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公开(公告)号:US09685508B2
公开(公告)日:2017-06-20
申请号:US14946718
申请日:2015-11-19
Applicant: Intel Corporation
Inventor: Han Wui Then , Robert Chau , Benjamin Chu-Kung , Gilbert Dewey , Jack Kavalieros , Matthew Metz , Niloy Mukherjee , Ravi Pillarisetty , Marko Radosavljevic
IPC: H01L29/06 , H01L29/66 , H01L29/775 , G05F3/02 , H01L29/786 , B82Y10/00 , H01L21/02 , H01L21/225 , H01L21/283 , H01L21/306 , H01L21/31 , H01L21/311 , H01L21/3213 , H01L21/324 , H01L29/04 , H01L29/417 , H01L29/423 , H01L29/20
CPC classification number: H01L29/0673 , B82Y10/00 , G05F3/02 , H01L21/02603 , H01L21/02636 , H01L21/225 , H01L21/283 , H01L21/30604 , H01L21/31 , H01L21/31116 , H01L21/32133 , H01L21/324 , H01L29/04 , H01L29/0676 , H01L29/068 , H01L29/2003 , H01L29/41725 , H01L29/42356 , H01L29/42392 , H01L29/66439 , H01L29/66462 , H01L29/66469 , H01L29/775 , H01L29/78696
Abstract: Transistors suitable for high voltage and high frequency operation are disclosed. A nanowire is disposed vertically or horizontally on a substrate. A longitudinal length of the nanowire is defined into a channel region of a first semiconductor material, a source region electrically coupled with a first end of the channel region, a drain region electrically coupled with a second end of the channel region, and an extrinsic drain region disposed between the channel region and drain region. The extrinsic drain region has a wider bandgap than that of the first semiconductor. A gate stack including a gate conductor and a gate insulator coaxially wraps completely around the channel region, drain and source contacts similarly coaxially wrap completely around the drain and source regions.
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22.
公开(公告)号:US08872225B2
公开(公告)日:2014-10-28
申请号:US13722824
申请日:2012-12-20
Applicant: Intel Corporation
Inventor: Benjamin Chu-Kung , Van Le , Robert Chau , Sansaptak Dasgupta , Gilbert Dewey , Niti Goel , Jack Kavalieros , Matthew Metz , Niloy Mukherjee , Ravi Pillarisetty , Willy Rachmady , Marko Radosavljevic , Han Wui Then , Nancy Zelick
CPC classification number: H01L21/823821 , H01L27/0924 , H01L29/1054 , H01L29/165 , H01L29/785
Abstract: An embodiment uses a very thin layer nanostructure (e.g., a Si or SiGe fin) as a template to grow a crystalline, non-lattice matched, epitaxial (EPI) layer. In one embodiment the volume ratio between the nanostructure and EPI layer is such that the EPI layer is thicker than the nanostructure. In some embodiments a very thin bridge layer is included between the nanostructure and EPI. An embodiment includes a CMOS device where EPI layers covering fins (or that once covered fins) are oppositely polarized from one another. An embodiment includes a CMOS device where an EPI layer covering a fin (or that once covered a fin) is oppositely polarized from a bridge layer covering a fin (or that once covered a fin). Thus, various embodiments are disclosed from transferring defects from an EPI layer to a nanostructure (that is left present or removed). Other embodiments are described herein.
Abstract translation: 一个实施例使用非常薄的层纳米结构(例如,Si或SiGe鳍)作为模板来生长晶体,非晶格匹配的外延(EPI)层。 在一个实施方案中,纳米结构和EPI层之间的体积比使得EPI层比纳米结构厚。 在一些实施例中,在纳米结构和EPI之间包括非常薄的桥接层。 一个实施例包括一个CMOS器件,其中覆盖翅片(或一旦被覆盖的翅片)的EPI层彼此相反地极化。 一个实施例包括一个CMOS器件,其中覆盖翅片(或一旦被覆盖的翅片)的EPI层与覆盖翅片(或一旦被覆盖的翅片)的桥接层相反地偏振。 因此,从EPI层转移到纳米结构(剩下的存在或去除)的缺陷中公开了各种实施例。 本文描述了其它实施例。
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