公开(公告)号：US08258502B2

公开(公告)日：2012-09-04

申请号：US12223133

申请日：2007-02-01

申请人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

发明人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

IPC分类号： H01L35/24

CPC分类号： C08K5/5425 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

摘要翻译： 组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。 通过将组合物施加到光源上然后固化来制造发光器件。 组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

公开(公告)号：US08153202B2

公开(公告)日：2012-04-10

申请号：US13009982

申请日：2011-01-20

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

IPC分类号： B05D5/00 ,  B05D1/38 ,  B05D3/10

CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  C08K5/56 ,  C09D183/04 ,  Y10T428/31663 ,  C08L83/00

摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。

公开(公告)号：US08044153B2

公开(公告)日：2011-10-25

申请号：US12093053

申请日：2006-11-08

申请人： Shinichi Yamamoto ,  Tomoko Kato ,  Hiroji Enami ,  Yoshitsugu Morita

发明人： Shinichi Yamamoto ,  Tomoko Kato ,  Hiroji Enami ,  Yoshitsugu Morita

IPC分类号： C08G77/12 ,  C08G77/20 ,  C08L83/05 ,  C08L83/07

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08L83/00 ,  C08K5/56

摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.

摘要翻译： 至少包含以下组分的可固化的硅氧烷组合物：（A）在一个分子中具有至少两个烯基的二有机聚硅氧烷; （B）将至少两种具有不同质均分子量的树脂状有机聚硅氧烷降低成标准聚苯乙烯测量的凝胶渗透色谱法，并由SiO 4/2单元，R 12 R 2 SiO 1/2单元和R 13 SiO 1/2单元组成，其中R 1 是不含脂族不饱和键的任意取代的一价烃基，R 2是烯基; （C）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 具有优异的流动性和填充能力，并且即使组合物含有形成具有适当强度和硬度的固化的硅氧烷体所需的树脂状有机聚硅氧烷，也可以制备而不具有极高的粘度。

公开(公告)号：US07329706B2

公开(公告)日：2008-02-12

申请号：US10476998

申请日：2002-05-14

申请人： Hiroshi Fukui ,  Manabu Sutoh ,  Hiroji Enami ,  Masayuki Onishi ,  Tadashi Okawa ,  Satoshi Onodera

发明人： Hiroshi Fukui ,  Manabu Sutoh ,  Hiroji Enami ,  Masayuki Onishi ,  Tadashi Okawa ,  Satoshi Onodera

IPC分类号： C08L83/05

CPC分类号： C08L83/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K9/06 ,  C08L83/14 ,  C08L83/00

摘要： A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

摘要翻译： 包含至少（A）有机聚硅氧烷，（B）导热填料和（C）特定有机硅氧烷的导热硅氧烷组合物。 硅氧烷组合物即使在含有大量导热性填料的情况下也具有优异的操作性，因此为了达到更高的导热性。

公开(公告)号：US20070112147A1

公开(公告)日：2007-05-17

申请号：US10573505

申请日：2004-09-14

申请人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Tomoko Kato

发明人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Tomoko Kato

IPC分类号： C08L83/04 ,  H01L21/56 ,  B32B27/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

摘要翻译： 一种可固化的有机聚硅氧烷组合物，其包含（A）每分子具有至少两个烯基和至少一个芳基的直链有机聚硅氧烷，（B）每分子具有至少一个烯基和至少一个芳基的支链有机聚硅氧烷，并具有硅氧烷 由以下通式表示的单元：RsiO 2/3，（C）分子链的两个末端被每分子具有至少一个芳基的硅键合氢原子封闭的直链有机聚硅氧烷和（ D）硅氢化反应催化剂，以及其半导体元件涂覆有上述组合物的固化产物的半导体器件。 可固化的有机基聚硅氧烷组合物显示出低粘度，优异的填充性能和固化性，并且固化性优异，可以形成具有大折射率，高透光率和对基材的高粘附性的软化固化物，以及半导体器件显示出优异的可靠性。

公开(公告)号：US06881807B2

公开(公告)日：2005-04-19

申请号：US10476055

申请日：2002-04-15

申请人： Masayoshi Terada ,  Hiroji Enami

发明人： Masayoshi Terada ,  Hiroji Enami

IPC分类号： C08L83/07 ,  C08K3/00 ,  C08K5/00 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/04 ,  C08L83/05 ,  H01L23/24 ,  C08G77/12

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K5/0091 ,  C08K5/5419 ,  C08K5/56 ,  C08L2205/02 ,  C08L83/00 ,  C08L2666/44 ,  C08L2666/54

摘要： A silicone gel composition is characterized by excellent storage stability in a non-cured state and by high adhesion to a substrate and long-term stability of consistency at elevated temperatures after curing. The silicone gel composition comprises: a polyorganosiloxane (A), which consists of polyorganosiloxane (A-1) that contains R(CH3)2SiO2/2 units, RsiO3/2 units R(CH3)2SiO1/2 units, and polydiorganosiloxane (A-2) that contains R(CH3)2SiO2/2 units and R(CH3)2SiO1/2 units, and R(CH3) which contains in one molecule two silicon-bonded hydrogen atoms; an addition-reaction platinum catalyst (C); an organosilicon compound (D) selected from silane of the general formula (R1O)nSiR24-n or a partially hydrolyzed condensate thereof; and an organic titanium compound (E).

