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公开(公告)号:US10915267B2
公开(公告)日:2021-02-09
申请号:US15833955
申请日:2017-12-06
Applicant: Intel Corporation
Inventor: Sanjeev N. Trika , Peng Li , Jawad B. Khan , Myron Loewen
Abstract: Examples include techniques for implementing a write transaction to two or more memory devices in a storage device. In some examples, the write transaction includes an atomic write transaction from an application or operating system executing on a computing platform to a storage device coupled with the computing platform. For these examples, the storage device includes a storage controller to receive an atomic multimedia write transaction request to write first data and second data; cause the first data to be stored in a first memory device, and cause the second data to be stored in a second memory device, simultaneously and atomically.
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公开(公告)号:US20210006439A1
公开(公告)日:2021-01-07
申请号:US17029445
申请日:2020-09-23
Applicant: Intel Corporation
Inventor: Peng Li , Masashi Shimanouchi , Hsinho Wu
Abstract: A method facilitates determining transmission loss in a transmission signal and adjusting a receiver setting of a receiver to compensate for the transmission loss. The method includes transmitting a transmission signal from a transmitter and receiving the transmission signal by a first receiver and a second receiver. The method includes digitizing the transmission signal by the first receiver at a first sampling frequency and digitizing the transmission signal by the second receiver at a second sampling frequency that is less than or equal to the first sampling frequency. The method includes generating a PAM-n eye diagram of the transmission signal by the second receiver using digitized signals digitized by the first and second receivers and adjusting an equalizer setting of a first equalizer of the first receiver using eye-opening information of the PAM-n eye diagram where the eye-opening information includes information for the transmission loss.
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23.
公开(公告)号:US20200381332A1
公开(公告)日:2020-12-03
申请号:US16423700
申请日:2019-05-28
Applicant: Intel Corporation
Inventor: Amitesh Saha , Sergio Antonio Chan Arguedas , Marco Aurelio Cartas , Ken Hackenberg , Peng Li
IPC: H01L23/373 , H01L23/367
Abstract: Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.
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公开(公告)号:US10795838B2
公开(公告)日:2020-10-06
申请号:US16242471
申请日:2019-01-08
Applicant: Intel Corporation
Inventor: Peng Li , David J. Pelster , William Harper
Abstract: An embodiment of a semiconductor apparatus may include technology to detect a collision for a read request of an electronic storage device, and read data for the read request directly from a transfer buffer if the collision is detected. Other embodiments are disclosed and claimed.
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公开(公告)号:US20190132160A1
公开(公告)日:2019-05-02
申请号:US16230974
申请日:2018-12-21
Applicant: Intel Corporation
Inventor: Hsinho Wu , Masashi Shimanouchi , Peng Li
IPC: H04L25/03
Abstract: Systems and methods for electronic devices including two or more semiconductor devices coupled via an interconnect. The interconnect includes multiple lanes each having a link between the first and second semiconductor devices. One or more lanes of the multiple lanes each include clock and data recovery circuitry to perform full clock and data recovery. One or more other lanes of the multiple lanes each do not include clock and data recovery circuitry and instead includes a phase adjustment and clock multiplier circuit that is slave to clock and data recovery circuitry of the one or more lanes.
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公开(公告)号:US20190102293A1
公开(公告)日:2019-04-04
申请号:US15721547
申请日:2017-09-29
Applicant: Intel Corporation
Inventor: Peng Li , Jawad B. Khan , Sanjeev N. Trika
IPC: G06F12/06 , G05B19/045 , G11C7/10
CPC classification number: G06F12/0692 , G05B19/045 , G11C7/1006
Abstract: An embodiment of a semiconductor package apparatus may include technology to provide a first interface between a first storage device and a host device, and provide a second interface directly between the first storage device and a second storage device. Other embodiments are disclosed and claimed.
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公开(公告)号:US10216445B2
公开(公告)日:2019-02-26
申请号:US15639450
申请日:2017-06-30
Applicant: Intel Corporation
Inventor: Peng Li , Jawad B. Khan , Sanjeev N. Trika , Vinodh Gopal
IPC: G06F3/06
Abstract: One embodiment provides an apparatus. The apparatus include a device storage logic. The device storage logic is to determine a key-based pointer based, at least in part, on a key included in an input key-value (KV) pair received from a host device and to determine whether a unique input KV data block included in the input KV pair is duplicated in a nonvolatile memory circuitry of a storage device. The device storage logic is further to set a descriptor pointer associated with the unique input KV data block to point to a physical nonvolatile memory (NVM) address associated with an existing unique data block and increment a first reference count associated with the existing unique data block, if the unique input KV data block is a duplicate of the existing unique data block, or store the input KV data block to a physical NVM location associated with a selected physical NVM address, set the descriptor pointer to point to the selected physical NVM address and set a second reference count associated with the selected physical NVM address to one, if the unique input KV data block is not duplicated in the NVM circuitry.
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28.
公开(公告)号:US10146440B2
公开(公告)日:2018-12-04
申请号:US15385791
申请日:2016-12-20
Applicant: INTEL CORPORATION
Inventor: Peng Li , Anand S. Ramalingam , Jawad B. Khan , William K. Lui , Divya Narayanan , Sanjeev N. Trika
IPC: G06F3/06
Abstract: Provided are an apparatus, system and method for offloading collision check operations in a memory storage device to a collision check unit. A collision check unit includes a collision table including logical addresses for pending Input/Output (I/O) requests. An I/O request is received to a target logical address addressing a block of data in the non-volatile memory. The logical address is sent to the collision check unit. Resources to transfer data with respect to the transfer buffer to data for the I/O request are allocated in parallel while the collision check unit is determining whether the collision table includes the target logical address. The collision check unit determines whether the collision table includes the target logical address and returns indication of whether the collision table includes the target logical address indicating that current data for the target logical address is already in the transfer buffer.
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公开(公告)号:US11798861B2
公开(公告)日:2023-10-24
申请号:US16504698
申请日:2019-07-08
Applicant: Intel Corporation
Inventor: Peng Li , Kelly P. Lofgreen , Manish Dubey , Bamidele Daniel Falola , Ken Hackenberg , Shenavia S. Howell , Sergio Antonio Chan Arguedas , Yongmei Liu , Deepak Goyal
IPC: H01L23/34 , H01L21/48 , H01L23/433 , H01L23/367
CPC classification number: H01L23/345 , H01L21/4871 , H01L23/367 , H01L23/433
Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.
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公开(公告)号:US11356303B2
公开(公告)日:2022-06-07
申请号:US17214171
申请日:2021-03-26
Applicant: Intel Corporation
Inventor: Hsinho Wu , Masashi Shimanouchi , Peng Li
Abstract: Systems and methods for electronic devices including two or more semiconductor devices coupled via an interconnect. The interconnect includes multiple lanes each having a link between the first and second semiconductor devices. One or more lanes of the multiple lanes each include clock and data recovery circuitry to perform full clock and data recovery. One or more other lanes of the multiple lanes each do not include clock and data recovery circuitry and instead includes a phase adjustment and clock multiplier circuit that is slave to clock and data recovery circuitry of the one or more lanes.
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