公开(公告)号：US20220328405A1

公开(公告)日：2022-10-13

申请号：US17851046

申请日：2022-06-28

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.

公开(公告)号：US11469491B2

公开(公告)日：2022-10-11

申请号：US16732701

申请日：2020-01-02

Applicant: InnoLux Corporation

Inventor： Chia-Ping Tseng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Ming-Yen Weng ,  Hung-I Tseng ,  Shu-Ling Wu ,  Huei-Ying Chen

IPC: H01Q1/38 ,  H01Q3/44 ,  H01Q9/04 ,  H01L27/12 ,  H01L21/04 ,  H01Q3/34 ,  G02F1/1343 ,  G02F1/1333

Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.

公开(公告)号：US11302635B2

公开(公告)日：2022-04-12

申请号：US16920448

申请日：2020-07-03

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93 ,  H01L23/538 ,  H01L21/60

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US12040315B2

公开(公告)日：2024-07-16

申请号：US17505594

申请日：2021-10-19

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Yan-Zheng Wu

IPC: H01L25/00 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L23/66 ,  H01L25/07

CPC classification number: H01L25/072 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15172

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

公开(公告)号：US12034002B2

公开(公告)日：2024-07-09

申请号：US17678040

申请日：2022-02-23

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L29/93 ,  H01L23/538

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US20240222327A1

公开(公告)日：2024-07-04

申请号：US18531720

申请日：2023-12-07

Applicant: Innolux Corporation

Inventor： Chia-Ping Tseng

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/0655 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32147 ,  H01L2224/32235 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/1306

Abstract: An electronic device includes a substrate, a conductive structure, a first passivation layer, and an electronic component. The conductive structure is provided on the substrate and has at least one discontinuous part. The first passivation layer is provided on the conductive structure and has a first opening. The electronic component is provided on the conductive structure. The electronic component is electrically connected to the conductive structure through the first opening. The at least one discontinuous part overlaps the first opening. The electronic device in the embodiments of the disclosure may improve the problem of the intermetallic compound layer affecting the formation of the conductive member.

公开(公告)号：US20230395484A1

公开(公告)日：2023-12-07

申请号：US18311230

申请日：2023-05-02

Applicant: Innolux Corporation

Inventor： Jen-Hai Chi ,  Chia-Ping Tseng

IPC: H01L23/498 ,  H01L25/16 ,  H01L23/48 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/4985 ,  H01L25/16 ,  H01L23/48 ,  H01L23/5387 ,  H01L25/0657 ,  H01L24/32 ,  H01L21/4846 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L24/16 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L24/73 ,  H01L2224/73204 ,  H01L24/14 ,  H01L2224/1403

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a flexible substrate, an adhesive layer, a metal layer, a driving unit, and a modulating unit. The adhesive layer is disposed on the flexible substrate. The metal layer is disposed on the adhesive layer. The driving unit is disposed on the adhesive layer. The modulating unit is disposed on the adhesive layer. The manufacturing method of the electronic device includes the following steps: providing a carrier substrate; forming a first metal layer on the carrier substrate; providing a flexible substrate, and combining the flexible substrate and the carrier substrate; removing the carrier substrate; and providing a modulating unit, and disposing the modulating unit on the flexible substrate. The electronic device and the manufacturing method thereof of the embodiments of the disclosure may make the electronic device having the modulating unit applicable to a non-planar structure.

公开(公告)号：US20230246037A1

公开(公告)日：2023-08-03

申请号：US18152764

申请日：2023-01-11

Applicant: Innolux Corporation

Inventor： Chia-Ping Tseng ,  Chia-Chi Ho

IPC: H01L27/12 ,  H01L23/373 ,  H01L23/552 ,  H01L23/60

CPC classification number: H01L27/124 ,  H01L23/3735 ,  H01L23/552 ,  H01L23/60

Abstract: An electronic device including a substrate, a conductive layer, a first driving component, and an electronic component is provided. The conductive layer is disposed on the substrate. A thickness of the conductive layer is between 0.5 μm and 12 μm. The first driving component is disposed on the conductive layer. The electronic component is disposed on the substrate and electrically connected to the first driving component.

公开(公告)号：US11574893B2

公开(公告)日：2023-02-07

申请号：US17106197

申请日：2020-11-30

Applicant: InnoLux Corporation

Inventor： Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Yan-Zheng Wu

IPC: H01L25/07 ,  H01L23/498 ,  H01L23/48 ,  H01L23/31 ,  H01L23/66 ,  H01L23/00

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

公开(公告)号：US20220165726A1

公开(公告)日：2022-05-26

申请号：US17513865

申请日：2021-10-28

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Jen-Hai Chi ,  Chia-Ping Tseng ,  Chen-Lin Yeh ,  Chung-Kuang Wei ,  Cheng-Hsu Chou

IPC: H01L27/06 ,  H01L29/778 ,  H01L29/93

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.