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21.发明授权Method of processing noise in image data, noise reduction unit, and imaging apparatus 有权处理图像数据，噪声降低单元和成像装置中的噪声的方法公开(公告)号：US08149302B2
公开(公告)日：2012-04-03
申请号：US12776396
申请日：2010-05-09
申请人： Kazuhiro Hoshino , Hirofumi Sumi
发明人： Kazuhiro Hoshino , Hirofumi Sumi
CPC分类号： H04N9/646
摘要： A method of processing noise in image data by an image processor having a signal-processing portion converting an image signal from an image sensor into a digital signal and outputting the converted signal as image data for each frame, the image data indicating sets of pixel values each having a brightness at a corresponding one of coordinate points arranged in directions of rows and columns is disclosed. The method includes the steps of: extracting pixel values; deciding pixel value; finding autocorrelation coefficients of pixel values which are less than a first threshold value; and deciding random noise in the image.
摘要翻译： 一种通过图像处理器处理图像数据中的噪声的方法，所述图像处理器具有信号处理部分，将来自图像传感器的图像信号转换为数字信号，并将转换的信号作为每帧的图像数据输出，所述图像数据指示像素值集合 公开了在行和列的方向上布置的坐标点的相应一个处的亮度。 该方法包括以下步骤：提取像素值; 决定像素值; 找到小于第一阈值的像素值的自相关系数; 并决定图像中的随机噪声。
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22.发明授权公开(公告)号：US07892655B2
公开(公告)日：2011-02-22
申请号：US11610799
申请日：2006-12-14
IPC分类号： B32B15/00
CPC分类号： C25D5/10 , B32B7/06 , B32B15/08 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2457/08 , H05K3/022 , Y10T428/12812 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931 , Y10T428/24917
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。
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公开(公告)号：US07521656B2
公开(公告)日：2009-04-21
申请号：US11106302
申请日：2005-04-13
IPC分类号： H01L27/00
CPC分类号： H04N5/335 , H01L27/14609 , H04N5/374 , H04N5/3742
摘要： An arithmetic circuit, which is retained by each pixel in a conventional image sensor, is shared by each column. Signal processing circuits of different configurations are provided on signal transmission paths in an upward direction and a downward direction of a vertical signal line for extracting an image signal from each pixel, whereby image output processing and arithmetic processing are performed completely separately by the different circuit blocks. Thus, image quality of an actual image is improved and optimum design for arithmetic processing is made possible. Specifically, an I-V converter circuit unit, a CDS circuit unit and the like are provided on the image output side. A current mirror circuit unit, an analog memory array unit, a comparator unit, a bias circuit unit, a data latch unit, an output data bus unit and the like are provided on the arithmetic processing side.
摘要翻译： 由常规图像传感器中的每个像素保留的算术电路由每列共享。 不同配置的信号处理电路在垂直信号线的向上方向和下方的信号传输路径上提供，用于从每个像素提取图像信号，从而通过不同的电路块完全分别执行图像输出处理和运算处理 。 因此，改善了实际图像的图像质量，使得可以进行算术处理的最佳设计。 具体地，在图像输出侧设置有I-V转换器电路单元，CDS电路单元等。 算术处理侧设置电流镜电路单元，模拟存储器阵列单元，比较单元，偏置电路单元，数据锁存单元，输出数据总线单元等。
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24.发明申请公开(公告)号：US20070154692A1
公开(公告)日：2007-07-05
申请号：US11610799
申请日：2006-12-14
CPC分类号： C25D5/10 , B32B7/06 , B32B15/08 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2457/08 , H05K3/022 , Y10T428/12812 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931 , Y10T428/24917
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基座的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足公式：<？in-line-formula description =“In-line formula”end =“lead”？> 10 <= A /（a + b）* 100 <= 70 <？in-line-formula description = “直线公式”end =“tail”？>和打印的c 通过使用这种超薄铜箔与载体制备的电路板。
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25.发明授权Semiconductor device a burried wiring structure and process for fabricating the same 有权半导体器件是布线布线结构及其制造方法公开(公告)号：US06395627B1
公开(公告)日：2002-05-28
申请号：US09691187
申请日：2000-10-19
申请人： Kazuhiro Hoshino , Takeshi Nogami
发明人： Kazuhiro Hoshino , Takeshi Nogami
IPC分类号： H01L2144
CPC分类号： H01L21/76814 , H01L21/288 , H01L21/76808 , H01L21/76879 , H01L21/76885 , H01L2221/1063
摘要： A semiconductor device comprising a substrate; a first metal wiring formed in the substrate, wherein the first metal wiring is comprised of a metal; an insulating film formed on the substrate so as to cover the first metal wiring; a trench formed in the insulating film; a via hole formed in the insulating film so as to reach the first metal wiring from the trench; a metal plug for plugging the via hole, wherein the metal plug is comprised of the same metal as that for the first metal wiring and formed so as to directly connect to the first metal wiring and reach the inside of the trench; and a second metal wiring formed in the trench so as to directly connect to the metal plug, wherein the second metal wiring is comprised of the same metal as that for the metal plug. The semiconductor device of the present invention is advantageous not only in that is has an improved electromigration resistance, but also in that it has a wiring structure such that the reliability is high and the resistivity is low.
