Metal-oxide based thin-film transistors with fluorinated active layer
    23.
    发明授权
    Metal-oxide based thin-film transistors with fluorinated active layer 有权
    具有氟化活性层的金属氧化物基薄膜晶体管

    公开(公告)号:US08878176B2

    公开(公告)日:2014-11-04

    申请号:US13572269

    申请日:2012-08-10

    CPC分类号: H01L29/7869

    摘要: A thin-film transistor with a fluorinated channel and fluorinated source and drain regions and methods of fabrication are provided. The thin-film transistor includes: a substrate; a semiconductor active layer of fluorine-doped metal-oxide formed on the substrate; fluorine-doped source and drain regions disposed adjacent to the semiconductor active layer; a gate electrode disposed over the semiconductor active layer, configured to induce a continuous conduction channel between the source and drain regions; and a gate dielectric material separating the gate electrode and the channel.

    摘要翻译: 提供具有氟化通道和氟化源极和漏极区域的薄膜晶体管及其制造方法。 薄膜晶体管包括:基板; 形成在所述基板上的掺杂氟化金属氧化物的半导体有源层; 配置在与半导体活性层相邻的氟掺杂源极和漏极区域; 设置在所述半导体有源层上方的栅电极,被配置为在所述源极和漏极区域之间引起连续的导电沟道; 以及分隔栅电极和沟道的栅介质材料。

    Integrated electronic microphone having a perforated rigid back plate membrane
    27.
    发明授权
    Integrated electronic microphone having a perforated rigid back plate membrane 有权
    具有穿孔刚性背板膜的集成电子麦克风

    公开(公告)号:US07642575B2

    公开(公告)日:2010-01-05

    申请号:US11647382

    申请日:2006-12-29

    IPC分类号: H01L27/20 H01L29/84

    摘要: The present invention provides an integrated electronic microphone formed as part of a semiconductor device, and a manufacturing method therefor. The microphone is formed with a sensing electrode as part of a sensing membrane, and the sensing electrode is connected to the gate of a sensing transistor to provide an output. The microphone may be operated in constant bias or constant charge mode.

    摘要翻译: 本发明提供一种形成为半导体器件的一部分的集成电子麦克风及其制造方法。 麦克风形成有感测电极作为感测膜的一部分,并且感测电极连接到感测晶体管的栅极以提供输出。 麦克风可以以恒定偏压或恒定充电模式工作。

    Space saving surface-mounted inductors
    28.
    发明申请
    Space saving surface-mounted inductors 失效
    节省空间的表面电感器

    公开(公告)号:US20050012585A1

    公开(公告)日:2005-01-20

    申请号:US10621208

    申请日:2003-07-15

    摘要: The present invention provides an inductive element and a method making an inductive element for surface mounting on an adjacent structure that has improved heat transfer characteristics. Specifically, the present invention includes an inductive element where the core and winding define coplanar surfaces that can then be mated to an adjacent structure, preferably a printed circuit board. Devices such as inductors or transformers including the inventive inductive element have multiple, low thermal resistance conductive paths for removing heat from the core and thereby enhance the heat transfer characteristics of the inductive element. The inductive element is particularly well suited for power electronics, such as for use a power choke or as part of a power transformer.

    摘要翻译: 本发明提供了一种电感元件和制造用于表面安装在相邻结构上的电感元件的方法,其具有改善的传热特性。 具体地说,本发明包括电感元件,其中芯和绕组限定了可以与相邻结构(优选印刷电路板)配合的共面。 包括本发明的感应元件的诸如电感器或变压器的装置具有多个低热阻导电路径,用于从芯中去除热量,从而增强电感元件的传热特性。 电感元件特别适用于电力电子设备,例如使用电源扼流圈或作为电力变压器的一部分。

    Method for vapor phase wafer cleaning
    29.
    发明授权
    Method for vapor phase wafer cleaning 失效
    气相晶圆清洗方法

    公开(公告)号:US5880031A

    公开(公告)日:1999-03-09

    申请号:US904419

    申请日:1992-06-25

    申请人: Man Wong

    发明人: Man Wong

    IPC分类号: H01L21/306 H01L21/30

    CPC分类号: H01L21/02049 Y10S438/906

    摘要: A controlled amount of gaseous nitrogen (12) is passed over a heated azeotropic solution of hydrogen fluoride and water (16) and producing an hydrogen fluoride vapor. The hydrogen fluoride vapor is combined with gaseous hydrogen chloride (14) and then the wafers (20) are exposed to the combined vapor at low pressure and room temperature.

    摘要翻译: 将受控量的气态氮(12)通过加热的氟化氢和水的共沸溶液(16),并产生氟化氢蒸气。 氟化氢蒸气与气态氯化氢(14)组合,然后在低压和室温下将晶片(20)暴露于组合的蒸汽。

    Method of making a low capacitance, low resistance sidewall antifuse
structure
    30.
    发明授权
    Method of making a low capacitance, low resistance sidewall antifuse structure 失效
    制造低电容,低电阻侧壁反熔丝结构的方法

    公开(公告)号:US5250464A

    公开(公告)日:1993-10-05

    申请号:US850192

    申请日:1992-03-11

    申请人: Man Wong David K. Liu

    发明人: Man Wong David K. Liu

    IPC分类号: H01L23/525 H01L21/14

    摘要: A method and resulting structure to provide an antifuse wherein the resistance of the programmed fuse and the line resistance and capacitance are materially reduced relative to the prior art and the procedures involved and the resulting structure of the fuse permit the use of materials not available in prior art antifuses. This is accomplished by providing the fuse on vertical sidewalls of the fuse electrode or beneath a sidewall oxide on the fuse electrode. Since the thickness of the electrode can be controlled to an extent not currently achievable by lithographic means, a much smaller area antifuse is provided using sidewall antifuse as opposed to a planar antifuse. The method of forming the antifuse structure comprises the steps of forming a pedestal having a sidewall comprising a first layer of electrically conductive material and a first electrically insulating layer thereon, forming a conformal layer of electrically conductive material on the pedestal and exposed substrate extending along the sidewall, forming a sidewall insulating layer along the sidewall portion of the layer of electrically conductive material, removing all of the exposed portion of the layer of electrically conductive material while retaining the portion of the layer of electrically conductive material between the pedestal and the sidewall insulating layer, forming a second layer of electrically insulating material over the structure, and forming a second layer of electrically conductive material over the second layer of electrically insulating material.

    摘要翻译: 一种提供反熔丝的方法和结果,其中编程熔丝的电阻和线电阻和电容相对于现有技术实质上减少,并且所涉及的程序和所得到的熔丝结构允许使用先前不可用的材料 艺术反熔丝。 这是通过在熔丝电极的垂直侧壁上或保险丝电极上的侧壁氧化物下面提供熔丝来实现的。 由于可以将电极的厚度控制在光刻装置当前不能达到的程度,所以与平面反熔丝相反,使用侧壁反熔丝提供了更小的区域反熔丝。 形成反熔丝结构的方法包括以下步骤:形成具有侧壁的基座,该侧壁包括第一层导电材料和其上的第一电绝缘层,在基座上形成导电材料的共形层,并沿着 侧壁,沿着导电材料层的侧壁部分形成侧壁绝缘层,移除导电材料层的所有暴露部分,同时将导电材料层的部分保持在基座和侧壁绝缘之间 在所述结构上形成第二层电绝缘材料,以及在所述第二层电绝缘材料上形成第二导电材料层。