公开(公告)号：US09886343B2

公开(公告)日：2018-02-06

申请号：US14622776

申请日：2015-02-13

Applicant: Intel Corporation

Inventor： Bryan K. Casper ,  Stephen R. Mooney ,  David Dunning ,  Mozhgan Mansuri ,  James E. Jaussi

IPC: G06F11/10 ,  G11C5/02 ,  G11C29/12 ,  H03M13/15

CPC classification number: G06F11/1076 ,  G11C5/02 ,  G11C29/12 ,  H01L2224/16145 ,  H03M13/15 ,  H03M13/152

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.

公开(公告)号：US20160352055A1

公开(公告)日：2016-12-01

申请号：US15152019

申请日：2016-05-11

Applicant: Intel Corporation

Inventor： James E. Jaussi ,  Stephen R. Mooney ,  Howard L. Heck ,  Bruce E. Pederson ,  Bryan K. Casper

IPC: H01R24/64 ,  H01R12/72

CPC classification number: H01R24/64 ,  H01R12/721 ,  H01R13/66 ,  H01R13/6658 ,  H01R24/28 ,  H01R24/62 ,  H01R2107/00

Abstract: Methods and systems may include an input/output (IO) interface that has an integrated buffer, a housing and a substrate disposed within the housing. The substrate may include a first side, a second side and a connection edge. The integrated buffer can be coupled to at least one of the first side and the second side of the substrate. A plurality of rows of contacts may be coupled to the first side of the substrate. Each row of contacts can be stacked substantially parallel to the connection edge. The substrate may have power outputs coupled thereto and the integrated buffer can include a voltage regulator that has a supply output coupled to the power outputs.

Abstract translation: 方法和系统可以包括具有集成缓冲器的输入/输出（IO）接口，壳体和设置在壳体内的基板。 衬底可以包括第一侧，第二侧和连接边缘。 集成缓冲器可以耦合到衬底的第一侧和第二侧中的至少一个。 多个触点列可以耦合到衬底的第一侧。 每排触点可以基本上平行于连接边缘堆叠。 衬底可以具有耦合到其上的功率输出，并且集成缓冲器可以包括具有耦合到功率输出的电源输出的电压调节器。

公开(公告)号：US09374250B1

公开(公告)日：2016-06-21

申请号：US14573343

申请日：2014-12-17

Applicant: Intel Corporation

Inventor： Tawfiq Musah ,  Gokce Keskin ,  Ganesh Balamurugan ,  James E. Jaussi ,  Bryan K. Casper

IPC: H03H7/30 ,  H04L25/03 ,  H04L7/02

CPC classification number: H04L25/03057 ,  H04L7/0058 ,  H04L7/0087 ,  H04L7/033 ,  H04L25/03146 ,  H04L25/14

Abstract: Some embodiments include apparatus and methods having an input to receive an input signal, additional inputs to receive clock signals having different phases to sample the input signal, and a decision feedback equalizer (DFE) having DFE slices. The DFE slices include a number of data comparators to provide data information based on the sampling of the input signal, and a number of phase error comparators to provide phase error information associated with the sampling of the input signal. The number of phase error comparators of the DFE slices is not greater than the number of data comparators of the DFE slices.

Abstract translation: 一些实施例包括具有用于接收输入信号的输入的装置和方法，用于接收具有不同相位以对输入信号进行采样的时钟信号的附加输入以及具有DFE切片的判决反馈均衡器（DFE）。 DFE片包括多个数据比较器，用于基于输入信号的采样来提供数据信息，以及多个相位误差比较器，以提供与输入信号的采样相关联的相位误差信息。 DFE切片的相位误差比较器的数量不大于DFE切片的数据比较器的数量。

公开(公告)号：US20150089110A1

公开(公告)日：2015-03-26

申请号：US14557699

申请日：2014-12-02

Applicant: INTEL CORPORATION

Inventor： David J. Harriman ,  Mahesh Wagh ,  Robert E. Gough ,  James E. Jaussi

IPC: G06F13/40 ,  G06F1/32 ,  G06N99/00

CPC classification number: G06F13/4027 ,  G06F1/3203 ,  G06F13/20 ,  G06F13/4295 ,  G06N99/005 ,  Y02D10/14 ,  Y02D10/151

Abstract: In an embodiment, the present invention includes a protocol stack having a transaction layer and a link layer. In addition a first physical (PHY) unit is coupled to the protocol stack to provide communication between a processor and a device coupled to the processor via a physical link, where the first PHY unit is of a low power communication protocol and includes a first physical unit circuit. In turn, a second PHY unit is coupled to the protocol stack to provide communication between the processor and the device via a sideband channel coupled between the multicore processor and the device separate from the physical link, where the second PHY unit includes a second physical unit circuit. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，本发明包括具有事务层和链路层的协议栈。 另外，第一物理（PHY）单元被耦合到协议栈，以经由物理链路提供处理器和耦合到处理器的设备之间的通信，其中第一PHY单元是低功率通信协议，并且包括第一物理 单位电路。 反过来，第二PHY单元被耦合到协议栈，以经由耦合在与物理链路分离的多核处理器和设备之间的边带信道来提供处理器和设备之间的通信，其中第二PHY单元包括第二物理单元 电路。 描述和要求保护其他实施例。