摘要:
Crystallization-inducing metal elements are introduced onto an amorphous silicon thin film. A first, low-temperature, heat-treatment induces nucleation of metal-induced crystallization (MIC), resulting in the formation of small polycrystalline silicon “islands”. A metal-gettering layer is formed on the resulting partially crystallized thin film. A second, low-temperature, heat-treatment completes the MIC process, whilst gettering metal elements from the partially crystallized thin film. The process results in the desired polycrystalline silicon thin film.
摘要:
The invention provides an organic light emitting diode (OLED), having a substrate, an anode layer of silver or gold, wherein the anode layer is treated with CF4 plasma to enhance the hole injection of the semitransparent anode layer.
摘要:
A thin-film transistor with a fluorinated channel and fluorinated source and drain regions and methods of fabrication are provided. The thin-film transistor includes: a substrate; a semiconductor active layer of fluorine-doped metal-oxide formed on the substrate; fluorine-doped source and drain regions disposed adjacent to the semiconductor active layer; a gate electrode disposed over the semiconductor active layer, configured to induce a continuous conduction channel between the source and drain regions; and a gate dielectric material separating the gate electrode and the channel.
摘要:
A thin-film transistor includes a source and a drain that have each been replaced with a metal by a heat-treatment at a temperature within the range of 250° C. and 500° C.
摘要:
Crystallization-inducing metal elements are introduced onto an amorphous silicon thin film. A first, low-temperature, heat-treatment induces nucleation of metal-induced crystallization (MIC), resulting in the formation of small polycrystalline silicon “islands”. A metal-gettering layer is formed on the resulting partially crystallized thin film. A second, low-temperature, heat-treatment completes the MIC process, whilst gettering metal elements from the partially crystallized thin film. The process results in the desired polycrystalline silicon thin film.
摘要:
An organic light-emitting diode display which can display independent images on both sides is described. This display can be driven with passive matrix or active matrix schemes. The invention combines a unique stacked organic diode structure and special driving schemes involving time-sequential reversed fields.
摘要:
The present invention provides an integrated electronic microphone formed as part of a semiconductor device, and a manufacturing method therefor. The microphone is formed with a sensing electrode as part of a sensing membrane, and the sensing electrode is connected to the gate of a sensing transistor to provide an output. The microphone may be operated in constant bias or constant charge mode.
摘要:
The present invention provides an inductive element and a method making an inductive element for surface mounting on an adjacent structure that has improved heat transfer characteristics. Specifically, the present invention includes an inductive element where the core and winding define coplanar surfaces that can then be mated to an adjacent structure, preferably a printed circuit board. Devices such as inductors or transformers including the inventive inductive element have multiple, low thermal resistance conductive paths for removing heat from the core and thereby enhance the heat transfer characteristics of the inductive element. The inductive element is particularly well suited for power electronics, such as for use a power choke or as part of a power transformer.
摘要:
A controlled amount of gaseous nitrogen (12) is passed over a heated azeotropic solution of hydrogen fluoride and water (16) and producing an hydrogen fluoride vapor. The hydrogen fluoride vapor is combined with gaseous hydrogen chloride (14) and then the wafers (20) are exposed to the combined vapor at low pressure and room temperature.
摘要:
A method and resulting structure to provide an antifuse wherein the resistance of the programmed fuse and the line resistance and capacitance are materially reduced relative to the prior art and the procedures involved and the resulting structure of the fuse permit the use of materials not available in prior art antifuses. This is accomplished by providing the fuse on vertical sidewalls of the fuse electrode or beneath a sidewall oxide on the fuse electrode. Since the thickness of the electrode can be controlled to an extent not currently achievable by lithographic means, a much smaller area antifuse is provided using sidewall antifuse as opposed to a planar antifuse. The method of forming the antifuse structure comprises the steps of forming a pedestal having a sidewall comprising a first layer of electrically conductive material and a first electrically insulating layer thereon, forming a conformal layer of electrically conductive material on the pedestal and exposed substrate extending along the sidewall, forming a sidewall insulating layer along the sidewall portion of the layer of electrically conductive material, removing all of the exposed portion of the layer of electrically conductive material while retaining the portion of the layer of electrically conductive material between the pedestal and the sidewall insulating layer, forming a second layer of electrically insulating material over the structure, and forming a second layer of electrically conductive material over the second layer of electrically insulating material.