Method of covering clear aperture of optic during deposition of glue protection layer
    21.
    发明申请
    Method of covering clear aperture of optic during deposition of glue protection layer 审中-公开
    在胶保护层沉积期间覆盖光学透明孔的方法

    公开(公告)号:US20080038456A1

    公开(公告)日:2008-02-14

    申请号:US11826197

    申请日:2007-07-12

    申请人: Matthew Lipson

    发明人: Matthew Lipson

    IPC分类号: B05D5/06

    CPC分类号: B05D1/322

    摘要: A system and method that can be used to cover a portion (e.g., a clear aperture) of an optical element (e.g., a lens) during coating of another portion (e.g., a circumferential portion) of the optical element. This can be done to protect the clear aperture during coating of an adhesive protection layer proximate a circumferential edge of the lens without damaging or altering the clear aperture. The method can include the following steps. An optical element is held so that a first portion of the optical element is covered and a second portion of the optical element is exposed. A first coating is provided on the second portion of the optical element. The optical element is released from being held. A second coating is provided on the optical element. The first and second coatings are removed from the second portion of the optical element.

    摘要翻译: 一种可用于在光学元件的另一部分(例如,圆周部分)的涂覆期间覆盖光学元件(例如,透镜)的部分(例如,透明孔径)的系统和方法。 这可以在粘合剂保护层在透镜的周缘边缘附近的涂覆期间保护透明孔径而不损坏或改变透明孔径。 该方法可以包括以下步骤。 保持光学元件使得光学元件的第一部分被覆盖,并且光学元件的第二部分被暴露。 第一涂层设置在光学元件的第二部分上。 光学元件被释放而不被保持。 在光学元件上设置第二涂层。 从光学元件的第二部分去除第一和第二涂层。

    Bonding Silicon Silicon Carbide to Glass Ceramics
    28.
    发明申请
    Bonding Silicon Silicon Carbide to Glass Ceramics 失效
    将硅碳化硅结合到玻璃陶瓷

    公开(公告)号:US20100128242A1

    公开(公告)日:2010-05-27

    申请号:US12700049

    申请日:2010-02-04

    IPC分类号: B05D5/10 G03B27/58

    摘要: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

    摘要翻译: 一种用于光刻设备的晶片卡盘,其包括低热膨胀玻璃陶瓷基板,硅碳化硅层和包括具有至少约5兆帕的强度的硅酸盐的粘合层,所述粘合层将硅硅 描述了到基底的碳化物层。 另外,一种形成用于光刻设备的晶片卡盘的方法,其包括用粘合溶液涂覆低热膨胀玻璃陶瓷基板和硅碳化硅中的一个或两个的一部分,并使基板和 描述了将基板和硅碳化硅层结合在一起的硅碳化硅层。

    Bonding silicon silicon carbide to glass ceramics
    29.
    发明授权
    Bonding silicon silicon carbide to glass ceramics 失效
    将硅碳化硅粘合到玻璃陶瓷上

    公开(公告)号:US07678458B2

    公开(公告)日:2010-03-16

    申请号:US11626747

    申请日:2007-01-24

    摘要: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

    摘要翻译: 一种用于光刻设备的晶片卡盘,其包括低热膨胀玻璃陶瓷基板,硅碳化硅层和包括具有至少约5兆帕的强度的硅酸盐的粘合层,所述粘合层将硅硅 描述了到基底的碳化物层。 另外,一种形成用于光刻设备的晶片卡盘的方法,其包括用粘合溶液涂覆低热膨胀玻璃陶瓷基板和硅碳化硅中的一个或两个的一部分,并使基板和 描述了将基板和硅碳化硅层结合在一起的硅碳化硅层。