公开(公告)号：US08760186B2

公开(公告)日：2014-06-24

申请号：US12708774

申请日：2010-02-19

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G01R31/01 ,  G01R1/067

CPC classification number: G01R1/06716 ,  G01R1/06744 ,  Y10T29/49224

Abstract: A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.

Abstract translation: 提供了一种探针装置，包括形成有通孔的探针层，电连接到测试设备的导体，设置在通孔侧壁上并与绝缘体侧壁绝缘;探针，设置在通孔内以与通孔隔开 导体，从而在施加外力的同时可移动，以及连接到探针的顺应性层，并且足够柔顺，以允许探针在施加外力时至少临时接触导体。

公开(公告)号：US08181846B2

公开(公告)日：2012-05-22

申请号：US13100133

申请日：2011-05-03

Applicant: Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

Inventor： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC: B23K31/02

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供了一种方法和装置，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US07757932B2

公开(公告)日：2010-07-20

申请号：US11508082

申请日：2006-08-22

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: B23K31/02 ,  B23K35/12 ,  B23K31/00

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L2224/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A method for dispensing solder bumps on a mold plate includes the steps of: relatively moving a fill head comprising an o-ring from a first location to a second location such that the o-ring decompresses as it crosses from the first location to the second location; filling at least one cavity in the mold plate with solder; and then relatively moving the fill head from the second location to a third location such that the o-ring decompresses as it crosses from the second location to the third location. The step of relatively moving the fill head from the first location to the second location includes moving from a higher elevation to a lower elevation. A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the interface.

Abstract translation: 一种用于在模具板上分配焊料凸块的方法包括以下步骤：将包括O形环的填充头从第一位置相对移动到第二位置，使得O形环在从第一位置穿过第二位置时减压 位置; 用焊料填充模具板中的至少一个空腔; 然后将填充头从第二位置相对移动到第三位置，使得O形环在从第二位置到第三位置越过时解压缩。 将填充头从第一位置相对移动到第二位置的步骤包括从较高的高度移动到较低的高度。 停车位置界面的模板包括：用于保持焊料的模板; 具有用于在模板上分配焊料凸块的O形环的填充头; 用于定位填充头的停车位置; 以及在模板和停车位置之间的平台，用于将填充头从第一位置相对移动到第二位置，使得O形环在通过界面时减压。

公开(公告)号：US20080170033A1

公开(公告)日：2008-07-17

申请号：US11623216

申请日：2007-01-15

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G06F3/033

CPC classification number: G06F3/0321

Abstract: A method, system, and device are provided for displaying a graphical pointer at a location on a display area. The method includes displaying, with an information processing system, a display image at a display area. The pointing device captures an image corresponding to at least a portion of the display image at the display area in a field of view of the pointing device. A location within the display image corresponding to a location in the at least the portion of the display image in the field of view of the pointing device is determined. Optionally, a virtual pointer is caused to be displayed at the determined location within the display image.

Abstract translation: 提供了一种方法，系统和装置，用于在显示区域上的位置显示图形指针。 该方法包括用信息处理系统在显示区域显示显示图像。 指示设备在指示设备的视场中捕获与显示区域上的显示图像的至少一部分相对应的图像。 确定与指示设备的视场中的显示图像的至少部分中的位置对应的显示图像内的位置。 可选地，使虚拟指针显示在显示图像内的确定位置处。

公开(公告)号：US07268292B2

公开(公告)日：2007-09-11

申请号：US10944979

申请日：2004-09-20

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H05K5/00 ,  H05K7/20

CPC classification number: G06F1/20 ,  H01L23/36 ,  H01L23/367 ,  H01L2924/0002 ,  Y10T29/52 ,  H01L2924/00

Abstract: A cooling structure for an electronic device comprises a plate including a thermally conducting material disposed over the electronic device. The cooling structure includes a first support and a second support. One of the first support and the second support provides compliance in the x-y directions, and the other support provides compliance in the z direction. In another embodiment of the present invention, the plate comprises a material having high thermal conductivity.

