Maskless etching of polysilicon
    25.
    发明授权
    Maskless etching of polysilicon 失效
    无掩模蚀刻多晶硅

    公开(公告)号:US4601778A

    公开(公告)日:1986-07-22

    申请号:US705161

    申请日:1985-02-25

    申请人: Francine Y. Robb

    发明人: Francine Y. Robb

    CPC分类号: H01L21/32137 Y10S438/924

    摘要: Maskless etching of polysilicon is accomplished by exposing portions of a polysilicon surface to ion bombardment. Bombardment by oxygen or hydrogen ions is effective to reduce the etch rate of polysilicon in a chlorine-containing plasma. Therefore, patterned ion bombardment prior to etching in a chlorine plasma is effective to pattern the polysilicon surface.

    摘要翻译: 通过将多晶硅表面的部分暴露于离子轰击来实现多晶硅的无掩模蚀刻。 通过氧或氢离子的轰击对于降低含氯等离子体中的多晶硅的蚀刻速率是有效的。 因此,在氯等离子体中蚀刻之前的图案化离子轰击有效地对多晶硅表面进行图案化。