摘要:
A memory includes a first charge storage region spaced apart from a second charge storage region by an isolation region. Techniques for erasing a memory are provided in which electrons are Fowler-Nordheim (FN) tunneled out of at least one of the charge storage regions into a substrate to erase the at least one charge storage region of the memory. Other techniques are provided for programming a single charge storage region at multiple different levels or states.
摘要:
A dual-bit memory device includes a first charge storage region spaced apart from a second charge storage region by an isolation region. Techniques for erasing a memory can be provided in which electrons can be injected into the charge storage regions to erase the charge storage regions. Other techniques for programming a memory can be provided in which holes can be injected into at least one of the charge storage regions to program the charge storage regions.
摘要:
A device includes a memory device and an NPN or PNP diode coupled to a word-line of the memory device. The NPN diode includes a p-type substrate connected to ground, a well of n-type material formed in the p-type substrate in direct physical contact with the p-type substrate and electrically connected to the p-type substrate via a first metal line, a well of p-type material formed in the first well of n-type material, a first n-type region formed in the well of p-type material in direct physical contact with the well of p-type material and connected to the word line of the memory device, and a first p-type region formed in the well of n-type material in direct physical contact with the well of n-type material and electrically connected to the well of p-type material via a second metal line. The PNP diode includes a n-type substrate connected to ground, a well of p-type material formed in the n-type substrate in direct physical contact with the n-type substrate and electrically connected to the n-type substrate via a first metal line, a well of n-type material formed in the first well of p-type material, a first p-type region formed in the well of n-type material in direct physical contact with the well of n-type material and connected to the word line of the memory device, and a first n-type region formed in the well of p-type material in direct physical contact with the well of p-type material and electrically connected to the well of n-type material via a second metal line.
摘要:
A flash memory system configured in accordance with an example embodiment of the invention employs a virtual ground array architecture. During programming operations, target memory cells are selected and the appropriate programming voltages are established at their wordlines and bitlines. Unselected wordlines in the array are biased with a slight negative bias voltage to reduce or eliminate leakage bitline current that might otherwise conduct through the memory cells. A slight negative wordline bias voltage may also be applied to unselected cells during verification operations (program verify, soft program verify, erase verify) and read operations to reduce or eliminate leakage current that might otherwise introduce errors in the verification and read operations.
摘要:
A flash memory system configured in accordance with an example embodiment of the invention employs a virtual ground array architecture. During programming operations, target memory cells are selected and the appropriate programming voltages are established at their wordlines and bitlines. Unselected wordlines in the array are biased with a slight negative bias voltage to reduce or eliminate leakage bitline current that might otherwise conduct through the memory cells. A slight negative wordline bias voltage may also be applied to unselected cells during verification operations (program verify, soft program verify, erase verify) and read operations to reduce or eliminate leakage current that might otherwise introduce errors in the verification and read operations.
摘要:
A flash memory system configured in accordance with an example embodiment of the invention employs a virtual ground array architecture. During programming operations, target memory cells are biased with a positive source bias voltage to reduce or eliminate leakage current that might otherwise conduct through the target memory cells. A positive source bias voltage may also be applied to target memory cells during verification operations (program verify, soft program verify, erase verify) to reduce or eliminate leakage current that might otherwise introduce errors in the verification operations.
摘要:
A device according to one embodiment includes an electronic component such as an MR sensor, a pair of leads operatively coupled to the electronic component, and shorting material between the leads, the shorting material having been applied by a laser deposition process, the shorting material having been severed. A magnetic storage system according to another embodiment includes magnetic media; and at least one head for reading from and writing to the magnetic media, each head having: a sensor; and a writer coupled to the sensor. The system also includes a pair of pads or leads operatively coupled to the head; shorting material between the leads, the shorting material having been applied by a laser deposition process, the shorting material having been severed; a slider for supporting the head; and a control unit coupled to the head for controlling operation of the head.
摘要:
A magnetic sensor is provided, having two bias layers separated by a decoupling layer to eliminate exchange coupling between the bias layers. The two bias layers may have differing coercivities, such that the biases provided by the bias layers to the free layer are independently adjustable. The grain structures of the two bias layers may be substantially decorrelated by the decoupling layer.
摘要:
A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.
摘要:
According to one exemplary embodiment, a structure, for example a flash memory cell, comprises a transistor gate dielectric stack situated on a semiconductor substrate. The transistor gate dielectric stack includes a bottom oxide layer, a silicon-rich nitride layer situated on the bottom oxide layer, a low silicon-rich nitride layer situated on the silicon-rich nitride layer, and a top oxide layer situated on the low silicon-rich nitride layer. This embodiment results in a nitride based flash memory cell having improved program speed and retention while maintaining a high erase speed. In another embodiment, a flash memory cell may further comprise a high-K dielectric layer situated on the transistor gate dielectric stack.