公开(公告)号：US20130014982A1

公开(公告)日：2013-01-17

申请号：US13483587

申请日：2012-05-30

Applicant: Hiroshi SEGAWA ,  Nobuyuki NAGANUMA ,  Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

Inventor： Hiroshi SEGAWA ,  Nobuyuki NAGANUMA ,  Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K1/142 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09972 ,  H05K2203/1189 ,  Y10T29/49126

Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.

Abstract translation: 布线基板具有第一布线基板，其具有第一阻焊层，第二布线基板与第一布线基板连接，位于形成于第一布线基板的第一阻焊层的第一开口部， 连接到第一布线板并且位于形成在第一布线板的第一阻焊层中的第二开口部分中，使得第二布线板和第三布线板位于第一布线板的同一侧。 第一布线板的第一开口部分和第一布线板的第二开口部分形成在第一阻焊层中容纳第二和第三布线板的公共开口部分或分离容纳第二布线板的单独开口部分， 第一阻焊层中的第三布线板。

公开(公告)号：US20120060367A1

公开(公告)日：2012-03-15

申请号：US13297311

申请日：2011-11-16

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K3/10

CPC classification number: H05K3/4697 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T29/49158 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate.

Abstract translation: 一种柔性刚性布线板的制造方法，其特征在于，具备形成刚性基材的刚性基材，设置在所述刚性基材上的隔膜，以及在隔膜之后层叠在所述刚性基材上的绝缘层， 在层压绝缘层之后的绝缘层的一部分，并且形成凹部，该凹部被构造成在刚性基板的表面上根据隔板的形状容纳电子部件。

公开(公告)号：US20120008293A1

公开(公告)日：2012-01-12

申请号：US13234365

申请日：2011-09-16

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K7/02 ,  H05K3/30 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K3/4602 ,  H05K1/0366 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/0959 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T156/1062

Abstract: A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.

Abstract translation: 布线板具有基底基板，形成在基底基板上的导电图案，形成在导电图案和基底基板上的绝缘层，并且包括树脂浸渍的无机布，形成在绝缘层上的导电图案，形成的通孔 在所述绝缘层中并且连接形成在所述基底基板上的导电图案和形成在所述绝缘层上的导电图案，以及连接到形成在所述基底基板上的所述导电图案的通孔，穿过所述基底基板，并具有孔直径 在10μm至150μm的范围内。

公开(公告)号：US20100155109A1

公开(公告)日：2010-06-24

申请号：US12496141

申请日：2009-07-01

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/028 ,  H05K1/142 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/055 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/09509 ,  H05K2201/096

Abstract: A flex-rigid wiring board including a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material, and a flexible wiring board including a flexible base material and having a conductive layer over the flexible base material. The conductive layer of the flexible wiring board is electrically connected to the conductive layer of the rigid wiring board. The flexible wiring board has a cut portion and one or more folding portions formed by using the cut portion and folding one or more portions of the flexible wiring board such that the flexible wiring board is extended in length.

Abstract translation: 一种柔性刚性布线板，包括刚性布线板，其包括刚性基材并且在刚性基材上方具有导电层，以及柔性布线板，其包括柔性基材并且在柔性基材上方具有导电层。 柔性布线板的导电层电连接到刚性布线板的导电层。 柔性布线板具有通过使用切割部分形成的切割部分和一个或多个折叠部分，并且折叠柔性布线板的一个或多个部分，使得柔性布线板的长度延伸。