公开(公告)号：US20110247212A1

公开(公告)日：2011-10-13

申请号：US13165014

申请日：2011-06-21

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/02

CPC classification number: H05K3/4691 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2203/1536

Abstract: A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the base substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, forming vias in at least one of the first substrate or second substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than a mounting area of the first substrate such that the first substrate extends beyond an edge of the second substrate.

Abstract translation: 一种制造布线板的方法，包括形成基底基板，在基底基板的第一表面上形成第一绝缘层，在基底基板的与第一表面相对的第二表面上形成第二绝缘层，形成IVH（间隙Via 孔），其穿过基底基板，在第一基板或第二基板中的至少一个中形成通孔，并且在第一区域中切割第一绝缘层，并且在偏离所述第一区域的第二区域中切割第二绝缘层，以形成 第一衬底层压到第二衬底上，其中基底层插入其中，第二衬底具有比第一衬底的安装面积小的安装面积，使得第一衬底延伸超过第二衬底的边缘。

公开(公告)号：US20110209344A1

公开(公告)日：2011-09-01

申请号：US13106330

申请日：2011-05-12

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/42 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.

Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的至少一个边缘。 基底衬底，第一衬底或第二衬底中的至少一个包括柔韧树脂，并且基底衬底，第一衬底或第二衬底中的至少一个包括无机填料。

公开(公告)号：US20100155109A1

公开(公告)日：2010-06-24

申请号：US12496141

申请日：2009-07-01

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/028 ,  H05K1/142 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/055 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/09509 ,  H05K2201/096

Abstract: A flex-rigid wiring board including a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material, and a flexible wiring board including a flexible base material and having a conductive layer over the flexible base material. The conductive layer of the flexible wiring board is electrically connected to the conductive layer of the rigid wiring board. The flexible wiring board has a cut portion and one or more folding portions formed by using the cut portion and folding one or more portions of the flexible wiring board such that the flexible wiring board is extended in length.

Abstract translation: 一种柔性刚性布线板，包括刚性布线板，其包括刚性基材并且在刚性基材上方具有导电层，以及柔性布线板，其包括柔性基材并且在柔性基材上方具有导电层。 柔性布线板的导电层电连接到刚性布线板的导电层。 柔性布线板具有通过使用切割部分形成的切割部分和一个或多个折叠部分，并且折叠柔性布线板的一个或多个部分，使得柔性布线板的长度延伸。

公开(公告)号：US20080093118A1

公开(公告)日：2008-04-24

申请号：US11876413

申请日：2007-10-22

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K1/11

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。