Method for manufacturing a dynamic quantity detection device
    21.
    发明授权
    Method for manufacturing a dynamic quantity detection device 失效
    动态量检测装置的制造方法

    公开(公告)号:US06960487B2

    公开(公告)日:2005-11-01

    申请号:US10404073

    申请日:2003-04-02

    IPC分类号: G01L9/00 H01L21/58 H01L29/84

    摘要: A method for manufacturing a dynamic quantity detection device includes bonding a semiconductor chip that includes a detection element for detecting a dynamic quantity to a stand using a bonding layer. Initially, a semiconductor chip is formed that includes a detection element used for correlating a dynamic quantity to be detected to an electric quantity and a processing circuit element used for a circuit that processes the electric quantity. Further, a bonding layer is placed on a stand. The semiconductor chip is then placed on the bonding layer and the semiconductor chip is bonded to the stand by sintering the bonding layer at 400° C. or lower in order to suppress a change in a characteristic of the processing circuit element.

    摘要翻译: 一种用于制造动态量检测装置的方法包括使用接合层将包括用于检测动态量的检测元件的半导体芯片接合到支架。 首先,形成半导体芯片,其包括用于将要检测的动态量与电量相关联的检测元件和用于处理电量的电路所使用的处理电路元件。 此外,将接合层放置在支架上。 然后将半导体芯片放置在接合层上,并且通过在400℃或更低温度下烧结粘合层将半导体芯片接合到支架上,以便抑制处理电路元件的特性变化。

    Virtual system time management system utilizing a time storage area and time converting mechanism
    22.
    发明授权
    Virtual system time management system utilizing a time storage area and time converting mechanism 有权
    虚拟系统时间管理系统利用时间存储区域和时间转换机制

    公开(公告)号:US06421786B1

    公开(公告)日:2002-07-16

    申请号:US09266781

    申请日:1999-03-12

    申请人: Shinji Yoshihara

    发明人: Shinji Yoshihara

    IPC分类号: G06F108

    CPC分类号: G06F1/14

    摘要: To allow an AP which performs operation based on a time of a system clock and another AP which performs operation based on a user-specified time to be executed concurrently in a data processing unit with only one system clock without having to change the time of the system clock, virtual system time setting means 5 receive a command or job start date and/or time from an input/output unit 2 and store it in a virtual system time storage area 4. In response to a system date acquisition function 6 or a system time acquisition function 7 from a command or a job, virtual system time converting means return either the date of the system clock when the date is not stored in the virtual system time storage area 4 or the date stored in the date storage area when the date is stored therein. The means also return either the time of the system clock when the time is not stored in the virtual system time storage area or the time of said system clock plus the time stored in said time storage area when the time is stored therein.

    摘要翻译: 为了允许基于系统时钟的时间执行操作的AP和基于用户指定时间执行操作的另一个AP在仅具有一个系统时钟的数据处理单元中同时执行,而不必改变 系统时钟,虚拟系统时间设置装置5从输入/输出单元2接收命令或作业开始日期和/或时间,并将其存储在虚拟系统时间存储区域4.响应于系统日期获取功能6或 系统时间获取功能7,虚拟系统时间转换装置在日期不存储在虚拟系统时间存储区域4中时返回系统时钟的日期,或者当存储在日期存储区域中的日期时,返回系统时钟的日期 日期存储在其中。 当时间不存储在虚拟系统时间存储区域中时,系统时钟的时间还是系统时钟的时间加上存储在所述时间存储区域中的时间加上存储在所述时间存储区域中的时间。

    Aluminum alloy of excellent machinability and manufacturing method
thereof
    23.
    发明授权
    Aluminum alloy of excellent machinability and manufacturing method thereof 失效
    具有优良机械加工性的铝合金及其制造方法

    公开(公告)号:US6059902A

    公开(公告)日:2000-05-09

    申请号:US880689

    申请日:1997-06-23

    摘要: An aluminum alloy containing Si: 1.5-12% (mass % here and hereinafter), Mg: 0.5-6% and, optionally, at least one of Mn: 0.5-2%, Cu: 0.15-3% and Cr: 0.04-0.35% and, further, containing Ti: 0.01-0.1% and the balance of Al and inevitable impurities, in which the average grain size of crystallized grains of Si system compounds is from 2 to 20 .mu.m and an area ratio thereof is from 2 to 12%. The alloy is melted to obtain a cast ingot having DAS (Dendrite Arm Spacing) of 10 to 50 .mu.m, which is then put to a soaking treatment at 450 to 520.degree. C. and then to extrusion molding. The aluminum alloy has excellent machinability with no addition of low melting metals.

