摘要:
An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.
摘要:
Disclosed herein is an apparatus for manufacturing a substrate, including: a first chamber supplying an insulation layer; a second chamber including a roughening roller roughening at least one side of the insulation layer supplied from the first chamber, an evaporator depositing a metal layer on the roughened insulation layer, and a pressing roller pressing the insulation layer and the metal layer; and a third chamber storing the insulation layer including the metal layer formed thereon, the insulation layer being taken out from the second chamber. The apparatus for manufacturing a substrate is advantageous in that substrates are continuously produced, thus increasing the productivity of the substrates and preventing the substrates from being contaminated by the air.
摘要:
Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.