摘要翻译： 一种半导体器件，包括衬底; 形成在所述基板中的第一金属布线，其中所述第一金属布线由金属构成; 形成在所述基板上以覆盖所述第一金属布线的绝缘膜; 形成在绝缘膜中的沟槽; 形成在所述绝缘膜上以从所述沟槽到达所述第一金属布线的通孔; 用于堵塞所述通孔的金属插塞，其中所述金属插塞由与所述第一金属布线相同的金属构成，并且形成为直接连接到所述第一金属布线并到达所述沟槽的内部; 以及形成在所述沟槽中以直接连接到所述金属插塞的第二金属布线，其中所述第二金属布线由与所述金属插塞相同的金属构成。 本发明的半导体器件的优点在于不仅具有改进的电迁移性，而且具有使得可靠性高并且电阻率低的布线结构。
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公开(公告)号：US5315062A
公开(公告)日：1994-05-24
申请号：US795545
申请日：1991-11-21
申请人： Kazuhiro Hoshino
发明人： Kazuhiro Hoshino
IPC分类号： H01R4/70 , H01R13/506 , H01R13/516 , H01R13/52 , H01R13/58 , H02G3/04 , H02G3/06 , H02G3/08 , H01R13/62 , H01R13/627
CPC分类号： H01R13/516 , H01R13/506 , H02G3/0691
摘要： A connector cover for a wire harness includes a main cover composed of a hinged pair of half case bodies and a secondary cover composed of a hinged pair of semicylindrical bodies. The main cover is formed with an opening for affixing to the back of the connector and a circular opening with a circular ridge elongating inside surface for passing the wire extending from the connector when the half case bodies are closed. The secondary cover has both ends opened for receiving the wire harness and is formed with a cylindrical opening with a channel grove extending therearound for passing the wire when the semicylindrical bodies are closed, and is connected to the main cover such that the circular ridge of the main cover fits in the channel groove around the cylindrical opening. Accordingly, the secondary cover can rotate with respect to the main cover.
摘要翻译： 用于线束的连接器盖包括由铰接的一对半壳体构成的主盖和由铰接的一对半圆柱体构成的次盖。 主盖形成有用于固定到连接器的背面的开口和具有延伸的内表面的圆形脊的圆形开口，用于当半壳体关闭时使从连接器延伸的线通过。 辅助盖的两端打开以接收线束，并且形成有圆柱形开口，其中在半圆柱体关闭时通过线路延伸的通道槽，并且连接到主盖，使得圆形凸起 主盖适合在圆柱形开口周围的槽槽中。 因此，副盖可以相对于主盖旋转。
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公开(公告)号：US4910169A
公开(公告)日：1990-03-20
申请号：US097739
申请日：1987-09-17
申请人： Kazuhiro Hoshino
发明人： Kazuhiro Hoshino
IPC分类号： H01L21/31 , H01L21/3205 , H01L21/768 , H01L23/52 , H01L23/532
CPC分类号： H01L21/76886 , H01L21/32051 , H01L21/76877 , H01L23/53233 , H01L23/53238 , H01L2924/0002
摘要： A method of producing a semiconductor device includes the steps of forming a metallization film including copper on a surface of a substrate, and depositing an insulating film on a surface of the metallization film at a temperature which is below the oxidation temperature of copper.
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28.发明申请公开(公告)号：US20120205146A1
公开(公告)日：2012-08-16
申请号：US13390403
申请日：2010-08-11
申请人： Ryoichi Oguro , Kazuhiro Hoshino
发明人： Ryoichi Oguro , Kazuhiro Hoshino
CPC分类号： H05K3/384 , B32B15/08 , B32B15/20 , C23C18/122 , C25D1/04 , C25D3/32 , C25D3/38 , C25D5/10 , C25D5/16 , C25D5/48 , C25D7/0614 , C25D11/38 , H05K1/0242 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12535 , Y10T428/12549 , Y10T428/12792
摘要： Disclosed is a copper foil which has excellent high frequency characteristics and heat resistance, while achieving high heat-resistant adhesion to a resin substrate at the same time. Specifically disclosed is a heat-resistant copper foil which has a configuration wherein a first roughened surface layer which has been treated by a first roughening treatment by copper metal, a second roughened surface layer which has been treated by a second roughening treatment by copper metal, and a third treated surface layer which has been treated by a third treatment process by zinc metal are sequentially provided on one surface of an untreated copper foil. Also specifically disclosed are: a circuit board which is obtained by laminating the heat-resistant copper foil on a flexible resin substrate or a rigid resin substrate; and a method for producing a copper-clad laminate wherein the heat-resistant copper foil and a heat-resistant resin substrate are thermally pressure-bonded and the roughened copper metal and the third treated surface layer of the zinc metal are alloyed.
