公开(公告)号：US20090183849A1

公开(公告)日：2009-07-23

申请号：US12018421

申请日：2008-01-23

Applicant: Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

Inventor： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC: B22D27/15 ,  B67D5/00 ,  B22D23/00

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US20090147394A1

公开(公告)日：2009-06-11

申请号：US12116175

申请日：2008-05-06

Applicant: German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

Inventor： German A. Chamorro ,  Michael P. McIntosh ,  Shawn M. Nave ,  Mark D. Schultz ,  Harley C. Witt ,  Raymond Yardy

IPC: G11B15/18

CPC classification number: G11B15/682 ,  G11B15/689 ,  G11B17/22 ,  G11B17/225 ,  G11B17/228

Abstract: In an automated library, data cartridges, such as magnetic tape cartridges, are stored in storage cells and accessed by data storage drives. An accessor with a gripper transports cartridges between storage cells and storage drives. Cartridges are prioritized according to their relative importance. A processor manages the placement of the cartridges in cells by having higher priority cartridges stored closer to the front of multi-cartridge cells than cartridges with a lower priority. Cartridges with a higher priority may also be stored closer to a storage drive than cartridges with a lower priority. A pusher may be used to push cartridges towards the front of multi-cartridge cells with an empty position to enable the gripper to reach the front cartridge.

Abstract translation: 在自动化库中，数据盒式磁带（如磁带盒）存储在存储单元中，并由数据存储驱动器访问。 具有夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 墨盒根据其相对重要性进行优先排序。 处理器通过将较高优先级的存储盒存储在比多盒单元的前面更靠近具有较低优先级的盒，来管理盒中的盒的放置。 具有较高优先级的墨盒也可以比具有较低优先级的墨盒更靠近存储驱动器。 可以使用推动器将空盒朝向多盒单元的前部推送，以使夹具能够到达前盒。

公开(公告)号：US07408780B2

公开(公告)日：2008-08-05

申请号：US11151843

申请日：2005-06-14

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20 ,  F28F7/00

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one of the spring elements comprises a spring portion and a fin portion. At least one of the spring elements provides a heat path from the electronic device and provides mechanical compliance. In another embodiment, the structure further includes a heat-conducting layer disposed over the electronic device, wherein the fin portion of each of at least one of the spring elements is coupled to the heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，其中弹簧元件中的至少一个包括弹簧部分和翅片部分。 至少一个弹簧元件提供来自电子设备的热路径并且提供机械顺应性。 在另一个实施例中，该结构还包括设置在电子设备上的导热层，其中至少一个弹簧元件中的每一个的翅片部分耦合到导热层。

公开(公告)号：US20080048008A1

公开(公告)日：2008-02-28

申请号：US11508082

申请日：2006-08-22

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: B23K1/08 ,  B23K31/02

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L2224/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A method for dispensing solder bumps on a mold plate includes the steps of: relatively moving a fill head comprising an o-ring from a first location to a second location such that the o-ring decompresses as it crosses from the first location to the second location; filling at least one cavity in the mold plate with solder; and then relatively moving the fill head from the second location to a third location such that the o-ring decompresses as it crosses from the second location to the third location. The step of relatively moving the fill head from the first location to the second location includes moving from a higher elevation to a lower elevation. A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the interface.

Abstract translation: 一种用于在模具板上分配焊料凸块的方法包括以下步骤：将包括O形环的填充头从第一位置相对移动到第二位置，使得O形环在从第一位置穿过第二位置时减压 位置; 用焊料填充模具板中的至少一个空腔; 然后将填充头从第二位置相对移动到第三位置，使得O形环在从第二位置到第三位置越过时解压缩。 将填充头从第一位置相对移动到第二位置的步骤包括从较高的高度移动到较低的高度。 停车位置界面的模板包括：用于保持焊料的模板; 具有用于在模板上分配焊料凸块的O形环的填充头; 用于定位填充头的停车位置; 以及在模板和停车位置之间的平台，用于将填充头从第一位置相对移动到第二位置，使得O形环在通过界面时减压。

公开(公告)号：US07236323B2

公开(公告)日：2007-06-26

申请号：US10930163

申请日：2004-08-31

Applicant: Blake O. Finstad ,  Gary A. Herbst ,  Kishan K. Kumbia ,  Mark D. Schultz ,  Scott A. Thomas ,  Satoshi Yamamoto

Inventor： Blake O. Finstad ,  Gary A. Herbst ,  Kishan K. Kumbia ,  Mark D. Schultz ,  Scott A. Thomas ,  Satoshi Yamamoto

IPC: G11B21/02 ,  G11B5/09

CPC classification number: G11B5/59633 ,  G11B5/59666

Abstract: A method and apparatus for providing combined radial and timing multislot self-servowrite propagation is disclosed. Radial bursts are combined with each timing mark and requires only three recovery/read-write spacing allocations per sector. The channel operates without requiring the writing of any bursts between reading radial bursts.

