公开(公告)号：US09948878B2

公开(公告)日：2018-04-17

申请号：US14961829

申请日：2015-12-07

Applicant: FLIR Systems, Inc.

Inventor： Brian Simolon ,  Eric A. Kurth ,  Jim Goodland ,  Mark Nussmeier ,  Nicholas Hogasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp ,  Naseem Y. Aziz

IPC: G06F11/07 ,  G01R23/00 ,  H04N5/376 ,  H04N5/225 ,  H04N5/33 ,  H04N5/365 ,  G06F1/04

CPC classification number: H04N5/3765 ,  G01R23/00 ,  G06F1/04 ,  G06F11/0703 ,  G06F11/076 ,  H04N5/2257 ,  H04N5/33 ,  H04N5/365

Abstract: Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select a current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.

公开(公告)号：US09918023B2

公开(公告)日：2018-03-13

申请号：US14106696

申请日：2013-12-13

Applicant: FLIR Systems, Inc.

Inventor： Brian Simolon ,  Eric A. Kurth ,  Mark Nussmeier ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H04N5/378 ,  H01L27/146 ,  H04N5/225

CPC classification number: H04N5/33 ,  H01L27/14634 ,  H01L27/1469 ,  H04N5/2257 ,  H04N5/378

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

公开(公告)号：US09900526B2

公开(公告)日：2018-02-20

申请号：US14749886

申请日：2015-06-25

Applicant: FLIR Systems, Inc.

Inventor： Joseph Kostrzewa ,  Vu L. Nguyen ,  Theodore R. Hoelter ,  Nicholas Högasten ,  Mark Nussmeier ,  Eric A. Kurth ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/351 ,  H04N5/335 ,  H04N5/235 ,  H04N5/33 ,  H04N17/00 ,  H04N5/365 ,  H04N5/378 ,  H04N5/225 ,  H04N5/217 ,  H04N101/00

CPC classification number: H04N5/351 ,  H04N5/2176 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/2351 ,  H04N5/33 ,  H04N5/332 ,  H04N5/335 ,  H04N5/3656 ,  H04N5/3658 ,  H04N5/378 ,  H04N17/002 ,  H04N2101/00

Abstract: Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken. Such snapshots may be utilized to provide useful NUC data when the infrared imaging device starts up or is otherwise reactivated, so that the SBNUC or other NUC methods may produce effective results soon after the start-up. Such snapshots may also be utilized to update ineffective calibration terms.

公开(公告)号：US09848134B2

公开(公告)日：2017-12-19

申请号：US14092794

申请日：2013-11-27

Applicant: FLIR Systems, Inc.

Inventor： Brian Simolon ,  Eric A. Kurth ,  Steve Barskey ,  Mark Nussmeier ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N9/10 ,  H04N9/14 ,  H04N5/33 ,  H04N5/359 ,  H01L27/146 ,  H04N5/365

CPC classification number: H04N5/33 ,  H01L27/1469 ,  H04N5/359 ,  H04N5/365

Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.

公开(公告)号：US09716844B2

公开(公告)日：2017-07-25

申请号：US14133095

申请日：2013-12-18

Applicant: FLIR Systems, Inc.

Inventor： Mark Nussmeier ,  Eric A. Kurth ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: G01J5/00 ,  H04N5/33 ,  H04N5/225 ,  H04N5/357 ,  H04N5/378 ,  H04M1/725

CPC classification number: H04N5/33 ,  H04M1/725 ,  H04M2250/52 ,  H04N5/2252 ,  H04N5/2257 ,  H04N5/357 ,  H04N5/378

Abstract: Various techniques are provided for implementing an infrared imaging system, especially for low power and small form factor applications. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. A low-dropout regulator (LDO) is integrated with the FPA and adapted to provide a regulated voltage in response to an external supply voltage. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors in response to the regulated voltage. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

公开(公告)号：US09716843B2

公开(公告)日：2017-07-25

申请号：US14034493

申请日：2013-09-23

Applicant: FLIR Systems, Inc.