摘要翻译： 公开了一种具有优异的高频特性和耐热性的铜箔，同时对树脂基板实现高耐热粘合性。 具体公开了一种耐热铜箔，其具有通过铜金属的第一粗糙化处理进行了处理的第一粗糙化表面层，通过铜金属进行第二粗糙化处理的第二粗糙化表面层， 并且在未处理的铜箔的一个表面上依次设置通过第三处理工艺用锌金属处理的第三处理表面层。 还具体公开的是：通过将耐热铜箔层压在柔性树脂基板或刚性树脂基板上而获得的电路板; 以及一种制造覆铜层压板的方法，其中耐热铜箔和耐热树脂基板被热压粘合，并且将粗糙的铜金属和第三被处理的锌金属表面层合金化。
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29.发明申请COPPER FOIL WITH RESISTANCE LAYER, METHOD OF PRODUCTION OF THE SAME AND LAMINATED BOARD 审中-公开具有电阻层的铜箔，其制造方法和层压板公开(公告)号：US20120111613A1
公开(公告)日：2012-05-10
申请号：US13384084
申请日：2010-07-07
申请人： Ryoichi Oguro , Kouji Kase , Kazuhiro Hoshino
发明人： Ryoichi Oguro , Kouji Kase , Kazuhiro Hoshino
CPC分类号： C25D5/48 , C23C30/00 , C25D1/04 , C25D3/562 , C25D5/34 , C25D7/0628 , C25D11/38 , H05K1/167 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , Y10T428/12049 , Y10T428/12076
摘要： A copper foil with a resistance layer is provided, wherein the variation value is small when it is made into a resistance element, the adhesion with the resin substrate to be laminated with is able to be sufficiently maintained, which has an excellent characteristics as a resistance element for a rigid and a flexible substrate. A copper foil with a resistance layer of the present invention comprises a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles. A method of production of a copper foil with a resistance layer of the present invention comprises: forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5 μm in terms of Rz value prescribed in JIS-B-0601; and performing roughening treatment to a surface of the resistance layer with nickel particles wherein a roughness is within a range of 4.5 to 8.5 μm in terms of Rz value prescribed in JIS-B-0601. The alloy layer is for example formed from phosphorus-containing nickel.
摘要翻译： 提供了具有电阻层的铜箔，其中当制成电阻元件时其变化值较小，能够充分保持与要层压的树脂基板的粘附性，其具有作为电阻的优异特性 用于刚性和柔性基底的元件。 本发明的具有电阻层的铜箔的一个表面上形成有形成有电阻元件的金属层或合金层的铜箔，金属层或合金层的表面经受 用镍颗粒进行粗糙处理。 本发明的具有电阻层的铜箔的制造方法包括：在具有由柱状晶粒构成的结晶的电沉积铜箔的无光泽表面上形成含磷镍电阻层，其中， 在JIS-B-0601中规定的Rz值为2.5〜6.5μm的范围内。 并且以JIS-B-0601中规定的Rz值为基准的粗糙度在4.5〜8.5μm的范围内的镍粒子对电阻层的表面进行粗糙化处理。 合金层例如由含磷的镍形成。
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30.发明授权Method of processing noise in image data, noise reduction unit, and imaging apparatus 有权处理图像数据，噪声降低单元和成像装置中的噪声的方法公开(公告)号：US07825964B2
公开(公告)日：2010-11-02
申请号：US11895528
申请日：2007-08-24
申请人： Kazuhiro Hoshino , Hirofumi Sumi
发明人： Kazuhiro Hoshino , Hirofumi Sumi
CPC分类号： H04N9/646
摘要： A method of processing noise in image data by an image processor having a signal-processing portion converting an image signal from an image sensor into a digital signal and outputting the converted signal as image data for each frame, the image data indicating sets of pixel values each having a brightness at a corresponding one of coordinate points arranged in directions of rows and columns is disclosed. The method includes the steps of: extracting pixel values; deciding pixel value; finding autocorrelation coefficients of pixel values which are less than a first threshold value; and deciding random noise in the image.
摘要翻译： 一种通过图像处理器处理图像数据中的噪声的方法，所述图像处理器具有将来自图像传感器的图像信号转换成数字信号的信号处理部分，并且将转换的信号作为每帧的图像数据输出，所述图像数据指示像素值集合 公开了在行和列的方向上布置的坐标点的相应一个处的亮度。 该方法包括以下步骤：提取像素值; 决定像素值; 找到小于第一阈值的像素值的自相关系数; 并决定图像中的随机噪声。
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