Abstract translation: 公开了一种用于提供组合的径向和定时多槽自伺服传播的方法和装置。 辐射脉冲串与每个定时标记组合，每扇区只需要三个恢复/读写间距分配。 信道操作而不需要在读取径向脉冲串之间写入任何脉冲串。

公开(公告)号：US07019926B2

公开(公告)日：2006-03-28

申请号：US10184343

申请日：2002-06-27

Applicant: Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: G11B5/09

CPC classification number: G11B5/59633 ,  G11B5/59605

Abstract: A system and method for self-servo-writing of multi-slot timing patterns is described. Individual timing marks are replaced with groups of timing mark slots. At each timing mark location, a time measurement is made by detecting a timing mark in one of the slots. Also, extensions to the existing timing marks are written in other slots. The combination of timing measurements at every timing mark and extensions to those timing marks written at every opportunity improves the overall precision of the timing propagation. The improved accuracy of timing mark placement produces a commensurate improvement in the placement of the concomitantly written servo-data. In addition, the alignment accuracy of the written pattern is less sensitive to variations in rotation speed and variations in the shape of written transitions. Moreover, only a single disk revolution is required at each servo radius to write servo data and propagate the timing marks.

Abstract translation: 描述了一种用于多时隙定时模式的自伺服写入的系统和方法。 单个定时标记被定时标记位置组替换。 在每个定时标记位置，通过检测其中一个时隙中的定时标记来进行时间测量。 此外，现有时序标记的扩展也写在其他插槽中。 每个定时标记的定时测量和在每个机会上写入的定时标记的扩展的组合可以提高定时传播的总体精度。 定时标记放置的改进精度在同时写入的伺服数据的位置上产生相应的改进。 此外，写入的图案的对准精度对旋转速度的变化和写入的转变的形状的变化较不敏感。 此外，在每个伺服半径处仅需要一次盘旋转以写入伺服数据并传播定时标记。

公开(公告)号：US09425124B2

公开(公告)日：2016-08-23

申请号：US13364907

申请日：2012-02-02

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: H01L23/367 ,  H01L23/473 ,  H01L23/00 ,  H01L23/467 ,  H01L21/48

CPC classification number: H01L23/473 ,  B23K1/0014 ,  B23K31/02 ,  B23K2101/14 ,  H01L21/4882 ,  H01L21/4885 ,  H01L23/3677 ,  H01L23/467 ,  H01L24/72 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.

Abstract translation: 散热器包括与热源的表面基本平行的多个层。 这些层包括以平面布置彼此间隔开的多个销部分，其中层的销部分被堆叠并结合以形成相对于热源在横向方向上延伸以散热的销散热片。 柔性层设置在销散热片和机械负载之间。 顺应层提供顺应性，使得当与热源接合时，销翅片适应尺寸差异。

公开(公告)号：US09167728B2

公开(公告)日：2015-10-20

申请号：US13551858

申请日：2012-07-18

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H05K7/20 ,  G05D23/00

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools air utilized by the rack of information technology equipment to cool the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat generated by the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的架构利用的空气以冷却信息技术设备的机架。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 由信息技术设备架构产生。

公开(公告)号：US09043035B2

公开(公告)日：2015-05-26

申请号：US13305967

申请日：2011-11-29

Applicant: Timothy J. Chainer ,  Milnes P. David ,  Madhusudan K. Iyengar ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark D. Schultz

Inventor： Timothy J. Chainer ,  Milnes P. David ,  Madhusudan K. Iyengar ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark D. Schultz

IPC: G06F19/00 ,  G05D7/06 ,  G06F1/20 ,  G11B33/14 ,  H05K7/20 ,  G06F1/32

CPC classification number: G05D7/0635 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3206 ,  G11B33/144 ,  H05K7/20281 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836 ,  Y02D10/16

Abstract: Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.

Abstract translation: 提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元 以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。 控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量 由N个可控部件消耗，其中Z≥1。

公开(公告)号：US08978401B2

公开(公告)日：2015-03-17

申请号：US13588260

申请日：2012-08-17

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: F25D17/02 ,  H05K7/20

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.

Abstract translation: 数据中心冷却系统可以包括用于冷却没有蒸气压缩制冷的液体冷却剂的传热设备，并且液体冷却剂被用在容纳在数据中心中的液冷信息技术设备机架上。 该系统还可以包括控制器装置，其通过基于信息技术设备温度阈值的一系列液体冷却剂流量值来调节流向液体冷却的信息技术设备机架的液体冷却剂流。