公开(公告)号：US20240312983A1

公开(公告)日：2024-09-19

申请号：US18671908

申请日：2024-05-22

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, a PN junction assembly, and a transistor circuit. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer is formed above the second surface. The second metal layer is formed on the second surface. The PN junction assembly is disposed on the first surface and electrically connected with the first metal layer and the second metal layer. The PN junction assembly includes a variable capacitor. The transistor circuit is electrically connecting with the second metal layer.

公开(公告)号：US11901618B2

公开(公告)日：2024-02-13

申请号：US17929907

申请日：2022-09-06

Applicant: InnoLux Corporation

Inventor： Chia-Ping Tseng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Ming-Yen Weng ,  Hung-I Tseng ,  Shu-Ling Wu ,  Huei-Ying Chen

IPC: H01Q1/38 ,  H01Q3/44 ,  H01Q9/04 ,  H01L27/12 ,  H01L21/04 ,  H01Q3/34 ,  G02F1/1343 ,  G02F1/1333

CPC classification number: H01Q1/38 ,  G02F1/13439 ,  H01L21/045 ,  H01L27/1237 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/0407 ,  G02F1/133345 ,  G02F2201/07

Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.

公开(公告)号：US11688934B2

公开(公告)日：2023-06-27

申请号：US17462461

申请日：2021-08-31

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Tang-Chin Hung ,  Chia-Chi Ho ,  I-Yin Li

IPC: H01Q1/38 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q3/44

CPC classification number: H01Q1/36 ,  H01Q9/0407 ,  G09G2300/0876 ,  H01Q3/44

Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.

公开(公告)号：US20230187594A1

公开(公告)日：2023-06-15

申请号：US17991779

申请日：2022-11-21

Applicant: Innolux Corporation

Inventor： Chia-Ping Tseng ,  Chia-Chi Ho

IPC: H01L33/62 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/56

Abstract: The disclosure provides an electronic device including a substrate, at least one conductive composite structure, and an electronic element. The at least one conductive composite structure is disposed on the substrate. The at least one conductive composite structure includes a first metal layer, a second metal layer, and a third metal layer. The second metal layer is located between the first metal layer and the third metal layer, and the thickness of the second metal layer ranges from 0.5 μm to 12 μm. The electronic element is disposed on the at least one conductive composite structure and bonded to the at least one conductive composite structure.

公开(公告)号：US20230170603A1

公开(公告)日：2023-06-01

申请号：US17975566

申请日：2022-10-27

Applicant: Innolux Corporation

Inventor： Chung-Chun Cheng ,  Chia-Chi Ho ,  Chia-Ping Tseng ,  Yan-Zheng Wu ,  Yao-Wen Hsu

IPC: H01Q1/22 ,  H01Q1/38

CPC classification number: H01Q1/2283 ,  H01Q1/38

Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

公开(公告)号：US20230084360A1

公开(公告)日：2023-03-16

申请号：US17889361

申请日：2022-08-16

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chia-Chi Ho

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic device includes a substrate, a bump, a chip, and an adhesive layer. The substrate includes a first connection pad. The bump is disposed on the first connection pad. The chip includes a second connection pad. The bump is disposed between the first connection pad and the second connection pad. The adhesive layer is disposed between the substrate and the chip. A dissipation factor of the adhesive layer is less than or equal to 0.01 at a frequency of 10 GHz. A manufacturing method of an electronic device includes the following: providing a substrate, where the substrate includes a first connection pad; applying an adhesive layer on the substrate; patterning the adhesive layer, such that the adhesive layer produces an opening exposing the first connection pad; forming a bump on the first connection pad; and bonding the chip onto the bump through the second connection pad.

公开(公告)号：US20210119333A1

公开(公告)日：2021-04-22

申请号：US17035725

申请日：2020-09-29

Applicant: Innolux Corporation

Inventor： Hsiuyi Tsai ,  Yi Hung Lin ,  Chia-Chi Ho ,  Yan-Zheng Wu

IPC: H01Q3/44 ,  G02F1/13

Abstract: An electromagnetic wave adjusting device includes a first substrate, a first conductive element, a first insulation layer, a second substrate, a second conductive element, a dielectric layer, and a conductive layer. The first conductive element is disposed on the first substrate. The first insulation layer is disposed on the first conductive element. The second conductive element is disposed on the second substrate. The dielectric layer is disposed between the first substrate and the second substrate. The first conductive layer is disposed on the first insulation layer and electrically connected to the first conductive element. The electromagnetic wave adjusting device includes an overlap area and a capacitance adjustable area. An overlap portion of the first conductive element and the second conductive element constitutes the overlap area, the capacitance adjustable area includes the overlap area, and at least part of the first conductive layer is disposed in the capacitance adjustable area.

公开(公告)号：US10651549B2

公开(公告)日：2020-05-12

申请号：US16026171

申请日：2018-07-03

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Chin-Lung Ting ,  Chia-Chi Ho ,  Yi-Hung Lin

IPC: H01Q1/40 ,  H01Q3/44 ,  H01Q1/36

Abstract: A microwave device includes a first substrate having a first surface, a first metal layer, a second substrate having a second surface corresponding to the first substrate, a second metal layer, a sealing element, a modulation material, and a fill material. The first metal layer is disposed on the first surface, and the first metal layer includes openings. The second metal layer is disposed on the second surface. The second metal layer includes electrodes corresponding to the openings. The sealing element is located between the first substrate and the second substrate. An active zone is formed by a space between the sealing element, the first substrate, and the second substrate. The modulation material is filled within the active area. The fill material is disposed in the active area. The thickness of the fill material is greater than 0.3 μm, and less than the thickness of the sealing element.

公开(公告)号：US10249949B2

公开(公告)日：2019-04-02

申请号：US15869786

申请日：2018-01-12

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Chia-Chi Ho ,  Chin-Lung Ting ,  Yan-Zheng Wu

IPC: H04B1/04 ,  H01Q3/44 ,  H01Q9/16 ,  H01Q7/00 ,  H01Q9/27 ,  H04B1/034 ,  H04B13/00 ,  H04B7/0404

Abstract: A microwave modulation device includes a first radiator; a second radiator disposed on the first radiator; a third radiator disposed on the second radiator; a support structure disposed between the first radiator and the second radiator; and a modulation structure disposed between the second radiator and the third radiator. A microwave-transmission layer is located among the space defined by the first radiator, the second radiator, and the support structure. The microwave-transmission layer is gas, substantially vacuum, liquid or insulating material.

公开(公告)号：US12266852B2

公开(公告)日：2025-04-01

申请号：US18401885

申请日：2024-01-02

Applicant: InnoLux Corporation

Inventor： Chia-Ping Tseng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Ming-Yen Weng ,  Hung-I Tseng ,  Shu-Ling Wu ,  Huei-Ying Chen

IPC: H01Q1/38 ,  G02F1/1343 ,  H01L21/04 ,  H01L27/12 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/04 ,  G02F1/1333

Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.