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公开(公告)号:US11948807B2
公开(公告)日:2024-04-02
申请号:US17216932
申请日:2021-03-30
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , Thomas W. Liang , Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
CPC classification number: H01L21/485 , H05K3/4007 , H05K2203/043
Abstract: A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.
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公开(公告)号:US11929390B2
公开(公告)日:2024-03-12
申请号:US17174830
申请日:2021-02-12
Applicant: International Business Machines Corporation
Inventor: Kyle Schoneck , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler , Layne A. Berge , Thomas W. Liang , Matthew Doyle
CPC classification number: H01L28/56 , H01G2/06 , H01G4/06 , H01G4/10 , H01G4/12 , H01G4/40 , H01G9/21
Abstract: A temperature-dependent capacitor comprises a first conductive plate, a second conductive plate located in a parallel-planar orientation to the first conductive plate, and a dielectric material located between the first conductive plate and the second conductive plate, the dielectric material having a temperature-dependent dielectric constant (ε) value, wherein the temperature-dependent capacitor has a positive correlation of an operating temperature of the temperature-dependent capacitor to a capacitance value of the temperature-dependent capacitor.
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公开(公告)号:US11855341B2
公开(公告)日:2023-12-26
申请号:US17457353
申请日:2021-12-02
Applicant: International Business Machines Corporation
Inventor: Samuel Connor , Joseph Kuczynski , Matthew Doyle , Stuart B. Benefield
CPC classification number: H01Q1/364 , H01Q1/38 , H05K3/06 , H05K2203/0165
Abstract: Embodiments herein describe a capillary containing a eutectic conductive liquid (e.g., EGaIn) and an electrolyte (e.g., NaOH) that is integrated into a printed circuit board (PCB). In one embodiment, the PCB includes a capillary, a negative electrode, a positive electrode, a plurality of insulation layers, and a conductive layer. The capillary extends through the PCB. The capillary includes a side surface forming an annular cylinder. A eutectic conductive liquid and an electrolyte are disposed within an aperture formed by the side surface. An electrode extends through the side surface and contacts at least the eutectic conductive liquid or the electrolyte. The negative electrode is disposed at a first end of the capillary. The positive electrode is disposed at a second end of the capillary. The conductive layer is disposed between two of the plurality of insulation layers. The electrode forms an electrical connection with the conductive layer.
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公开(公告)号:US11693978B2
公开(公告)日:2023-07-04
申请号:US17303880
申请日:2021-06-09
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , Gerald Bartley
IPC: G06F21/62 , G06F1/30 , G06F13/16 , G06F13/42 , H01R12/73 , H01R12/70 , H01R13/66 , H05K1/11 , G06F21/60
CPC classification number: G06F21/62 , G06F1/30 , G06F13/1668 , G06F13/4282 , H01R12/7082 , H01R12/7088 , H01R12/737 , H01R13/6675 , H05K1/117 , G06F21/602 , G06F21/6245 , G06F2213/0026 , H05K2201/10037 , H05K2201/10159
Abstract: A printed circuit (PC) card apparatus can, in an absence of external power provided to a Peripheral Component Interconnect Express (PCIe) PC card, prevent and detect unauthorized access to secure data stored on a memory device mounted on the PCIe PC card. The PCIe card includes a primary battery to supply, when external power is disconnected from the PCIe card, power to an electronic security device mounted on the PCIe card. The PC card apparatus also includes a PCIe edge connector protector enclosing electrically conductive fingers of a PCIe edge card connector. The PCIe edge connector protector includes a hidden supplemental charge storage device integrated into the PCIe edge connector protector. The PCIe edge connector protector also includes electrically conductive contacts to transfer supplemental power from the supplemental charge storage device to the electronic security device.
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公开(公告)号:US20230054606A1
公开(公告)日:2023-02-23
申请号:US17404071
申请日:2021-08-17
Applicant: International Business Machines Corporation
Inventor: Arthur J. Higby , DAVID CLIFFORD LONG , Edward N. Cohen , John R. Dangler , Matthew Doyle , Philipp K. Buchling Rego , William Santiago-Fernandez , Levi CAMPBELL , James Busby
Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.
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公开(公告)号:US20220344569A1
公开(公告)日:2022-10-27
申请号:US17811374
申请日:2022-07-08
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , Joseph Kuczynski , Patrick Egan , Jeffrey N. Judd , Timothy J. Tofil
IPC: H01L41/09 , H01H1/029 , H01H57/00 , H01L41/193
Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.
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公开(公告)号:US20220319867A1
公开(公告)日:2022-10-06
申请号:US17216932
申请日:2021-03-30
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , Thomas W. Liang , Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
Abstract: A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.
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公开(公告)号:US20220262893A1
公开(公告)日:2022-08-18
申请号:US17174830
申请日:2021-02-12
Applicant: International Business Machines Corporation
Inventor: Kyle Schoneck , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler , Layne A. Berge , Thomas W. Liang , Matthew Doyle
Abstract: A temperature-dependent capacitor comprises a first conductive plate, a second conductive plate located in a parallel-planar orientation to the first conductive plate, and a dielectric material located between the first conductive plate and the second conductive plate, the dielectric material having a temperature-dependent dielectric constant (ε) value, wherein the temperature-dependent capacitor has a positive correlation of an operating temperature of the temperature-dependent capacitor to a capacitance value of the temperature-dependent capacitor.
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公开(公告)号:US11411166B2
公开(公告)日:2022-08-09
申请号:US16415949
申请日:2019-05-17
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , Joseph Kuczynski , Patrick Egan , Jeffrey N. Judd , Timothy J. Tofil
IPC: H01L41/09 , H01H57/00 , H01H1/029 , H01L41/193
Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.
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公开(公告)号:US11171103B2
公开(公告)日:2021-11-09
申请号:US16734583
申请日:2020-01-06
Applicant: International Business Machines Corporation
Inventor: Jason J. Bjorgaard , Layne A. Berge , John R. Dangler , Matthew Doyle , Thomas W. Liang , Kyle Schoneck , Matthew A. Walther
IPC: H01L23/00
Abstract: A solder ball assembly can include a first spring element having a first shape and formed from a first elastic electrically conductive material. The solder ball assembly can also include a second spring element having a second shape and formed from a second elastic electrically conductive material. The second spring element is mechanically attached to the first spring element to form a spring assembly. The solder ball can be configured to enclose the spring assembly.
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