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195 条记录 (耗时 0.022 秒)

    Solid-state imaging device
    22.
    发明申请
    Solid-state imaging device 有权
    固态成像装置

    公开(公告)号：US20060066743A1

    公开(公告)日：2006-03-30

    申请号：US11234258

    申请日：2005-09-26

    申请人： Kazutoshi Onozawa ,  Daisuke Ueda ,  Shinji Yoshida

    发明人： Kazutoshi Onozawa ,  Daisuke Ueda ,  Shinji Yoshida

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2254 ,  H04N5/2253

    摘要： The present invention provides a solid-state imaging device including an optical element that efficiently condenses even a wide-angle incident light and has a color separation function. The solid-state imaging device includes pixels, and in the device each pixel includes: a light receiving element; and an optical element, whose surface at least, is made of metal, the optical element has: an aperture; and convex parts which are arranged cyclically, and a distance between adjacent convex parts and a width of each convex part range from 0 to 1 wavelength of light to be condensed.

    摘要翻译： 本发明提供一种固态成像装置，其包括能够有效地冷凝广角入射光并具有分色功能的光学元件。 固态成像装置包括像素，并且在该装置中，每个像素包括：光接收元件; 以及光学元件，其表面至少由金属制成，所述光学元件具有：孔; 并且周向布置的凸部和相邻的凸部之间的距离和每个凸部的宽度在0-1波长范围内被冷凝。

    Sheet feeding apparatus
    23.
    发明授权
    Sheet feeding apparatus 失效
    送纸装置

    公开(公告)号：US06942208B2

    公开(公告)日：2005-09-13

    申请号：US10813884

    申请日：2004-03-31

    申请人： Shigeru Okazaki ,  Daisuke Ueda ,  Kenji Kato

    发明人： Shigeru Okazaki ,  Daisuke Ueda ,  Kenji Kato

    IPC分类号： G03G15/00 ,  B65H1/04 ,  B65H1/18 ,  B65H1/26 ,  B65H3/06 ,  B65H3/48 ,  B65H3/54 ,  B65H3/66 ,  B65H7/14 ,  B65H3/14

    CPC分类号： B65H3/48 ,  B65H1/18 ,  B65H3/06 ,  B65H3/54

    摘要： A sheet feeding apparatus includes a sheet feeding roller that comes in contact with stacked sheets and feeds sheets one by one from the top, wherein an air outlet is provided so that air can be blown onto the upper part of the stacked sheets from the lateral side in the sheet feeding direction, and a floatation suppression member for suppressing floatation of the sheet is provided between the air outlet and the feeding roller and spaced apart from the uppermost surface of the stacked sheets.

    摘要翻译： 片材进给装置包括与堆叠的片材接触并从顶部一个接一张地供给片材的片材进给辊，其中设置空气出口，使得空气可以从侧面吹送到堆叠片材的上部 在送纸方向上设置有用于抑制片材漂浮的浮起抑制部件，并且在排出口与供给辊之间设置有与堆叠片材的最上表面间隔开的浮动抑制部件。

    Semiconductor device and method for dividing substrate
    24.
    发明申请
    Semiconductor device and method for dividing substrate 审中-公开
    用于分割衬底的半导体器件和方法

    公开(公告)号：US20050029646A1

    公开(公告)日：2005-02-10

    申请号：US10912136

    申请日：2004-08-06

    申请人： Tetsuzo Ueda ,  Daisuke Ueda

    发明人： Tetsuzo Ueda ,  Daisuke Ueda

    IPC分类号： G01K1/08 ,  H01J3/14 ,  H01L21/301 ,  H01L21/304 ,  H01L21/78 ,  H01L23/22 ,  H01L33/00

    CPC分类号： H01L21/78 ,  H01L21/3043 ,  H01L33/0095

    摘要： The object of the present invention is to provide a semiconductor device and a method for dividing a substrate which are capable of preventing chips from breaking and manufacturing chips in a reproducible square-like form. After the surface of the epitaxial growth layer 2 of the end part of the nitride semiconductor wafer is linear-scanned a plurality of times by the electron beam 3 so that scanning lines are parallel, the scribe line 4 is formed. Then, the edge jig 5 is put on the scribe line 4. And, the back surface of the SiC substrate 1 is pressed by the edge jig 6.

    摘要翻译： 本发明的目的是提供一种能够防止芯片破碎和制造可重现的正方形芯片的基板的半导体器件和方法。 在氮化物半导体晶片的端部的外延生长层2的表面被电子束3多次扫描以使扫描线平行之后，形成刻划线4。 然后，将边缘夹具5放在划线4上。并且，SiC基板1的背面被边缘夹具6按压。

    Sewing machine
    25.
    发明授权
    Sewing machine 有权
    缝纫机

    公开(公告)号：US08752491B2

    公开(公告)日：2014-06-17

    申请号：US13029790

    申请日：2011-02-17

    申请人： Masahiko Nagai ,  Masaru Jimbo ,  Eiichi Hamajima ,  Toru Imaeda ,  Hiroshi Yamasaki ,  Daisuke Ueda ,  Yasuhiro Ishiyama

    发明人： Masahiko Nagai ,  Masaru Jimbo ,  Eiichi Hamajima ,  Toru Imaeda ,  Hiroshi Yamasaki ,  Daisuke Ueda ,  Yasuhiro Ishiyama

    IPC分类号： D05B29/02

    CPC分类号： D05B29/02

    摘要： A sewing machine is disclosed that includes a needle bar allowing attachment of a sewing needle including a needle eye to a lower end of thereof; a needle-bar lifting/lowering mechanism that moves the needle bar up and down; a presser foot; a presser foot lifting/lowering mechanism that moves the presser foot up and down; a hook that is provided with a beak for seizing a needle thread loop formed at the needle eye and that rotates in coordination with the up and down movement of the needle bar; and a controller that controls the presser foot lifting/lowering mechanism so as to resize a needle thread loop by lifting the presser foot to a predetermined height in coordination with a swing position of the needle bar and a predetermined height of the needle bar where the beak meets the needle thread loop.

