公开(公告)号：US08541695B2

公开(公告)日：2013-09-24

申请号：US12956826

申请日：2010-11-30

申请人： Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

发明人： Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

IPC分类号： H05K1/11

CPC分类号： H05K1/0222 ,  H05K1/0271 ,  H05K1/115 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827

摘要： A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.

摘要翻译： 布线基板包括具有第一表面和第二表面的基底，穿过基底的第一穿透孔，形成在第一孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二穿透孔 以及形成在所述第二孔中的第二通孔导体，在所述基板的第一表面上的第一导电电路，所述基板的第二表面上的第二导电电路，所述第二孔的一端上的第一导电部， 以及在所述第二穿透孔的相对端上的第二导电部分。 第一导体连接第一电路和第二电路。 第二导体由填充在第二孔中的导电材料制成，并且连接第一导电部分和第二导电部分。

公开(公告)号：US07227577B2

公开(公告)日：2007-06-05

申请号：US10307810

申请日：2002-12-02

申请人： Yoshinori Tanida ,  Kenji Sakai

发明人： Yoshinori Tanida ,  Kenji Sakai

IPC分类号： H04N5/225 ,  G02B13/16 ,  G03B17/00

CPC分类号： H04N5/2257 ,  H04N5/2254

摘要： A camera module includes a solid-state imaging device; a lens unit having a lens for guiding light to the solid-state imaging device; a lens holder for holding the solid-state imaging device, the lens holder including a lens coupling section provided for adjusting the position of the lens, such that a distance between the lens and the solid-state imaging device becomes a prescribed focusing distance; and a shield cap for covering the lens coupling section and the lens unit so as to allow the light to be guided to the lens in the lens unit.

摘要翻译： 相机模块包括固态成像装置; 透镜单元，具有用于将光引导到固态成像装置的透镜; 用于保持固态成像装置的透镜保持器，所述透镜保持器包括用于调节透镜的位置的透镜联接部，使得透镜和固态成像装置之间的距离成为规定的聚焦距离; 以及用于覆盖透镜联接部和透镜单元的屏蔽帽，以允许光被引导到透镜单元中的透镜。

公开(公告)号：US20070105727A1

公开(公告)日：2007-05-10

申请号：US10580829

申请日：2004-11-25

申请人： Yoshihisa Doi ,  Masayoshi Sakakibara ,  Kenji Sakai ,  Koichi Goto ,  Hiroaki Yoshida ,  Shigekazu Ito

发明人： Yoshihisa Doi ,  Masayoshi Sakakibara ,  Kenji Sakai ,  Koichi Goto ,  Hiroaki Yoshida ,  Shigekazu Ito

IPC分类号： C01G39/06 ,  C10L1/18

CPC分类号： C10M173/02 ,  C10M2201/041 ,  C10M2201/0413 ,  C10M2201/066 ,  C10M2201/0663 ,  C10M2205/026 ,  C10M2207/02 ,  C10M2207/022 ,  C10M2217/028 ,  C10N2210/01 ,  C10N2220/021 ,  C10N2230/04 ,  C10N2230/06 ,  C10N2240/402 ,  C10N2240/405 ,  C10N2250/121 ,  C10M2209/086

摘要： The present invention provides an aqueous lubricant for plastic working which comprises (a) 10 to 40% by mass of a solid lubricating agent; (b) 2 to 20% by mass of an attaching agent having both lubricating and dispersing properties; (c) 2 to 20% by mass of an agent having both wetting characteristics and moisture evaporation-accelerating actions; and water. The use of this lubricant solves problems associated with conventional aqueous lubricants such that it has insufficient lubricating property and likewise permit the completion of a plurality of continuous plastic working steps, starting from a raw material and extending over a final product, without suspending a series of these plastic working steps in the middle thereof.

摘要翻译： 本发明提供一种塑料加工用水性润滑剂，其含有（a）10〜40质量％的固体润滑剂; （b）2〜20质量％具有润滑和分散性能的附着剂; （c）2〜20质量％的具有润湿特性和水分蒸发促进作用的试剂; 和水。 这种润滑剂的使用解决了与常规水性润滑剂相关的问题，使得其具有不足的润滑性能，并且同样允许从原料开始并在最终产品上延伸的多个连续塑料加工步骤，而不会悬浮一系列 这些塑料加工步骤在其中间。

公开(公告)号：US06679929B2

公开(公告)日：2004-01-20

申请号：US10046394

申请日：2002-01-16

申请人： Hiroshi Asano ,  Kenji Sakai ,  Katsuyoshi Ina

发明人： Hiroshi Asano ,  Kenji Sakai ,  Katsuyoshi Ina

IPC分类号： C09G102

CPC分类号： C09G1/02 ,  H01L21/3212

摘要： A polishing composition comprising the following components (a) to (g): (a) at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide and titanium oxide, (b) an aliphatic carboxylic acid, (c) at least one basic compound selected from the group consisting of an ammonium salt, an alkali metal salt, an alkaline earth metal salt, an organic amine compound and a quaternary ammonium salt, (d) at least one polishing accelerating compound selected from the group consisting of citric acid, oxalic acid, tartaric acid, glycine, &agr;-alanine and histidine, (e) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole and tolyltriazole, (f) hydrogen peroxide, and (g) water.