    摘要翻译: 含有Si:1.5〜12%(质量%以下),Mg:0.5〜6%,以及Mn:0.5〜2%,Cu:0.15〜3%,Cr:0.04〜 0.35%,进一步含有Ti:0.01-0.1%,余量为Al和不可避免的杂质,其中Si系化合物的结晶晶粒的平均粒径为2〜20μm,面积比为2 至12%。 将合金熔化,得到10〜50μm的DAS(枝晶臂间距)的铸锭,然后在450〜520℃下进行均热处理,然后进行挤出成型。 铝合金具有优异的机械加工性,不添加低熔点金属。

    Semiconductor sensor chip having diaphragm and method of manufacturing the same
    24.
    发明授权
    Semiconductor sensor chip having diaphragm and method of manufacturing the same 失效
    具有隔膜的半导体传感器芯片及其制造方法

    公开(公告)号:US06747329B2

    公开(公告)日:2004-06-08

    申请号:US09977681

    申请日:2001-10-16

    IPC分类号: H01L2984

    摘要: A plularity of sensor chips, each having strain gauges and a thin diaphragm, are formed on a semiconductor wafer having an upper layer and a lower layer forming a P-N junction plane therebetween. The sensor chips are separated into individual pieces by dicing along column and row interstices dividing the sensor chips. Conductor lines for supplying an electrical voltage for electrochemically etching the diaphragms are formed on and along the interstices. All of the conductor lines are removed by a dicing blade having a wider width than the conductor lines to avoid electrical leakage due to particles of conductor lines leftover on side surfaces of the diced out sensor chips.

    摘要翻译: 在具有在其间形成P-N结面的上层和下层的半导体晶片上形成具有应变片和薄膜的传感器芯片的细度。 传感器芯片通过划分传感器芯片的列和行间隙进行切割而分离为单独的部件。 用于提供用于电化学蚀刻隔膜的电压的导体线形成在空隙上和沿着间隙。 所有的导体线通过具有比导体线宽的宽度的切割刀片去除,以避免由于在切割出的传感器芯片的侧表面残留的导线的颗粒导致的电泄漏。

    Apparatus and method for composing music data by inputting time positions of notes and then establishing pitches of notes
    25.
    发明授权
    Apparatus and method for composing music data by inputting time positions of notes and then establishing pitches of notes 有权
    通过输入音符的时间位置,然后建立音符间距来组合音乐数据的装置和方法

    公开(公告)号:US06245984B1

    公开(公告)日:2001-06-12

    申请号:US09449715

    申请日:1999-11-24

    IPC分类号: G10H140

    摘要: The display screen displays measure windows corresponding to the first through fourth measures for a melody to be composed. By clicking the play switch on the screen, a background accompaniment performance covering the four measures is played back to indicate the beats in the progressing tempo, thereby representing the rhythm speed. In time to the accompaniment progression, the user inputs note time points by tapping the input switch such as a space key in the keyboard to constitute a rhythm pattern for a melody progression. The measure window has a time axis in the horizontal direction and a pitch axis in the vertical direction. The tap-inputted note time points are exhibited at the corresponding positions along the time axis from left to right. Each point is dragged with the mouse pointer upward or downward to an intended pitch level, thereby establishing a pitch thereof. Alternatively, a pitch variation curve is drawn in the measure window plane to be sampled at the note time points, thereby establishing pitches of the respective note points. Only the pitches of important notes may be inputted, and the remainder may be automatically created in the apparatus according to a prepared algorithm.

    摘要翻译: 显示屏幕显示对应于要组成的旋律的第一到第四措施的测量窗口。 通过单击屏幕上的播放开关,播放覆盖四个度量的背景伴奏演奏,以指示节奏中的节拍,从而表示节奏速度。 在伴奏进行的时候,用户通过点击诸如键盘中的空格键的输入开关来输入音符时间点,以构成旋律演进的节奏模式。 测量窗口在水平方向上具有时间轴,在垂直方向上具有俯仰轴。 抽头输入的音符时间点在从左到右沿着时间轴的对应位置展现。 每个点被鼠标指针向上或向下拖动到预期的音高水平,从而建立其间距。 或者,在测量窗口平面中画出音调变化曲线,以在音符时间点进行采样,从而建立各音符点的间距。 可以仅输入重要音符的音调,并且可以根据准备的算法在装置中自动创建其余部分。

    Segment division management system
    26.
    发明授权
    Segment division management system 失效
    分部管理系统

    公开(公告)号:US5684995A

    公开(公告)日:1997-11-04

    申请号:US360291

    申请日:1994-12-21

    申请人: Shinji Yoshihara

    发明人: Shinji Yoshihara

    CPC分类号: G06F12/0292

    摘要: One physical segment 30 is divided into a plurality of fixed-length logic segments 31, where a logic segment management table 22 for management each logic segment 31 is provided. In registering a subprogram 40, a smaller sized region is assigned to the logic segment 31 by a segment size decision means 11, a logic segment producing means 12, and a logic segment register means 13. In deleting the subprogram 40, the logic segment 31 which comes to a not-use status is deleted by a logic segment retrieval means 14 and a logic segment delete means 15.

