Abstract:
Techniques for providing temperature trim codes to multiple reference circuits of an integrated circuit are provided. In an example, a string of primary latch circuits can provide a set of pre-defined temperature trim codes to a multiplexer in response to a token of a series of tokens. The multiplexer can provide two trim of the trim codes to an interpolator based on a temperature reading of the integrated circuit. The interpolator can provide an interpolated trim code and the trim code can be distributed to a reference circuit based on the token.
Abstract:
Error correction procedures for a memory device including a memory die having an array of memory cells including a plurality of banks are described. The memory die includes a first error correcting code (ECC) circuit coupled with a first bank of memory cells, where the first ECC circuit is configured to perform operations associated with a first access operation (e.g., write operation) of the first bank of memory cells. The memory die further includes a second ECC circuit coupled with the first bank of memory cells, where the second ECC circuit is configured to perform ECC operations associated with a second access operation (e.g., read operation) of the first bank. In some cases, the first ECC circuit is located under the footprint of the array and the second ECC circuit is located outside the footprint of the array.
Abstract:
Embodiments relate to improving the biasing of active electronic components such as, for example, sense amplifiers. Embodiments include an adjustable bias signal generator that receives a reference signal as an input and generates a corresponding bias signal as an output. The adjustable bias signal generator may comprise a voltage driver and capacitor divider circuitry. In some embodiments, the capacitor divider circuitry is configurable by selecting specific capacitor dividers using a digital code. In other embodiments, the voltage driver is adjustable by applying different trim settings to tune the output of the voltage driver. The voltage driver may be temperature compensated by multiplexing different trim settings that correspond to different temperatures.
Abstract:
Some instances of a memory device include a memory die having an array of memory cells including a plurality of banks. In some cases, the memory die further includes a first error correcting code (ECC) circuit coupled with a first bank of memory cells, where the first ECC circuit is configured to perform operations associated with a first access operation (e.g., write operation) of the first bank of memory cells. In some examples, the memory die further includes a second ECC circuit coupled with the first bank of memory cells, where the second ECC circuit is configured to perform ECC operations associated with a second access operation (e.g., read operation) of the first bank. In some cases, the first ECC circuit is located under the footprint of the array and the second ECC circuit is located outside the footprint of the array.
Abstract:
Methods, systems, and devices for error correction on a memory device are described. Examples may include a memory die having an array of memory cells including a plurality of banks. The memory die may further include a first error correcting code (ECC) circuit coupled with a first bank of memory cells, where the first ECC circuit is configured to perform operations associated with a first access operation (e.g., write operation) of the first bank of memory cells. The memory die may further include a second ECC circuit coupled with the first bank of memory cells, where the second ECC circuit is configured to perform ECC operations associated with a second access operation (e.g., read operation) of the first bank. In some cases, the first ECC circuit may be located under the footprint of the array and the second ECC circuit may be located outside the footprint of the array.
Abstract:
Methods, systems, and devices for leakage current reduction in electronic devices are described. Electronic devices may be susceptible to leakage currents when operating in a first mode, such as an inactive (e.g., a standby) mode. To mitigate leakage current, an electronic device may include transistors coupled in cascode configuration where a gate of a drain-side transistor in the cascode configuration is configured to be biased by an adjustable (e.g., a dynamic) control signal. When the transistors are inactive (e.g., “off”), the control signal may be adjusted to prevent leakage associated with the inactive transistors. Further, a source-side transistor in the cascode configuration may be configured to have a high threshold voltage (e.g., relative to the drain-side transistor).
Abstract:
Apparatuses and methods for capturing data using a divided clock are described. An example apparatus includes a clock divider configured to receive a DQS signal, and to provide divided clock signals. A divided clock signal of the divided clock signals has a frequency that is less than a frequency of the DQS signal. The example apparatus further includes a command circuit configured to receive a command, and to assert one of a plurality of flag signals based on the divided clock signals and on a defined latency from a time of receipt of the command. The example apparatus further includes a data capture circuit configured serially receive data associated with the command and to provide deserialized data responsive to the divided clock signals. The data capture circuit is further configured to sort the deserialized data based on the asserted one of the plurality of flag signals to provide sorted data.
Abstract:
Apparatuses, memory section control circuits, and methods of refreshing memory are disclosed. An example apparatus includes a plurality of memory sections and a plurality of memory section control circuits. Each memory section control circuit is coupled to a respective one of the plurality of memory sections and includes a plurality of access line drivers, each of which includes a plurality of transistors having common coupled gates. During an operation of the apparatus a first voltage is provided to the commonly coupled gates of the transistors of at least some of the access line drivers of the memory section control circuit coupled to an active memory section and a second voltage is provided to the commonly coupled gates of the transistors of the access line drivers of the memory section control circuit coupled to an inactive memory section control circuit, wherein the first voltage is greater than the second voltage.
Abstract:
Systems and methods described herein may enable memory maintenance operations to be performed on a memory device in compliance with a time interval having a duration based on a temperature of the memory device. A system may include a memory device and a memory controller communicatively coupled to the memory device. The memory controller may receive a temperature measurement indicative of a present temperature of the memory device and determine a memory management interval based on the temperature measurement. The memory controller may perform a memory management operation based on the memory management interval. Sometimes, the memory controller powers on the memory device to perform the memory management operation on the memory device.
Abstract:
Apparatus and methods for page-based soft post package repair are disclosed. Based on data stored in a storage element, an address may be decoded to a prime row, a row-based redundant row, or a page-based redundant row. A match logic circuit may determine whether the address corresponds to a defective prime row and generate a match signal. A decoder can select a redundant row to be accessed instead of a prime row in response to the match signal indicating that the address data corresponding to the address to be accessed matches defective address data stored in a volatile memory. A page-based redundant row allows for page-by-page substitution for defective memory, allowing functional portions of memory to continue to be used.