Abstract translation: 电子设备的冷却结构包括一个板，该板包括布置在该电子设备上的导热材料。 冷却结构包括第一支撑件和第二支撑件。 第一个支持和第二个支持之一是在x-y方向上提供合规性，而另一个支持在z方向提供合规性。 在本发明的另一个实施例中，该板包括具有高导热性的材料。

公开(公告)号：US08736048B2

公开(公告)日：2014-05-27

申请号：US13398534

申请日：2012-02-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H01L23/36

CPC classification number: H01L23/46 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

Abstract: A multi-chip module (MCM) structure comprises more than one semiconductor chip lying in a horizontal plane, the MCM having individual chip contact patches on the chips and a flexible heat sink having lateral compliance and extending in a plane in the MCM and secured in a heat exchange relation to the chips through the contact patches. The MCM has a mismatch between the coefficient of thermal expansion of the heat sink and the MCM and also has chip tilt and chip height mismatches. The flexible heat sink with lateral compliance minimizes or eliminates shear stress and shear strain developed in the horizontal direction at the interface between the heat sink and the chip contact patches by allowing for horizontal expansion and contraction of the heat sink relative to the MCM without moving the individual chip contact patches in a horizontal direction.

Abstract translation: 多芯片模块（MCM）结构包括位于水平面中的多于一个的半导体芯片，MCM在芯片上具有单独的芯片接触贴片，并且柔性散热器具有侧向顺应性并且在MCM中的平面中延伸并固定在 通过接触片与芯片的热交换关系。 MCM具有散热器的热膨胀系数与MCM之间的不匹配，并且还具有芯片倾斜和芯片高度失配。 具有横向顺从性的柔性散热器通过允许相对于MCM的散热器的水平膨胀和收缩，最小化或消除了在散热器和芯片接触片之间的界面处在水平方向上产生的剪切应力和剪切应变，而不移动 单个芯片接触片在水平方向。

公开(公告)号：US20140020884A1

公开(公告)日：2014-01-23

申请号：US13551858

申请日：2012-07-18

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G05D23/00

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools air utilized by the rack of information technology equipment to cool the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat generated by the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的架构利用的空气以冷却信息技术设备的机架。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 由信息技术设备架构产生。

公开(公告)号：US20140020418A1

公开(公告)日：2014-01-23

申请号：US13588260

申请日：2012-08-17

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: F25B49/00 ,  F25D17/02 ,  F25D31/00

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.

Abstract translation: 数据中心冷却系统可以包括用于冷却没有蒸气压缩制冷的液体冷却剂的传热设备，并且液体冷却剂被用在容纳在数据中心中的液冷信息技术设备机架上。 该系统还可以包括控制器装置，其通过基于信息技术设备温度阈值的一系列液体冷却剂流量值来调节流向液体冷却的信息技术设备机架的液体冷却剂流。

公开(公告)号：US08493738B2

公开(公告)日：2013-07-23

申请号：US13102211

申请日：2011-05-06

Applicant: Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

Inventor： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Abstract translation: 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

公开(公告)号：US20130014926A1

公开(公告)日：2013-01-17

申请号：US13184239

申请日：2011-07-15

Applicant: Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

Inventor： Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

IPC: F28F27/00

CPC classification number: H05K7/20836 ,  F28D15/00 ,  H05K7/2079

Abstract: A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid. It has a second heat transfer fluid freezing point lower than the first heat transfer fluid freezing point, and the second heat transfer fluid freezing point is sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Abstract translation: 数据中心冷却系统以第一模式运行; 其具有室内部分，其中热量从数据中心的部件吸收;以及室外热交换器部分，其中外部空气被用于冷却至少在室外热交换器部分中存在的第一传热流体（例如，水） 第一模式下的冷却系统。 第一传热流体是相对高性能的传热流体（与第二流体相比），并且具有第一传热流体凝固点。 确定已经达到适当的时间以从第一模式切换到第二模式。 基于该判定，与第一传热流体相比，数据冷却系统的室外热交换器部分切换为相对低性能的传热流体的第二传热流体。 其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度下降到与第一传热的第一预定关系时，第二传热流体凝固点足够低以在不冻结的情况下运行 流体凝固点。