    摘要翻译： 公开了一种缝纫机，其包括：针杆，其能够将包括针眼的缝纫针附着到其下端; 针杆上下移动的针杆升降机构; 压脚 压脚上下移动的压脚升降机构; 具有用于抓住在针眼处形成的针线圈并与针杆的上下运动协调旋转的喙的钩; 以及控制器，其通过将针脚的摆动位置和针杆的预定高度与针杆的预定高度配合来控制压脚提升/降低机构，以便通过将压脚抬高到预定高度来调整针线圈的大小 符合针线循环。

    Semiconductor device for reducing and/or preventing current collapse
    28.
    发明授权
    Semiconductor device for reducing and/or preventing current collapse 有权
    用于减少和/或防止电流崩溃的半导体装置

    公开(公告)号：US08390029B2

    公开(公告)日：2013-03-05

    申请号：US12867427

    申请日：2009-01-23

    申请人： Hidekazu Umeda ,  Masahiro Hikita ,  Tetsuzo Ueda ,  Tsuyoshi Tanaka ,  Daisuke Ueda

    发明人： Hidekazu Umeda ,  Masahiro Hikita ,  Tetsuzo Ueda ,  Tsuyoshi Tanaka ,  Daisuke Ueda

    IPC分类号： H01L29/00

    CPC分类号： H01L29/7786 ,  H01L29/2003 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/432 ,  H01L29/66462

    摘要： A semiconductor device includes an undoped GaN layer (103) formed on a substrate (101), an undoped AlGaN layer (104) formed on the undoped GaN layer (103) and having a band gap energy larger than that of the undoped GaN layer (103), a p-type AlGaN layer (105) and a high-concentration p-type GaN layer (106) formed on the undoped AlGaN layer (104), and an n-type AlGaN layer (107) formed on the high-concentration p-type GaN layer (106). A gate electrode (112) which makes ohmic contact with the high-concentration p-type GaN layer (106) is formed on the high-concentration p-type GaN layer (106) in a region thereof exposed through an opening (107a) formed in the n-type AlGaN layer (107).

    摘要翻译： 半导体器件包括形成在衬底（101）上的未掺杂的GaN层（103），形成在未掺杂的GaN层（103）上并且具有比未掺杂的GaN层的带隙能量大的带隙能量的未掺杂的AlGaN层（104） 103），形成在未掺杂的AlGaN层（104）上的p型AlGaN层（105）和高浓度p型GaN层（106）以及形成在高掺杂AlGaN层上的n型AlGaN层（107） 浓度p型GaN层（106）。 在高浓度p型GaN层（106）上形成与高浓度p型GaN层（106）欧姆接触的栅电极（112），其形成在通过形成的开口（107a）的部分露出的区域 在n型AlGaN层（107）中。

    Workpiece processing attachment and sewing machine
    30.
    发明授权
    Workpiece processing attachment and sewing machine 有权
    工件加工附件和缝纫机

    公开(公告)号：US08261678B2

    公开(公告)日：2012-09-11

    申请号：US12656237

    申请日：2010-01-21

    申请人： Akifumi Nakashima ,  Daisuke Ueda

    发明人： Akifumi Nakashima ,  Daisuke Ueda

    IPC分类号： D05B23/00

    CPC分类号： D05B55/06 ,  D05B23/00 ,  D05D2303/00

    摘要： A workpiece processing attachment detachably attached to a sewing machine including a presser foot, a presser bar having the presser foot detachably attached to its lower end, a presser bar vertically moving mechanism, a sewing needle, a needle clamp having the sewing needle detachably attached thereto, a needle bar having the needle clamp attached thereto, and a needle bar vertically moving mechanism, the workpiece processing attachment, including a body detachably attached to the lower end of the presser bar; a connecting element capable of being connected to the needle clamp and movable up and down with the needle bar being moved up and down by the needle bar vertically moving mechanism; a needle penetrating the workpiece to form a hole in the workpiece; and a needle vertically moving mechanism moving the needle up and down by the up and down movement of the connecting element.

    摘要翻译： 一种可拆卸地安装在缝纫机上的工件加工附件，该缝纫机包括压脚，压脚可拆卸地安装在其下端，压杆垂直移动机构，缝纫针，具有可拆卸地连接到其上的缝纫针的针夹 具有附接有针夹的针杆和针杆上下移动机构，所述工件加工附件包括可拆卸地附接到所述按压杆的下端的主体; 连接元件，其能够连接到针夹并且可通过针杆上下移动机构上下移动而上下移动; 针穿过工件在工件上形成一个孔; 并且针垂直移动机构通过连接元件的上下移动来上下移动针。