摘要:
A method includes growing a plurality of parallel mandrels on a surface of a semiconductor substrate, each mandrel having at least two laterally opposite sidewalls and a predetermined width. The method further includes forming a first type of spacers on the sidewalls of the mandrels, wherein the first type of spacers between two adjacent mandrels are separated by a gap. The predetermined mandrel width is adjusted to close the gap between the adjacent first type of spacers to form a second type of spacers. The mandrels are removed to form a first type of fins from the first type of spacers, and to form a second type of fins from spacers between two adjacent mandrels. The second type of fins are wider than the first type of fins.
摘要:
The disclosure relates to a Fin field effect transistor (FinFET). An exemplary structure for a FinFET comprises a substrate comprising a top surface; a first fin and a second fin extending above the substrate top surface, wherein each of the fins has a top surface and sidewalls; an insulation layer between the first and second fins extending part way up the fins from the substrate top surface; a first gate dielectric covering the top surface and sidewalls of the first fin having a first thickness and a second gate dielectric covering the top surface and sidewalls of the second fin having a second thickness less than the first thickness; and a conductive gate strip traversing over both the first gate dielectric and second gate dielectric.
摘要:
A method includes growing a plurality of parallel mandrels on a surface of a semiconductor substrate, each mandrel having at least two laterally opposite sidewalls and a predetermined width. The method further includes forming a first type of spacers on the sidewalls of the mandrels, wherein the first type of spacers between two adjacent mandrels are separated by a gap. The predetermined mandrel width is adjusted to close the gap between the adjacent first type of spacers to form a second type of spacers. The mandrels are removed to form a first type of fins from the first type of spacers, and to form a second type of fins from spacers between two adjacent mandrels. The second type of fins are wider than the first type of fins.
摘要:
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary FinFET device includes a semiconductor substrate; a fin structure disposed over the semiconductor substrate; and a gate structure disposed on a portion of the fin structure. The gate structure traverses the fin structure and separates a source region and a drain region of the fin structure, the source and drain region defining a channel therebetween. The source and drain region of the fin structure include a strained source and drain feature. The strained source feature and the strained drain feature each include: a first portion having a first width and a first depth; and a second portion disposed below the first portion, the second portion having a second width and a second depth. The first width is greater than the second width, and the first depth is less than the second depth.
摘要:
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary FinFET device includes a semiconductor substrate; a fin structure disposed over the semiconductor substrate; and a gate structure disposed on a portion of the fin structure. The gate structure traverses the fin structure and separates a source region and a drain region of the fin structure, the source and drain region defining a channel therebetween. The source and drain region of the fin structure include a strained source and drain feature. The strained source feature and the strained drain feature each include: a first portion having a first width and a first depth; and a second portion disposed below the first portion, the second portion having a second width and a second depth. The first width is greater than the second width, and the first depth is less than the second depth.
摘要:
An integrated circuit structure includes an n-type fin field effect transistor (FinFET) and a p-type FinFET. The n-type FinFET includes a first germanium fin over a substrate; a first gate dielectric on a top surface and sidewalls of the first germanium fin; and a first gate electrode on the first gate dielectric. The p-type FinFET includes a second germanium fin over the substrate; a second gate dielectric on a top surface and sidewalls of the second germanium fin; and a second gate electrode on the second gate dielectric. The first gate electrode and the second gate electrode are formed of a same material having a work function close to an intrinsic energy level of germanium.
摘要:
This description relates to a fin field-effect-transistor (FinFET) including a substrate and a fin structure on the substrate. The fin structure includes a channel between a source and a drain, wherein the source, the drain, and the channel have a first type dopant, and the channel comprises at least one of a Ge, SiGe, or III-V semiconductor. The FinFET further includes a gate dielectric layer over the channel and a gate over the gate dielectric layer. The FinFET further includes a nitride spacer on the substrate adjacent the gate and an oxide layer between the nitride spacer and the gate and between the nitride spacer and the substrate.
摘要:
A liquid crystal display (LCD) device includes an LCD panel, and a common voltage generating circuit configured for providing common voltages to the LCD panel. The common voltage generating circuit includes a microprocessor, a timer, a voltage adjustment circuit, and a look up table. The microprocessor is electrically connected to the timer, the look up table, and the voltage adjustment circuit. The timer is configured for recording a continuous operated time of the LCD panel. The look up table is configured for storing optimal common voltages corresponding to each continuous operated time. The microprocessor is configured for reading the optimal common voltage at set intervals corresponding to the continuous operated time, and controlling the voltage adjustment circuit to provide the corresponding optimal common voltage to the LCD panel.
摘要:
A microelectronic device including, in one embodiment, a plurality of active devices located at least partially in a substrate, at least one dielectric layer located over the plurality of active devices, and an inductor located over the dielectric layer. At least one of the plurality of active devices is located within a columnar region having a cross-sectional shape substantially conforming to a perimeter of the inductor. The at least one of the plurality of active devices may be biased based on a desired Q factor of the inductor or and/or an operating frequency of the microelectronic device.
摘要:
A method for manufacturing a complementary metal-oxide semiconductor sensor is provided. The present method provides a semiconductor structure including a plurality of conductors thereon. An inter-metal dielectric layer is formed on the conductors. A silicon nitride film is applied on the inter-metal dielectric layer. An oxide layer is formed on the silicon nitride film. The oxide layer, the silicon nitride film and the inter-metal dielectric are etched to expose portions of the conductors. The oxide layer and the exposed conductors are cleaned in a cleaning step later.