公开(公告)号：US20090149045A1

公开(公告)日：2009-06-11

申请号：US11999434

申请日：2007-12-05

Applicant: Kuan-Yu Chen ,  Chong Yi ,  Jia-Yong He

Inventor： Kuan-Yu Chen ,  Chong Yi ,  Jia-Yong He

IPC: H01R13/648

CPC classification number: H01R13/6471 ,  H01R13/6589 ,  H01R24/64

Abstract: An electrical connector includes an insulative housing, a plurality of first and second contacts retained in the insulative housing and a metallic ground. Each first contact comprises a first contact portion and a first mounting portion. Each second contact comprises a second contact portion and a second mounting portion. The first and second mounting portions are respectively arranged in first and second rows. The second contacts comprise a grounding contact. The ground piece comprises an elastic contact beam for abutting against the grounding contact so that the surface of the grounding contact is expanded. As a result, cross-talk occurred between the contacts can be decreased.

Abstract translation: 电连接器包括绝缘壳体，保持在绝缘壳体中的多个第一和第二触点和金属接地。 每个第一接触包括第一接触部分和第一安装部分。 每个第二接触件包括第二接触部分和第二安装部分。 第一和第二安装部分分别设置在第一和第二行中。 第二触点包括接地触点。 接地片包括用于抵靠接地触头的弹性接触梁，使得接地触头的表面膨胀。 结果，可以减少触点之间的串扰。

公开(公告)号：US20090130906A1

公开(公告)日：2009-05-21

申请号：US11985676

申请日：2007-11-16

Applicant: Pei Tsao ,  Chong Yi ,  Kuan-Yu Chen ,  Gary E. Biddle

Inventor： Pei Tsao ,  Chong Yi ,  Kuan-Yu Chen ,  Gary E. Biddle

IPC: H01R24/00

CPC classification number: H01R13/58

Abstract: An electrical connector (100) includes an insulative housing (2) extending in a front-to-back direction, a conductive shell (7) enclosing the insulative housing and cooperating with the insulative housing to define a receiving cavity (101) adapted for receiving a complementary connector, a first set of contacts (3) held in the insulative housing for transmitting a first kind of signals, a second set of contacts (4) held in the insulative housing and comprising two pairs of differential contacts (41) respectively for transmitting and receiving a second kind of signals and a grounding contact (42), a first set of wires (51) and a second set of wires (52). Each first contact includes a contacting section (36) exposed in the receiving cavity and a tail section (35) extending rearward from the contacting section. Each of the second set of contacts includes a contacting section (43) exposed in the receiving cavity and a tail section (45) extending rearward form the contacting section. The first set of wires are aligned in one row and have inner conductors (510) electrically connecting with the tail sections of the first set of contacts. The second set of wires are aligned in one row and include a pair of differential pairs (521) electrically connecting with the two pairs of differential contacts for transmitting and receiving the second kind of signals and at least one grounding conductor (522) electrically connecting with the grounding contact.

Abstract translation: 电连接器（100）包括在前后方向延伸的绝缘壳体（2），包围绝缘壳体的导电壳体（7），并与绝缘壳体配合以限定适于接纳的接收腔 互补连接器，保持在绝缘壳体中用于传输第一种信号的第一组触点（3），保持在绝缘壳体中的第二组触点（4），分别包括两对差动触点（41），用于 发送和接收第二类信号和接地触点（42），第一组电线（51）和第二组电线（52）。 每个第一接触包括暴露在接收腔中的接触部分（36）和从接触部分向后延伸的尾部（35）。 第二组触点中的每一个包括暴露在接收腔中的接触部分（43）和从接触部分向后延伸的尾部（45）。 第一组电线排列成一列，并且具有与第一组触点的尾部部分电连接的内部导体（510）。 第二组线对齐在一排中，并且包括一对与两对差动触点电连接的差分对（521），用于传输和接收第二种信号，以及至少一个接地导体（522）与 接地接点。

公开(公告)号：US20080285196A1

公开(公告)日：2008-11-20

申请号：US11934767

申请日：2007-11-03

Applicant: Wen-Ching Hsiung ,  Jeng-Dau Chang ,  Chia-Liang Lai ,  Kuan-Yu Chen

Inventor： Wen-Ching Hsiung ,  Jeng-Dau Chang ,  Chia-Liang Lai ,  Kuan-Yu Chen

IPC: H02H9/04 ,  H02H3/20

CPC classification number: H03K17/223 ,  H03K17/08 ,  H03K17/18 ,  H03K19/00315 ,  H03K2217/0018 ,  H03K2217/96054

Abstract: Over-voltage indicator and related circuit and method. The over-voltage indicator can work with an I/O circuit of a chip for detecting over-voltage in an I/O pad and providing an indication signal accordingly. When over-voltage does not happen, the over-voltage indicator continues to detect a signal level of the I/O pad and keeps the indication signal low. Once over-voltage is detected, the over-voltage indicator pauses detecting, asserts a high level in the indication signal, and periodically resumes detecting until end of over-voltage is detected. With informing provided by the indication signal, a core cell of the chip can perform proper operation to reduce potential damage caused by over-voltage.