    摘要翻译: 一个物理段30被分成多个固定长度逻辑段31,其中提供用于管理每个逻辑段31的逻辑段管理表22。 在注册子程序40时,通过段大小决定装置11,逻辑段产生装置12和逻辑段寄存器装置13将更小尺寸的区域分配给逻辑段31.在删除子程序40时,逻辑段31 由逻辑段检索装置14和逻辑段删除装置15删除处于不使用状态的状态。

    METHOD FOR MANUFACTURING AN EXTRUDED MATERIAL OF HEAT TREATMENT TYPE AL-ZN-MG SERIES ALUMINUM ALLOY
    27.
    发明申请
    METHOD FOR MANUFACTURING AN EXTRUDED MATERIAL OF HEAT TREATMENT TYPE AL-ZN-MG SERIES ALUMINUM ALLOY 有权
    制造热处理型AL-ZN-MG系列铝合金的方法

    公开(公告)号:US20120234440A1

    公开(公告)日:2012-09-20

    申请号:US13419798

    申请日:2012-03-14

    IPC分类号: C22F1/053

    CPC分类号: C22F1/053 C21D1/673 C22C21/10

    摘要: A casted ingot of a heat treatment type Al—Zn—Mg series aluminum alloy comprising Zn: 4.0-8.0% by mass, Mg: 0.5-2.0% by mass, Cu: 0.05-0.5% by mass, Ti: 0.01-0.1% by mass, and any one or more of Mn: 0.1-0.7% by mass, Cr: 0.1-0.5% by mass and Zr: 0.05-0.3% by mass, and the balance being aluminum and incidental impurities is extruded at a homogenization treatment temperature after a homogenization treatment without cooled, and a resulted extruded material is die quenched at a cooling rate equal to or more than 100° C./min and then subjected to an artificial aging treatment, wherein the homogenization treatment is carried out by heating to the homogenization treatment temperature as 430-500° C. at a heating rate less than 750° C./hr or by heating to the homogenization treatment temperature and held the homogenization treatment temperature for 3 hours.

    摘要翻译: 含有Zn:4.0〜8.0质量%,Mg:0.5〜2.0质量%,Cu:0.05〜0.5质量%,Ti:0.01-0.1质量%的热处理型Al-Zn-Mg系铝合金铸造锭, ,Mn:0.1-0.7质量%,Cr:0.1-0.5质量%,Zr:0.05〜0.3质量%中的任一种或以上,余量由铝和附带杂质在均化处理中挤出 未冷却均质处理后的温度,所得到的挤出材料以等于或大于100℃/分钟的冷却速度进行猝熄,然后进行人造时效处理,其中均化处理通过加热至 均质处理温度为430-500℃,加热速率小于750℃/小时或通过加热至均化处理温度并保持均化处理温度3小时。

    Semiconductor device having passivation cap and method for manufacturing the same
    29.
    发明授权
    Semiconductor device having passivation cap and method for manufacturing the same 有权
    具有钝化帽的半导体器件及其制造方法

    公开(公告)号:US06995466B2

    公开(公告)日:2006-02-07

    申请号:US10732377

    申请日:2003-12-11

    IPC分类号: H01L23/12

    摘要: A semiconductor device includes a semiconductor wafer having a weak portion and a removable passivation cap disposed on the wafer for covering the weak portion. The passivation cap has an absorption coefficient of a laser beam, which is smaller than that of the wafer. The cap has a capability of passing water therethrough. In a case where the device is diced and cut into a plurality of chips, the passivation cap can be removed easily without bonding the cap again. That is because the passivation cap remains one body after dicing.

    摘要翻译: 半导体器件包括具有弱部分的半导体晶片和设置在晶片上以覆盖弱部分的可移除钝化帽。 钝化帽具有比晶片小的激光束的吸收系数。 盖子具有通过水的能力。 在将设备切割并切割成多个芯片的情况下,可以容易地移除钝化盖而不再次接合盖。 这是因为钝化帽在切割后保持一体。

    Semiconductor dynamic quantity sensor
    30.
    发明授权
    Semiconductor dynamic quantity sensor 有权
    半导体动量传感器

    公开(公告)号:US06938501B2

    公开(公告)日:2005-09-06

    申请号:US10625896

    申请日:2003-07-24

    摘要: A semiconductor dynamic quantity sensor detects a dynamic force and a fault diagnosis through the use of a single bridge circuit. Sensor output terminals are connected to midpoints between gauge resistors to make a combination of the midpoints at which an equal electric potential is measured when no pressure is applied to a diaphragm of the sensor. Fault diagnostic output terminals are connected to wiring patterns in the same manner as the first output terminals. One of the sensor output terminals has three selectable terminals connected to different positions of the midpoint. One of the diagnostic output terminals also has three selectable terminals connected to different positions of the wiring patterns. Accordingly, an offset voltage of the sensor output and the fault diagnostic output can be adjusted appropriately when one of the selectable terminals are selected as appropriate.

    摘要翻译: 半导体动态量传感器通过使用单桥电路检测动态力和故障诊断。 传感器输出端子连接到量规电阻之间的中点,以便在没有压力施加到传感器的隔膜上时测量相等电位的中点的组合。 故障诊断输出端子以与第一输出端子相同的方式连接到布线图案。 其中一个传感器输出端子有三个可选择的端子连接到中点的不同位置。 诊断输出端子之一还具有连接到布线图案的不同位置的三个可选端子。 因此,当适当地选择可选择的端子之一时,可以适当地调整传感器输出的偏移电压和故障诊断输出。