摘要翻译： 硅凝胶组合物的特征在于在非固化状态下具有优异的储存稳定性和通过对基材的高粘附性以及在固化后的高温下的长期稳定性。 硅氧烷凝胶组合物包括：聚有机硅氧烷（A），其由含有R（CH 3 3）2 SiO 2/2/2的聚有机硅氧烷（A-1） 单元R 3 O 3/2单元R（CH 3 3）2 SiO 2 1/2单元 ，和含有R（CH 3 3）2 SiO 2/2/2单元的聚二有机硅氧烷（A-2）和R（CH 3）3 2个/或2个/ 2个单元，和在一个分子中含有两个与硅键合的氢原子的R（CH 3） ; 加成反应铂催化剂（C）; 选自通式（R 1）O的硅烷的有机硅化合物（D）N 2 SiR 2 S 4 - 或其部分水解的缩合物; 和有机钛化合物（E）。

公开(公告)号：US5969023A

公开(公告)日：1999-10-19

申请号：US35281

申请日：1998-03-05

申请人： Hiroji Enami ,  Yuji Hamada ,  Takeaki Saiki

发明人： Hiroji Enami ,  Yuji Hamada ,  Takeaki Saiki

IPC分类号： C08K3/10 ,  C08K3/36 ,  C08K5/17 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  C08G77/08

CPC分类号： C08K5/17 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20

摘要： A curable silicone composition cures to form a silicone cured product with improved fire-retarding properties. The composition comprises a hydrosilylation-reaction curable silicone composition Fire-retarding properties are imparted to the composition using a silica powder with a specific surface area of not less than 50 sq. m/g and a diamine compound. The cured product is preferably a silicone gel.

摘要翻译： 可固化的硅氧烷组合物固化以形成具有改进的阻燃性能的硅氧烷固化产物。 该组合物包括氢化硅烷化反应固化的硅氧烷组合物使用比表面积不小于50平方米/克的二氧化硅粉末和二胺化合物将组合物赋予阻燃性能。 固化物优选为硅胶。

公开(公告)号：US5153332A

公开(公告)日：1992-10-06

申请号：US757362

申请日：1991-09-10

申请人： Hiroji Enami ,  Shoji Akamatsu

发明人： Hiroji Enami ,  Shoji Akamatsu

IPC分类号： B01J23/42 ,  B01J27/13 ,  B01J31/22 ,  C07B61/00 ,  C07F7/21 ,  C08G77/04 ,  C08G77/48

CPC分类号： C07F7/21 ,  C08G77/045 ,  C08G77/485

摘要： An organocyclosiloxane is disclosed which has both silicon-bonded alkoxy groups and organofunctional groups within each molecule. This cyclic siloxane finds utility as a coupling agent and has the general formula ##STR1## wherein R.sup.1 is independently selected from the group consisting of a monovalent hydrocarbon group having 1 to 8 carbon atoms and a monovalent halogen-substituted hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 is selected from the group consisting of an alkoxy group and an alkoxysilylalkyl group, R.sup.3 is an organofunctional group selected from the group consisting of glycidoxyalkyl groups, methacryloxyalkyl groups, N-(trialkylsilyl)aminoalkyl groups, (hydroxyphenyl)alkyl groups, and haloalkyl groups and n and m each represent an integer having a value of 1 to 6 with the proviso that n+m is an integer with a value of 3 to 8.

公开(公告)号：US5084587A

公开(公告)日：1992-01-28

申请号：US729767

申请日：1991-07-15

申请人： Hiroji Enami ,  Takeshi Imai

发明人： Hiroji Enami ,  Takeshi Imai

IPC分类号： C07F7/18

CPC分类号： C07F7/1836 ,  C07F7/182 ,  C07F7/1864

摘要： The present invention relates to novel alkylamino-substituted organosilicon compounds and a method for their preparation. The described process involves a dehydrohalogenation reaction between a triorganosilylalkyl halide and an aminophenol in the presence of a hydrogen halide acceptor.

公开(公告)号：US20110227235A1

公开(公告)日：2011-09-22

申请号：US13062374

申请日：2009-09-04

申请人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

发明人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

IPC分类号： H01L23/28 ,  C08G77/04

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00

摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

摘要翻译： 一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元， 三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷 其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。 一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。