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公开(公告)号：US20190385785A1
公开(公告)日：2019-12-19
申请号：US16007844
申请日：2018-06-13
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Cong Li , Anoop Jassal , Naveenan Thiagarajan , Satish Prabhakaran , Kum-Kang Huh , Jiangbiao He , Xiaosong Kang , Ruxi Wang
Abstract: A magnetic unit is presented. The magnetic unit includes a magnetic core. The magnetic core includes a first limb and a second limb disposed proximate to the first limb, where a gap is formed between the first limb and the second limb. The magnetic unit further includes a first winding wound on the first limb. Moreover, the magnetic unit includes a conductive element disposed facing an outer periphery of the first winding, where the conductive element is configured to control a fringing flux generated at the gap. Further, the magnetic unit includes a heat sink operatively coupled to the conductive element, where the conductive element is further configured to transfer heat from at least one of the conductive element and the first winding to the heat sink. Moreover, a high frequency power conversion system and a method of operation of the magnetic unit is also presented.
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公开(公告)号：US10383261B2
公开(公告)日：2019-08-13
申请号：US15222478
申请日：2016-07-28
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Theodore Clark Brown , Shreenath Shekar Perlaguri , Brian Magann Rush , Rajendra Yammanuru , Naveenan Thiagarajan , Arunpandi Radhakrishnan
IPC: H05K7/20 , H01L23/467 , H01L23/473
Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
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公开(公告)号：US20170112018A1
公开(公告)日：2017-04-20
申请号：US15222478
申请日：2016-07-28
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Theodore Clark Brown , Shreenath Shekar Perlaguri , Brian Magann Rush , Rajendra Yammanuru , Naveenan Thiagarajan , Arunpandi Radhakrishnan
IPC: H05K7/20
CPC classification number: H05K7/20927 , H01L23/467 , H01L23/473 , H05K7/20263 , H05K7/20336 , H05K7/20881
Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
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公开(公告)号：US12297813B2
公开(公告)日：2025-05-13
申请号：US18009088
申请日：2020-06-10
Applicant: General Electric Company
Inventor： Naveenan Thiagarajan , Andrew Maxwell Peter , Samir Salamah
IPC: F03D80/60
Abstract: A multisiphon passive cooling system includes a heat exchanger thermally connected to a heat-generating component located within an enclosure, a distribution manifold located below the heat exchanger, a condensing unit located external to the enclosure and above the heat exchanger, and a first conduit thermally connected to the heat exchanger. The first conduit is fluidly connected to the distribution manifold and the condensing unit. The cooling system also includes a second conduit fluidly connected to the condensing unit and the distribution manifold, a liquid bridge fluidly connected to the first conduit and the second conduit or the distribution manifold, and a two-phase cooling medium that circulates through a loop defined by the first conduit, the liquid bridge, the condensing unit, the second conduit, the heat exchanger, and the distribution manifold. As such, the liquid bridge transfers the cooling medium in a liquid state from the first conduit to the second conduit or the distribution manifold.
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公开(公告)号：US10784746B2
公开(公告)日：2020-09-22
申请号：US15624456
申请日：2017-06-15
Applicant: General Electric Company
Inventor： Karthik Kumar Bodla , Naveenan Thiagarajan , Patel Bhageerath Reddy , Yogen Vishwas Utturkar
Abstract: A method includes fabricating a core, wherein the core comprises a chemically soluble first polymer, forming a body around the core, wherein the body comprises a second polymer, and etching away the core to reveal a cooling channel extending through the body.
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Patent Agency Ranking
公开(公告)号：US10761162B2
公开(公告)日：2020-09-01
申请号：US16134060
申请日：2018-09-18
Applicant: General Electric Company
Inventor： Naveenan Thiagarajan , Derek Allan Seeber , Eric George Budesheim , Charles Critcher , Dominic Michael Graziani
IPC: G01R33/385 , G01R33/421
Abstract: A magnetic resonance imaging (MRI) coil system is provided that includes a gradient coil and a flow inlet. The gradient coil includes a flow channel passing therethrough. The gradient coil defines an eye and an end. The eye is disposed proximate the center of the gradient coil. The flow inlet is disposed along the gradient coil between the eye and the end. Cooling fluid is provided to the gradient coil via the flow inlet, and removed from the gradient coil via the eye and the end.
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27.发明授权公开(公告)号：US10533901B2
公开(公告)日：2020-01-14
申请号：US15615576
申请日：2017-06-06
Applicant: General Electric Company
Inventor： Guanghua Wang , Nirm Velumylum Nirmalan , Mohamed Sakami , Thomas Charles Adcock , Jeffrey Jay Porubcan , James William Sears , Naveenan Thiagarajan , Bernard Bewlay , Jason Edward Dees , James DeLancey
Abstract: An imaging system includes a sight tube extending along a longitudinal axis of the imaging system and configured to extend through an access port. The sight tube includes a wall extending about the longitudinal axis and defining a cavity. The imaging system also includes a plurality of cooling channels extending through the sight tube. The plurality of cooling channels are configured to direct cooling fluid through the sight tube for cooling the imaging system. The plurality of cooling channels are formed in the sight tube such that at least one cooling channel of the plurality of cooling channels extends in a direction oblique to the longitudinal axis.
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公开(公告)号：US10517567B2
公开(公告)日：2019-12-31
申请号：US16243823
申请日：2019-01-09
Applicant: General Electric Company
Inventor： Warren Lee , Naveenan Thiagarajan
Abstract: A docking station for electrically charging and managing a thermal condition of an ultrasound probe is presented. The docking station includes a first charging unit magnetically coupled to an induction unit of the ultrasound probe and configured to charge at least one battery in the ultrasound probe. Further, the docking station includes a first cooling unit thermally coupled to a thermal unit of the ultrasound probe and configured to dissipate heat from the ultrasound probe.
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公开(公告)号：US20180195896A1
公开(公告)日：2018-07-12
申请号：US15401927
申请日：2017-01-09
Applicant: General Electric Company
Inventor： Guanghua Wang , Naveenan Thiagarajan , Todd Garrett Wetzel , Jason Edward Dees , Bernard Patrick Bewlay
CPC classification number: G01J1/0252 , F02C7/12 , F05D2260/207 , F05D2270/112 , F05D2270/804 , G01J5/0088 , G01J5/042 , G01J5/046 , G01J5/049 , G01J5/061 , G01J2005/0077
Abstract: An infrared imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.
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公开(公告)号：US20170067693A1
公开(公告)日：2017-03-09
申请号：US14848860
申请日：2015-09-09
Applicant: GENERAL ELECTRIC COMPANY
IPC: F28D15/02
CPC classification number: F28F7/02 , F28D15/0266 , F28D15/046 , F28D20/02 , F28D2020/0013 , F28F2210/02 , F28F2215/06 , H01L23/427 , H05K7/20 , H05K7/20309 , H05K7/20318 , Y02E60/145
Abstract: A thermal management system including a first vapor housing configured to receive a fluid that absorbs thermal energy from a first heat source, and a phase change material (PCM) housing thermally coupled to the first vapor housing, wherein the PCM housing is configured to receive a PCM that absorbs thermal energy from the first vapor housing, wherein the first vapor housing and the PCM housing are one-piece.
Abstract translation: 一种热管理系统，包括构造成接收从第一热源吸收热能的流体的第一蒸汽壳体，以及热耦合到第一蒸气壳体的相变材料（PCM）壳体，其中PCM壳体构造成接收 PCM，其从第一蒸汽壳体吸收热能，其中第一蒸汽壳体和PCM壳体是一体的。
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