Abstract translation: 过电压指示器及相关电路及方法。 过电压指示器可以与芯片的I / O电路一起工作，用于检测I / O焊盘中的过电压并相应地提供指示信号。 当不发生过电压时，过电压指示器继续检测I / O焊盘的信号电平，并保持指示信号为低电平。 一旦检测到过电压，则过电压指示器暂停检测，在指示信号中置高电平，并且周期性地恢复检测直到检测到过电压结束。 通过指示信号提供的通知，芯片的核心单元可以执行正常的操作，以减少由过电压引起的潜在损害。

公开(公告)号：US20080246057A1

公开(公告)日：2008-10-09

申请号：US11732889

申请日：2007-04-05

Applicant: Hsien-Hsin Lin ,  Weng Chang ,  Chien-Chang Su ,  Kuan-Yu Chen ,  Hsueh-Chang Sung ,  Ming-Hua Yu

Inventor： Hsien-Hsin Lin ,  Weng Chang ,  Chien-Chang Su ,  Kuan-Yu Chen ,  Hsueh-Chang Sung ,  Ming-Hua Yu

IPC: H01L29/78

CPC classification number: H01L29/66477 ,  H01L21/02532 ,  H01L29/165 ,  H01L29/665 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7848

Abstract: A composite semiconductor structure and method of forming the same are provided. The composite semiconductor structure includes a first silicon-containing compound layer comprising an element selected from the group consisting essentially of germanium and carbon; a silicon layer on the first silicon-containing compound layer, wherein the silicon layer comprises substantially pure silicon; and a second silicon-containing compound layer comprising the element on the silicon layer. The first and the second silicon-containing compound layers have substantially lower silicon concentrations than the silicon layer. The composite semiconductor structure may be formed as source/drain regions of metal-oxide-semiconductor (MOS) devices.

Abstract translation: 提供一种复合半导体结构及其形成方法。 复合半导体结构包括第一含硅化合物层，其包含选自基本上由锗和碳组成的组的元素; 所述第一含硅化合物层上的硅层，其中所述硅层包含基本上纯的硅; 以及在所述硅层上包含所述元素的第二含硅化合物层。 第一和第二含硅化合物层具有比硅层低的硅浓度。 复合半导体结构可以形成为金属氧化物半导体（MOS）器件的源极/漏极区域。

公开(公告)号：US20080100540A1

公开(公告)日：2008-05-01

申请号：US11750317

申请日：2007-05-17

Applicant: Shi-Hao Li ,  Ching-Ian Chao ,  Jiun-Haw Lee ,  Mao-Kuo Wei ,  Hoang-Yan Lin ,  Kuan-Yu Chen ,  Yu-Hsuan Ho ,  Sheng-Chih Hsu

Inventor： Shi-Hao Li ,  Ching-Ian Chao ,  Jiun-Haw Lee ,  Mao-Kuo Wei ,  Hoang-Yan Lin ,  Kuan-Yu Chen ,  Yu-Hsuan Ho ,  Sheng-Chih Hsu

IPC: G09G3/30

CPC classification number: H01L51/5275

Abstract: An electroluminescent display includes an electroluminescent panel, and at least one brightness enhanced film. The electroluminescent panel has a plurality of sub-pixels, and at least one illumination surface. The brightness enhanced film is disposed on the at least one illumination surface. The brightness enhanced film has a plurality of micro lenses, and the width of the micro lens is smaller than half of the minimum width of the sub-pixels.

Abstract translation: 电致发光显示器包括电致发光面板和至少一个亮度增强膜。 电致发光面板具有多个子像素和至少一个照明面。 亮度增强膜设置在至少一个照明面上。 亮度增强膜具有多个微透镜，微透镜的宽度小于子像素的最小宽度的一半。

公开(公告)号：US20070157187A1

公开(公告)日：2007-07-05

申请号：US11471483

申请日：2006-06-21

Applicant: Fu-Chiung Cheng ,  Shin-Hway Yu ,  Kuan-Yu Chen ,  Jian-Yi Chen ,  Ming-Shiou Chiang ,  Shu-Ming Chang ,  Hung-Chi Wu ,  Ping-Yun Wang

Inventor： Fu-Chiung Cheng ,  Shin-Hway Yu ,  Kuan-Yu Chen ,  Jian-Yi Chen ,  Ming-Shiou Chiang ,  Shu-Ming Chang ,  Hung-Chi Wu ,  Ping-Yun Wang

