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公开(公告)号:US20240111130A1
公开(公告)日:2024-04-04
申请号:US18264682
申请日:2022-02-09
Applicant: LG INNOTEK CO., LTD.
Inventor: Chang Gyun SON , Ki Cheol KIM , Jun Young LIM
CPC classification number: G02B13/0035 , B60R11/04 , G02B1/041 , G02B3/00 , G02B9/12 , H04N23/12 , H04N23/55 , G02B2003/0093
Abstract: An optical system according to an embodiment includes first to third lenses disposed along an optical axis from an object side to a sensor side direction, wherein the first lens has a meniscus shape convex toward the object side, and satisfies 1.7≤nt_1≤2.3 and TTL≤6 mm.
(nt_1 is the refractive index of the first lens with respect to the light of the t-line wavelength band, and TTL is the distance on the optical axis from the object-side surface of the first lens to the upper surface of the image sensor.)-
公开(公告)号:US20200243452A1
公开(公告)日:2020-07-30
申请号:US16756552
申请日:2018-10-25
Applicant: LG INNOTEK CO., LTD.
Inventor: Jun Young LIM , Hyung Kyu YOON , Sung Min CHAE
IPC: H01L23/538 , H01L23/498 , H01L25/16 , H01L25/18 , H01L23/00
Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
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公开(公告)号:US20180027651A1
公开(公告)日:2018-01-25
申请号:US15657296
申请日:2017-07-24
Applicant: LG INNOTEK CO., LTD.
Inventor: Jun Young LIM , Woong Sik KIM , Hyung Kyu YOON , Min Hwan KIM
CPC classification number: H05K1/0281 , H01L21/481 , H01L21/4821 , H01L23/4985 , H01L24/16 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H05K1/0271 , H05K1/144 , H05K1/189 , H05K3/18 , H05K3/28 , H05K2201/055 , H05K2201/10128
Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
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24.
公开(公告)号:US20140151093A1
公开(公告)日:2014-06-05
申请号:US14175137
申请日:2014-02-07
Applicant: LG INNOTEK CO., LTD.
Inventor: Tae Ki HONG , Jun Young LIM , Ki Tae PARK , Sang Ki CHO , Dae Sung YOO , Han Mo KOO
IPC: H05K1/02
CPC classification number: H05K1/028 , H01L23/4985 , H01L24/50 , H01L2924/01029 , H01L2924/14
Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.
Abstract translation: 本发明涉及一种制造TAB龙头的方法。 该方法包括在基膜上形成具有输入/输出端子图案的电路图案区域,并且在具有用于露出基底膜的链轮孔的输送区域处形成曝光区域。 因此,本发明提供一种TAB带,其通过基本上防止金属颗粒的产生而形成暴露区域,从而通过选择性地蚀刻和去除在 TAB带,并且具有链轮孔,并且通过在不具有通过蚀刻形成在其上的电路图案的预定区域部分地去除基底膜来防止短路。
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