DUAL POLYSILICON GATE OF SEMICONDUCTOR DEVICE WITH MULTI-PLANE CHANNEL AND FABRICATION METHOD THEREOF
    21.
    发明申请
    DUAL POLYSILICON GATE OF SEMICONDUCTOR DEVICE WITH MULTI-PLANE CHANNEL AND FABRICATION METHOD THEREOF 失效
    具有多平面通道的半导体器件的双聚硅栅和其制造方法

    公开(公告)号:US20080081421A1

    公开(公告)日:2008-04-03

    申请号:US11618779

    申请日:2006-12-30

    IPC分类号: H01L21/336

    摘要: A dual polysilicon gate of a semiconductor device includes a substrate having a first region, a second region, and a third region, a channel region with a recessed structure formed in the first region of the substrate, a gate insulating layer formed over the substrate, a first polysilicon layer filled into the channel region, and formed over the gate insulating layer of the first and second regions, a second polysilicon layer formed over the gate insulating layer of the third region, and an insulating layer doped with an impurity, and disposed inside the first polysilicon layer in the channel region.

    摘要翻译: 半导体器件的双多晶硅栅极包括具有第一区域,第二区域和第三区域的衬底,形成在衬底的第一区域中的凹陷结构的沟道区,在衬底上形成的栅极绝缘层, 并且形成在所述第一和第二区域的所述栅极绝缘层之上的第一多晶硅层,形成在所述第三区域的所述栅极绝缘层上的第二多晶硅层和掺杂有杂质的绝缘层, 在通道区域的第一多晶硅层的内部。

    Semiconductor device and method for fabricating the same
    25.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08227920B2

    公开(公告)日:2012-07-24

    申请号:US13237743

    申请日:2011-09-20

    摘要: A semiconductor device includes a substrate, a pattern including a conductive layer and a hard mask layer stacked over the substrate, a capping layer surrounding sidewalls of the pattern, and a stress buffer layer disposed between the hard mask layer and the capping layer. The stress buffer layer is configured to inhibit transfer of stress between the hard mask layer and the capping layer during a thermal process so as to inhibit leaning of the capping layer.

    摘要翻译: 半导体器件包括衬底,包括导电层和层叠在衬底上的硬掩模层的图案,围绕图案的侧壁的覆盖层以及设置在硬掩模层和覆盖层之间的应力缓冲层。 应力缓冲层被配置为在热处理期间抑制硬掩模层和覆盖层之间的应力传递,以抑制覆盖层的倾斜。

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    26.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20120007246A1

    公开(公告)日:2012-01-12

    申请号:US13237743

    申请日:2011-09-20

    IPC分类号: H01L29/43

    摘要: A semiconductor device includes a substrate, a pattern including a conductive layer and a hard mask layer stacked over the substrate, a capping layer surrounding sidewalls of the pattern, and a stress buffer layer disposed between the hard mask layer and the capping layer. The stress buffer layer is configured to inhibit transfer of stress between the hard mask layer and the capping layer during a thermal process so as to inhibit leaning of the capping layer.

    摘要翻译: 半导体器件包括衬底,包括导电层和堆叠在衬底上的硬掩模层的图案,围绕图案的侧壁的覆盖层以及设置在硬掩模层和覆盖层之间的应力缓冲层。 应力缓冲层被配置为在热处理期间抑制硬掩模层和覆盖层之间的应力传递,从而抑制覆盖层的倾斜。

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    29.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20090115003A1

    公开(公告)日:2009-05-07

    申请号:US11966435

    申请日:2007-12-28

    IPC分类号: H01L29/423 H01L21/28

    摘要: A method for fabricating a semiconductor device includes forming a stacked layer including a tungsten layer, forming a hard mask pattern over the stacked layer, and oxidizing a surface of the hard mask pattern to form a stress buffer layer. A portion of the stacked layer uncovered by the hard mask pattern is removed using the hard mask pattern and the stress buffer layer as an etch mask, thereby forming a first resultant structure. A capping layer is formed over the first resultant structure, the capping layer is etched to retain the capping layer on sidewalls of the first resultant structure, and the remaining portion of the stacked layer uncovered by the hard mask pattern is removed.

    摘要翻译: 一种制造半导体器件的方法包括:形成包含钨层的堆叠层,在层叠层上形成硬掩模图案,并且氧化硬掩模图案的表面以形成应力缓冲层。 使用硬掩模图案和应力缓冲层作为蚀刻掩模去除未被硬掩模图案覆盖的堆叠层的一部分,从而形成第一结果结构。 在第一结果结构上形成覆盖层,蚀刻覆盖层以将覆盖层保持在第一结构结构的侧壁上,并且去除未被硬掩模图案覆盖的堆叠层的剩余部分。