摘要:
A semiconductor device, a thin film transistor, and a method for producing the same capable of decreasing the management cost, and capable of decreasing the production steps to reduce the production cost are proposed. A method for producing a thin film transistor 2 provided with a semiconductor which is composed of a prescribed material and serves as an active layer 41 and a conductor which is composed of a material having the same composition as that of the prescribed material and serves as at least one of a source electrode 51, a drain electrode 53 and a pixel electrode 55, which includes the steps of simultaneously forming into a film an object to be processed and a conductor (a source electrode 51, a source wire 52, a drain electrode 53, a drain wire 54 and a pixel electrode 55) which are composed of the amorphous prescribed material, followed by simultaneous shaping, and crystallizing the object to be processed which has been shaped to allow it to be the active layer 41.
摘要:
To provide a method for producing a thin film transistor improved in stability, uniformity, reproducibility, heat resistance, durability or the like, a thin film transistor, a thin film transistor substrate, an image display apparatus, an image display apparatus and a semiconductor device.In the semiconductor device, a crystalline oxide is used as an N-type transistor and the electron carrier concentration of the crystalline oxide is less than 2×1017/cm3. Furthermore, the crystalline oxide is a polycrystalline oxide containing In and one or more positive divalent elements selected from Zn, Mg, Cu, Ni, Co and Ca, and the atomic ratio In [In] and the positive divalent element [X][X]/([X]+[In]) is 0.0001 to 0.13.
摘要:
To provide a field-effect transistor improved in transparency, electrical properties, stability, uniformity, reproducibility, heat resistance and durability, and as a reduced overlap capacity between electrodes.A field-effect thin film transistor 1001 includes a gate electrode 1025, an active layer, a source electrode 1022 and a drain electrode 1023, wherein a crystalline oxide 1021 containing indium and having an electron carrier concentration of less than 1018/cm3 is used as the active layer, and the gate electrode 1025 is in self-alignment with the source electrode 1022 and the drain electrode 1023. The crystalline oxide 1021 contains a positive trivalent element different from a positive divalent element or indium.
摘要:
A sputtering target including indium (In), tin (Sn) and zinc (Zn) and an oxide including one or more elements X selected from the following group X, the atomic ratio of the elements satisfying the following formulas (1) to (4): Group X: Mg, Si, Al, Sc, Ti, Y, Zr, Hf, Ta, La, Nd, Sm 0.10≦In/(In+Sn+Zn)≦0.85 (1) 0.01≦Sn/(In+Sn+Zn)≦0.40 (2) 0.10≦Zn/(In+Sn+Zn)≦0.70 (3) 0.70≦In/(In+X)≦0.99 (4)
摘要翻译:包括铟(In),锡(Sn)和锌(Zn)的溅射靶和包含选自下列X族的一种或多种元素X的氧化物,满足下式(1)至(4)的元素的原子比 ):组X:Mg,Si,Al,Sc,Ti,Y,Zr,Hf,Ta,La,Nd,Sm 0.10≦̸ In /(In + Sn + Zn)≦̸ 0.85(1)0.01& /(In + Sn+Zn)≤nlE;0.40(2)0.10≦̸ Zn /(In + Sn + Zn)≦̸ 0.70(3)0.70< In /(In + X)≦̸ 0.99(4)
摘要:
An oxide sintered body including indium element (In), gallium element (Ga) and tin element (Sn) in atomic ratios represented by the following formulas (1) to (3): 0.10≦In/(In+Ga+Sn)≦0.60 (1) 0.10≦Ga/(In+Ga+Sn)≦0.55 (2) 0.0001
摘要翻译:包含由下式(1)〜(3)表示的原子比的铟元素(In),镓元素(Ga)和锡元素(Sn)的氧化物烧结体:0.10≦̸ In /(In + Ga + Sn) ≦̸ 0.60(1)0.10≦̸ Ga /(In + Ga + Sn)≦̸ 0.55(2)0.0001
摘要:
A sputtering target including indium (In), tin (Sn) and zinc (Zn) and an oxide including one or more elements X selected from the following group X, the atomic ratio of the elements satisfying the following formulas (1) to (4): Group X: Mg, Si, Al, Sc, Ti, Y, Zr, Hf, Ta, La, Nd, Sm 0.10≦In/(In+Sn+Zn)≦0.85 (1) 0.01≦Sn/(In+Sn+Zn)≦0.40 (2) 0.10≦Zn/(In+Sn+Zn)≦0.70 (3) 0.70≦In/(In+X)≦0.99 (4).
摘要翻译:包括铟(In),锡(Sn)和锌(Zn)的溅射靶和包含选自下列X族的一种或多种元素X的氧化物,满足下式(1)至(4)的元素的原子比 ):组X:Mg,Si,Al,Sc,Ti,Y,Zr,Hf,Ta,La,Nd,Sm 0.10≦̸ In /(In + Sn + Zn)≦̸ 0.85(1)0.01& /(In+Sn+Zn)≦̸0.40(2)0.10≦̸ Zn /(In + Sn + Zn)≦̸ 0.70(3)0.70< In /(In + X)≦̸ 0.99(4)。
摘要:
An oxide sintered body including indium element (In), gallium element (Ga) and tin element (Sn) in atomic ratios represented by the following formulas (1) to (3): 0.10≦In/(In+Ga+Sn)≦0.60 (1) 0.10≦Ga/(In+Ga+Sn)≦0.55 (2) 0.0001
摘要翻译:包含由下式(1)〜(3)表示的原子比的铟元素(In),镓元素(Ga)和锡元素(Sn)的氧化物烧结体:0.10≦̸ In /(In + Ga + Sn) ≦̸ 0.60(1)0.10≦̸ Ga /(In + Ga + Sn)≦̸ 0.55(2)0.0001
摘要:
A sputtering target including indium (In) and zinc (Zn) and an oxide including one or more elements X selected from the following group X, the atomic ratio of the elements satisfying the following formulas (1) and (2): Group X: Mg, Si, Al, Sc, Ti, Y, Zr, Hf, Ta, La, Nd, Sm 0.30≦In/(In+Zn)≦0.90 (1) 0.70≦In/(In+X)≦0.99 (2).
摘要翻译:包含铟(In)和锌(Zn)的溅射靶和包含选自以下X组的一种或多种元素X的氧化物,满足下式(1)和(2)的元素的原子比:组X: Mg,Si,Al,Sc,Ti,Y,Zr,Hf,Ta,La,Nd,Sm 0.30和nlE; In /(In + Zn)≦̸ 0.90(1)0.70和nlE; In /(In + X) ; 0.99(2)。
摘要:
A sputtering target including an oxide A and InGaZnO4, the oxide A having a diffraction peak in regions A to K at 2θ=7.0° to 8.4°, 30.6° to 32.0°, 33.8° to 35.8°, 53.5° to 56.5°, 56.5° to 59.5°, 14.8° to 16.2°, 22.3° to 24.3°, 32.2° to 34.2°, 43.1° to 46.1°, 46.2° to 49.2°, and 62.7° to 66.7°.
摘要:
A sputtering target including an oxide A and InGaZnO4, the oxide A having a diffraction peak in regions A to K at 2θ=7.0° to 8.4°, 30.6° to 32.0°, 33.8° to 35.8°, 53.5° to 56.5°, 56.5° to 59.5°, 14.8° to 16.2°, 22.3° to 24.3°, 32.2° to 34.2°, 43.1° to 46.1°, 46.2° to 49.2°, and 62.7° to 66.7°.