公开(公告)号：US11373957B2

公开(公告)日：2022-06-28

申请号：US16994764

申请日：2020-08-17

Applicant: MEDIATEK Inc.

Inventor： Wen-Sung Hsu ,  Tao Cheng ,  Nan-Cheng Chen ,  Che-Ya Chou ,  Wen-Chou Wu ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Wei-Hsiu Hsu

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L23/66 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H01L25/00 ,  H01Q1/22 ,  H01Q9/04 ,  H01L23/14 ,  H01L23/00 ,  H01Q21/06

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US20210302467A1

公开(公告)日：2021-09-30

申请号：US17211738

申请日：2021-03-24

Applicant: MEDIATEK INC.

Inventor： Sheng-Wei Lei ,  Chang-Lin Wei ,  Ying-Chou Shih ,  Yeh-Chun Kao ,  Yen-Ju Lu ,  Po-Sen Tseng

IPC: G01R1/04 ,  H04B17/29

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

公开(公告)号：US10916854B2

公开(公告)日：2021-02-09

申请号：US16293661

申请日：2019-03-06

Applicant: MEDIATEK INC.

Inventor： Jiunn-Nan Hwang ,  Yi-Chieh Lin ,  Yen-Ju Lu ,  Shih-Chia Chiu ,  Wen-Chou Wu

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q19/10 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q11/04 ,  H01Q19/00 ,  H01L23/498 ,  H01L23/66 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H01L23/00 ,  H05K1/03

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

公开(公告)号：US10700410B2

公开(公告)日：2020-06-30

申请号：US16145108

申请日：2018-09-27

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Wen-Chou Wu

IPC: H01L23/34 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q21/12 ,  H01Q9/26 ,  H01Q21/06 ,  H01L23/28 ,  H01L23/528 ,  H01L23/64 ,  H01L23/66

Abstract: An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.

公开(公告)号：US20180069307A1

公开(公告)日：2018-03-08

申请号：US15685885

申请日：2017-08-24

Applicant: MediaTek Inc.

Inventor： Yen-Ju Lu ,  Yi-Chieh Lin ,  Wen-Chou Wu

IPC: H01Q1/52 ,  H01Q1/38 ,  H01Q21/24 ,  H01Q21/08 ,  H01Q21/06 ,  H01Q5/30

CPC classification number: H01Q1/523 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/525 ,  H01Q5/30 ,  H01Q5/378 ,  H01Q21/062 ,  H01Q21/08 ,  H01Q21/24

Abstract: A Radio Frequency (RF) device may include a plurality of antennas and one or more conductive traces configured to trap a portion of energy transmitted from at least one of the plurality of antennas. The one or more conductive traces are sized and positioned such that undesired coupling between the plurality of antennas may be suppressed while maintaining performance parameters of at least one of the plurality of antennas. The plurality of antennas and the one or more conductive traces may be formed using a redistribution layer coupled to a chip embedded in a molding layer.

公开(公告)号：US20240079787A1

公开(公告)日：2024-03-07

申请号：US18233335

申请日：2023-08-14

Applicant: MEDIATEK INC.

Inventor： Debapratim Dhara ,  Shih-Chia Chiu ,  Yen-Ju Lu ,  Sheng-Mou Lin

IPC: H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q9/045 ,  H01Q1/48

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.

公开(公告)号：US11848481B2

公开(公告)日：2023-12-19

申请号：US17713105

申请日：2022-04-04

Applicant: MediaTek Inc.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01Q21/06 ,  H01L23/14 ,  H01Q15/00 ,  H01Q19/06 ,  H01Q15/10

CPC classification number: H01Q1/2283 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/66 ,  H01Q15/0013 ,  H01Q15/10 ,  H01Q19/062 ,  H01Q21/065 ,  H01L2223/6677 ,  H01L2224/02379 ,  H01L2224/02381

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US11322823B2

公开(公告)日：2022-05-03

申请号：US16120446

申请日：2018-09-03

Applicant: MEDIATEK INC.

Inventor： Shih-Chia Chiu ,  Yen-Ju Lu ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01Q21/06 ,  H01L23/14 ,  H01Q15/00 ,  H01Q19/06 ,  H01Q15/10

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

公开(公告)号：US20220026552A1

公开(公告)日：2022-01-27

申请号：US17495769

申请日：2021-10-06

Applicant: MediaTek Inc.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu

IPC: G01S13/02 ,  H01Q15/14 ,  G01S7/03 ,  H01Q1/38 ,  H01Q1/32 ,  H01Q1/52 ,  G01S13/931 ,  H01Q1/22 ,  H01Q17/00 ,  H01L23/12 ,  H01L23/28 ,  H01Q1/24 ,  H05K1/02

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

公开(公告)号：US11169250B2

公开(公告)日：2021-11-09

申请号：US16143470

申请日：2018-09-27

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu

IPC: G01S13/02 ,  H01Q15/14 ,  G01S7/03 ,  H01Q1/38 ,  H01Q1/32 ,  H01Q1/52 ,  G01S13/931 ,  H01Q1/22 ,  H01Q17/00 ,  H01L23/12 ,  H01L23/28 ,  H01Q1/24 ,  H05K1/02 ,  G01S7/02

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.