IPC: G06F9/45 ,  G06F9/44

CPC classification number: G06F8/10 ,  G06F17/5045

Abstract: A process of automatically translating an extended activity diagram (EAD) into a hardware component graph (HCG). For translating the high level programming language into a Very High Speed Integrated Circuit Hardware Description Language (VHDL), the high level programming language is first translated into an activity diagram (AD), then the AD is translated into an HCG, which can indicate a connection relation between hardware components, and finally corresponding HDL codes are generated according to the HCG

Abstract translation: 将扩展活动图（EAD）自动翻译成硬件组件图（HCG）的过程。 为了将高级编程语言转换为超高速集成电路硬件描述语言（VHDL），首先将高级编程语言转换为活动图（AD），然后将AD转换为HCG，其可以指示 硬件组件之间的连接关系，最后根据HCG生成相应的HDL代码

公开(公告)号：US20060197872A1

公开(公告)日：2006-09-07

申请号：US11255437

申请日：2005-10-19

Applicant: Kuan-Yu Chen ,  Yao-Chen Huang ,  Wei-Chen Shen

Inventor： Kuan-Yu Chen ,  Yao-Chen Huang ,  Wei-Chen Shen

IPC: H03M1/12

CPC classification number: H03M1/1028 ,  H03M1/1295 ,  H03M1/18

Abstract: A method for processing a video signal and a method for calibrating signal processing apparatuses are disclosed. The method for video signal process comprises the following steps. First, an analog video signal having a sync pulse is provided. Then, a peak level of the sync pulse is detected, and a signal transfer gain is determined based on the peak level of the sync pulse. Finally, the analog video signal is converted into a digital signal according to the signal transfer gain.

Abstract translation: 公开了一种用于处理视频信号的方法和用于校准信号处理装置的方法。 视频信号处理方法包括以下步骤。 首先，提供具有同步脉冲的模拟视频信号。 然后，检测同步脉冲的峰值电平，并且基于同步脉冲的峰值电平来确定信号传递增益。 最后，根据信号传递增益将模拟视频信号转换为数字信号。

公开(公告)号：US12250769B2

公开(公告)日：2025-03-11

申请号：US17842796

申请日：2022-06-17

Applicant: Kuan-Yu Chen ,  Hsiao-Lung Lin

Inventor： Kuan-Yu Chen ,  Hsiao-Lung Lin

IPC: H05K1/11 ,  H05K1/05 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

Abstract: A circuit board includes a metal substrate, a resin layer, an insulating layer, and a first conductive structure. The metal substrate has a first through hole, and the first through hole has a first width. A portion of the resin layer is disposed in the first through hole. The resin layer has a second through hole. The second through hole has a second width. The insulating layer is disposed on at least one surface of the metal substrate, and a portion of the insulating layer contacts the resin layer. The first conductive structure is disposed in the second through hole. The first conductive structure penetrates through the metal substrate. The first width is greater than the second width. A manufacturing method of the circuit board is also provided.

公开(公告)号：US11670668B2

公开(公告)日：2023-06-06

申请号：US17199445

申请日：2021-03-12

Applicant: Kuan-Yu Chen ,  Hsiao-Lung Lin ,  Hao-Hsiang Huang

Inventor： Kuan-Yu Chen ,  Hsiao-Lung Lin ,  Hao-Hsiang Huang

IPC: H01L27/15 ,  H01L33/56 ,  H01L33/54

CPC classification number: H01L27/156 ,  H01L33/54 ,  H01L33/56

Abstract: A light-emitting device including a substrate, an insulating layer, an inner circuit structure, a plurality of light-emitting elements, an insulating encapsulation layer, and a transparent conductive layer is provided. The insulating layer is disposed on the substrate. The inner circuit structure is disposed on the insulating layer. The light-emitting elements are correspondingly disposed on the inner circuit structure. The insulating encapsulation layer is disposed on the inner circuit structure. The insulating encapsulating layer covers a portion of the inner circuit structure and encapsulates the light-emitting elements. The transparent conductive layer is disposed on the insulating encapsulating layer. The transparent conductive layer electrically connects the light-emitting elements, and serially connects the light-emitting elements.

公开(公告)号：US20230054463A1

公开(公告)日：2023-02-23

申请号：US17405043

申请日：2021-08-18

Applicant: Kuan-Wei Chen ,  Kuan-Yu Chen

Inventor： Kuan-Wei Chen ,  Kuan-Yu Chen

IPC: B24C11/00 ,  B24C1/04 ,  B24C3/32 ,  B24C5/06 ,  B24C5/08

Abstract: A cutting method by applying a particle beam of metallic glass onto a substrate to cut or partially cut the substrate with high production efficiency, low production cost and better environmental protection.