3D THERMOFORMED ELEMENT
    23.
    发明申请

    公开(公告)号:US20210316673A1

    公开(公告)日:2021-10-14

    申请号:US17269930

    申请日:2019-08-22

    Applicant: Hutchinson

    Abstract: A three-dimensional, vacuum thermal insulating element comprising a compressed three-dimensional porous structure, an envelope closed in an airtight manner comprising a thermoformable barrier wall, enclosing the porous structure, which is interposed between two major surfaces of the barrier wall, and where, at outside ambient temperature and pressure, a pressure between less than 105 Pa and more than 10−2 Pa prevails. The barrier wall is thermoformed at said the two major surfaces, between which the porous structure is bent-shaped and/or has reliefs and/or depressions.

    Method for heat exchange and conditioning of a heat exchanger

    公开(公告)号:US11067342B2

    公开(公告)日:2021-07-20

    申请号:US16308201

    申请日:2017-06-09

    Applicant: Hutchinson

    Abstract: The invention relates to a method for heat exchange. At a first point in time, in a thermal energy storing device, at least part of the previously accumulated thermal energy is discharged to a first fluid by heat exchange, and subsequently, at a second later point in time, when the first fluid has been heated to a temperature higher than the temperature of a second fluid, the second fluid receives heat energy by heat exchange with said first fluid which then circulates on the other side of a first wall that prevents the first and second fluids from mixing.

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