Inventor： Michael Fox ,  Mark Nussmeier ,  Eric A. Kurth ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  G01C3/08

CPC classification number: H04N5/33 ,  G01C3/08 ,  H04N5/332

Abstract: Techniques are disclosed for measurement devices and methods to obtain various physical and/or electrical parameters in an integrated manner. For example, a measurement device may include a housing, an optical emitter, a sensor, a distance measurement circuit, a length measurement circuit, an electrical meter circuit, a display, an infrared imaging module, and/or a non-thermal imaging module. The device may be conveniently carried and utilized by users to perform a series of distance measurements, wire length measurements, electrical parameter measurements, and/or fault inspections, in an integrated manner without using multiple different devices. In one example, electricians may utilize the device to perform installation of electrical wires and/or other tasks at various locations (e.g., electrical work sites). In another example, electricians may utilize the device to view a thermal image of one or more scenes at such locations for locating potential electrical faults.

公开(公告)号：US20150332441A1

公开(公告)日：2015-11-19

申请号：US14138055

申请日：2013-12-21

Applicant: FLIR Systems, Inc.

Inventor： Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Malin Ingerhed ,  Mark Nussmeier ,  Eric A. Kurth ,  Pierre Boulanger ,  Barbara Sharp

IPC: G06T5/00 ,  G06T5/20 ,  B60R11/04 ,  H04N5/232 ,  G06K9/60 ,  H04N5/225 ,  H04N5/33 ,  G06K9/00

CPC classification number: G06T5/003 ,  B60R11/04 ,  G06K9/0051 ,  G06K9/00791 ,  G06K9/605 ,  G06T5/002 ,  G06T5/20 ,  G06T2207/10016 ,  G06T2207/10048 ,  G06T2207/20201 ,  G06T2207/30252 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/23258 ,  H04N5/23267 ,  H04N5/33 ,  H04N5/332 ,  H04N5/3651

Abstract: Techniques are disclosed for systems and methods using small form factor infrared imaging devices to image scenes in proximity to a vehicle. An imaging system may include one or more infrared imaging devices, a processor, a memory, a display, a communication module, and modules to interface with a user, sensors, and/or a vehicle. Infrared imaging devices may be positioned in proximity to, mounted on, installed in, or otherwise fixed relative to a vehicle. Infrared imaging devices may be configured to capture infrared images of scenes in proximity to a vehicle. Various infrared image analytics and processing may be performed on captured infrared images to correct and/or calibrate the infrared images. Monitoring information, notifications, and/or control signals may be generated based on the corrected infrared images and then presented to a user and/or a monitoring and notification system, and/or used to control aspects of the vehicle.

Abstract translation: 公开了使用小尺寸红外成像装置对车辆附近的场景进行成像的系统和方法的技术。 成像系统可以包括一个或多个红外成像设备，处理器，存储器，显示器，通信模块以及与用户，传感器和/或车辆接口的模块。 红外成像装置可以被定位在车辆附近，安装在，安装在或相对于车辆固定的位置。 红外成像装置可以被配置为捕获靠近车辆的场景的红外图像。 可以对所捕获的红外图像执行各种红外图像分析和处理，以校正和/或校准红外图像。 监视信息，通知和/或控制信号可以基于经校正的红外图像生成，然后呈现给用户和/或监视和通知系统，和/或用于控制车辆的各个方面。

公开(公告)号：US20150319379A1

公开(公告)日：2015-11-05

申请号：US14748873

申请日：2015-06-24

Applicant: FLIR Systems, Inc.

Inventor： Mark Nussmeier ,  Eric A. Kurth ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H04N5/347 ,  H04N5/372 ,  H04N5/225 ,  H04N5/374 ,  H04N5/268 ,  H04N5/232

CPC classification number: H04N5/33 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/0077 ,  G01J2005/202 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/23258 ,  H04N5/23293 ,  H04N5/268 ,  H04N5/347 ,  H04N5/372 ,  H04N5/374

Abstract: Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.