摘要翻译： 一种抛光组合物，其包含以下组分（a）至（g）：（a）至少一种选自二氧化硅，氧化铝，氧化铈，氧化锆和氧化钛的研磨剂，（b）脂族羧酸 ，（c）至少一种选自铵盐，碱金属盐，碱土金属盐，有机胺化合物和季铵盐的碱性化合物，（d）至少一种选择的研磨加速化合物 来自由柠檬酸，草酸，酒石酸，甘氨酸，α-丙氨酸和组氨酸组成的组，（e）至少一种选自苯并三唑，苯并咪唑，三唑，咪唑和甲苯基三唑的防腐剂，（f）过氧化氢 ，（g）水。

公开(公告)号：US06602615B2

公开(公告)日：2003-08-05

申请号：US10103764

申请日：2002-03-25

申请人： Kenji Sakai ,  Eisaku Inoue ,  Satoru Kurimoto ,  Koichi Yamamoto ,  Takayuki Shibayama

发明人： Kenji Sakai ,  Eisaku Inoue ,  Satoru Kurimoto ,  Koichi Yamamoto ,  Takayuki Shibayama

IPC分类号： B32B1520

CPC分类号： B22F7/008 ,  B22F2998/00 ,  B32B15/013 ,  C22C9/00 ,  C22C9/02 ,  F16C33/121 ,  F16C2204/12 ,  F16C2204/18 ,  Y10S428/926 ,  Y10T428/12014 ,  Y10T428/12917 ,  Y10T428/12924 ,  B22F7/04

摘要： Disclosed is a composite sliding material having a steel plate and a sintered copper alloy layer which is bonded to the steel plate. The copper alloy contains, 1.5 to 15 mass % Sn, 1.5 to 15 mass % Bi, 1.5 to 20 volume % of a solid lubricant, and balance of Cu and incidental impurities. The volume ratio of Bi to the solid lubricant is in a range of 0.5 to 2.0. Bi and the solid lubricant improves the copper alloy in sintering property, since Bi melts when sintering because of a low melting point resulting in improved sintering property, and the solid lubricant ensures good anti-seizure property, and deterioration of mechanical strength is prevented by virtue of a phenomenon that the solid lubricant is entrained in Bi.

摘要翻译： 公开了一种复合滑动材料，其具有与钢板接合的钢板和烧结铜合金层。 铜合金含有1.5〜15质量％的Sn，1.5〜15质量％的Bi，1.5〜20体积％的固体润滑剂，余量的Cu和附带的杂质。 Bi与固体润滑剂的体积比在0.5至2.0的范围内。 Bi和固体润滑剂改善了铜合金的烧结性能，因为Bi由于熔点低而烧结而熔化，从而提高了烧结性能，固体润滑剂确保了良好的抗咬合性能，并且凭借其防止机械强度的劣化 固体润滑剂夹带在Bi中的现象。

公开(公告)号：US06582269B2

公开(公告)日：2003-06-24

申请号：US09905975

申请日：2001-07-17

申请人： Kenji Sakai ,  Sumio Hashimoto ,  Hisao Hosoya ,  Masaaki Komiya

发明人： Kenji Sakai ,  Sumio Hashimoto ,  Hisao Hosoya ,  Masaaki Komiya

IPC分类号： H01J900

CPC分类号： H01J5/54

摘要： A lamp apparatus comprises a lamp body, a base mounted to the lamp body, the base including a top end of base connected with a first conductor electrically and a threaded portion connected with a second conductor electrically, the top end of base and the first conductor welded through the process of mutual fusion, and a welded portion formed in a convex shape with the mixture of materials of the top end of base and the first conductor.

