Abstract:
The present invention is related to a method for manufacturing lead frames and a lead frame material including an intermediate layer and a top layer. The intermediate layer is composed of a layer of nickel-cobalt alloy having 5 to 30 wt. % of cobalt and a thickness of 3 to 20 microinches and a layer of nickel or nickel alloy having a thickness of 10 to 80 microinches. The intermediate layer can inhibit the diffusion of the base metal to the surface of the leads. The top layer consisting of gold or gold alloy, which is composed of gold and at least one metal selected from the group consisting of palladium, silver, tin and copper and has at least 60 weight percent gold, has a thickness of 0.1 to 5 microinches.
Abstract:
A tactile display writer unit includes a probe having a contact tip, and at least a first actuator and a second actuator coupled to the probe, whereby activation of the actuators results in a displacement of the probe tip in one or more of a z-direction and in a lateral direction having a vector in an x-y plane. Also, a display writer includes a plurality of such units supported in an x-y array. The writer units may have a third actuator coupled to the probe. Also, a tactile vision system includes such a display writer, an image processor, and an image sensor. The processor transforms RGB image information from the image sensor into hue-based information having two or more attributes; and the actuators in the tactile display writer are activated by the information attributes. Also, a method for producing a tactile color stimulus at a site on the skin of a subject includes providing a probe having a contact tip; displacing the tip at the contact site in a direction generally normal to the skin surface at the site to an extent that relates one attribute of a hue-based model of the color, and displacing the tip in at least one lateral direction generally in a plane parallel to the skin surface at the site to an extent that relates to at least one additional attribute of the color.
Abstract:
A semiconductor device with a cavity structure comprises: a carrier substrate; a first die having an active surface and the pads thereon; a back surface of the first die is disposed on the carrier substrate; a second die having a top surface and a back surface and a cavity structure therein; the top surface of a second die is flipped to dispose on the first die, and the cavity structure is an inverse U-type to dispose between the active surface of the first die and the top surface of the second die; the wires is electrically connected the pads with the first connecting points; a package body encapsulated the first die, the second die, the wires, and the portion of the top surface of the carrier substrate; and the connecting components is disposed on the back surface of the carrier substrate and is electrically connected the second connecting points.
Abstract:
In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.
Abstract:
Disclosed are methods of identifying microRNA motifs or microRNA precursors for a target gene or a set of target genes. Also disclosed are related computer-readable media.
Abstract:
Disclosed are methods of identifying microRNA motifs or microRNA precursors for a target gene or a set of target genes. Also disclosed are related computer-readable media