Abstract translation: 提供各种技术用于对焦平面阵列（FPA）的两个或更多个红外传感器进行分组（例如，聚集或分组）以允许将FPA配置为各种尺寸和/或像素尺寸。 例如，根据一个或多个实施例，可切换互连可以在FPA内实现，其中可切换互连包括多个开关，其适于选择性地将FPA的红外传感器连接到/从列线，行线，以及 彼此。 可切换互连还可以包括适于将相邻列线选择性地连接在一起的另一组开关。 通过选择性地打开和关闭可切换互连的适当的开关，可以将两个或更多个相邻的红外传感器合并在一起以形成分箱检测器。 有利地，分装的检测器以及阵列和相关联的电路可以提供增加的灵敏度，降低的功率消耗和/或增加的帧速率。

公开(公告)号：US20150312490A1

公开(公告)日：2015-10-29

申请号：US14751437

申请日：2015-06-26

Applicant: FLIR Systems, Inc.

Inventor： Theodore R. Hoelter ,  Mark Nussmeier ,  Eric A. Kurth ,  Nicholas Högasten ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H04N5/225 ,  G01J5/04 ,  H01L27/146 ,  G01J5/06 ,  G01J5/08 ,  G01J5/20 ,  H04N5/365 ,  G01J5/02

CPC classification number: H04N5/33 ,  G01J5/025 ,  G01J5/0265 ,  G01J5/027 ,  G01J5/04 ,  G01J5/061 ,  G01J5/0881 ,  G01J5/20 ,  G01J2005/0077 ,  G01J2005/202 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2257 ,  H04N5/332 ,  H04N5/3655 ,  H04N5/3656 ,  H01L2924/00014

Abstract: In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

Abstract translation: 在一个实施例中，红外（IR）传感器模块包括IR传感器组件，其包括衬底，设置在衬底的上表面上的微热辐射计阵列; 以及盖，其设置在所述基板的上表面上并且密封地包围所述微测热计阵列。 基底设置在基底下方，并且具有大致平坦部分的散热器插入在基底的下表面和基底的上表面之间。 在一些实施例中，散热器可以包括具有各向异性热导率的材料，例如石墨。

公开(公告)号：US20150312489A1

公开(公告)日：2015-10-29

申请号：US14750781

申请日：2015-06-25

Applicant: FLIR Systems, Inc.

Inventor： Theodore R. Hoelter ,  Nicholas Högasten ,  Malin Ingerhed ,  Mark Nussmeier ,  Eric A. Kurth ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  G06T5/00 ,  H04N5/225 ,  H04N5/365 ,  H04N5/367

CPC classification number: H04N5/33 ,  G06T5/002 ,  G06T5/20 ,  G06T2207/10048 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/3651 ,  H04N5/3658 ,  H04N5/3675

Abstract: Various techniques are provided to identify anomalous pixels in images captured by imaging devices. In one example, an infrared image frame is received. The infrared image frame is captured by a plurality of infrared sensors based on infrared radiation passed through an optical element. A pixel of the infrared image frame is selected. A plurality of neighborhood pixels of the infrared image frame are selected. Values of the selected pixel and the neighborhood pixels are processed to determine whether the value of the selected pixel exhibits a disparity in relation to the neighborhood pixels that exceeds a maximum disparity associated with a configuration of the optical element and the infrared sensors. The selected pixel is selectively designated as an anomalous pixel based on the processing.

Abstract translation: 提供各种技术来识别由成像设备捕获的图像中的异常像素。 在一个示例中，接收红外图像帧。 基于通过光学元件的红外线辐射，由红外线传感器捕获红外图像帧。 选择红外图像帧的像素。 选择红外图像帧的多个邻域像素。 处理所选择的像素和相邻像素的值以确定所选像素的值是否相对于超过与光学元件和红外传感器的配置相关联的最大视差的邻近像素呈现差异。 基于该处理，所选择的像素被选择性地指定为异常像素。