公开(公告)号：US06565619B1

公开(公告)日：2003-05-20

申请号：US10263846

申请日：2002-10-04

申请人： Hiroshi Asano ,  Kenji Sakai ,  Katsuyoshi Ina

发明人： Hiroshi Asano ,  Kenji Sakai ,  Katsuyoshi Ina

IPC分类号： C09K314

CPC分类号： C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/3212

摘要： A polishing composition comprising: (a) colloidal silica having a positively charged surface, (b) colloidal silica having a negatively charged surface, (c) at least one acid selected from the group consisting of nitric acid, hydrochloric acid, sulfuric acid, lactic acid, acetic acid, oxalic acid, citric acid, malic acid, succinic acid, butyric acid and malonic acid, (d) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole, tolyltriazole and their derivatives, and (e) water.

摘要翻译： 1.一种抛光组合物，其特征在于，具有：（a）具有带正电荷的表面的胶体二氧化硅，（b）具有带负电荷的表面的胶体二氧化硅，（c）至少一种选自硝酸，盐酸，硫酸，乳酸 酸，乙酸，草酸，柠檬酸，苹果酸，琥珀酸，丁酸和丙二酸，（d）至少一种选自苯并三唑，苯并咪唑，三唑，咪唑，甲苯基三唑及其衍生物的防腐剂，以及 （e）水。

公开(公告)号：US06334914B1

公开(公告)日：2002-01-01

申请号：US09749442

申请日：2000-12-28

申请人： Kenji Sakai ,  Naohisa Kawakami ,  Satoru Kurimoto ,  Takashi Inaba ,  Koichi Yamamoto ,  Takayuki Shibayama

发明人： Kenji Sakai ,  Naohisa Kawakami ,  Satoru Kurimoto ,  Takashi Inaba ,  Koichi Yamamoto ,  Takayuki Shibayama

IPC分类号： C22C902

摘要： Disclosed is a copper alloy sliding material comprising 0.5 to 15 mass % Sn and 0.1 to 10 vol % of hard particles consisting of one or more selected from WC, W2C and Mo2C. The hard particles have preferably an average particle size of 0.1 to 10 &mgr;m, whereby they are dispersed in the copper alloy matrix so as to make the sliding-contact surface uneven, from which the hard particles protrude partially. The sliding material comprises an amount or a total amount of not more than 40 mass % of one or more selected from Ni, Ag, Fe, Al, Zn, Mn, Co, Si and P, an amount or a total amount of not more than 10 mass % of Bi and/or Pb, and/or an amount or a total amount of not more than 10 vol % of a solid lubricant comprising BN, graphite, MoS2 and/or WS2.

公开(公告)号：US6059636A

公开(公告)日：2000-05-09

申请号：US112287

申请日：1998-07-09

申请人： Takao Inaba ,  Minoru Numoto ,  Kenji Sakai ,  Manabu Satoh

发明人： Takao Inaba ,  Minoru Numoto ,  Kenji Sakai ,  Manabu Satoh

IPC分类号： B24B37/04 ,  B24B37/005 ,  B24B49/02 ,  B24B49/04 ,  B24B49/06 ,  H01L21/304 ,  B24B49/00

CPC分类号： B24B37/013 ,  B24B37/005 ,  B24B49/04 ,  B24B49/06

摘要： Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.

公开(公告)号：US5876272A

公开(公告)日：1999-03-02

申请号：US885870

申请日：1997-06-30

申请人： Takao Inaba ,  Masaaki Oguri ,  Kenji Sakai

发明人： Takao Inaba ,  Masaaki Oguri ,  Kenji Sakai

IPC分类号： B24B1/00 ,  B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  H01L21/304 ,  B24B5/00 ,  B24B29/00

CPC分类号： H01L21/02024 ,  B24B37/30

摘要： A wafer mount plate is inserted loosely into a housing, and the wafer mount plate is supported in such a manner as to be swingable and movable vertically and horizontally with respect to a polishing pad. An air chamber is formed between the wafer mount plate and the housing. By controlling the internal pressure of the air chamber, it is possible to control polishing pressure applied on the wafer mount plate. Since the entire top side of the wafer mount plate can be uniformly pressured, the uniform polishing pressure can be applied on the entire surface of the semiconductor wafer. Further, the wafer mount plate inclines in accordance with variations in the inclination of the polishing pad so that the semiconductor wafer and the polishing pad can be maintained in a parallel position.

摘要翻译： 晶片安装板松散地插入壳体中，并且晶片安装板以相对于抛光垫可摆动和垂直和水平移动的方式被支撑。 在晶片安装板和壳体之间形成空气室。 通过控制空气室的内部压力，可以控制施加在晶片安装板上的抛光压力。 由于晶片安装板的整个顶侧能够被均匀地加压，所以可以在半导体晶片的整个表面上施加均匀的抛光压力。 此外，晶片安装板根据抛光垫的倾斜度的变化而倾斜，使得半导体晶片和抛光垫可以保持在平行位置。