公开(公告)号：US06300678B1

公开(公告)日：2001-10-09

申请号：US09184081

申请日：1998-11-02

申请人： Mitsuo Suehiro ,  Satoshi Osawa ,  Shunichi Kikuchi

发明人： Mitsuo Suehiro ,  Satoshi Osawa ,  Shunichi Kikuchi

IPC分类号： H01L2348

CPC分类号： H01L24/01 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

摘要： There is provided an I/O pin by which an MCM is positively prevented from being damaged by solder flowing from the fore end to the base of the I/O pin when the I/O pin is soldered in the case of mounting the MCM. An I/O pin used for an electrical connection is provided, one end of which is perpendicularly fixed to an MCM and the other end of which is soldered to a predetermined position on the mother board in the case of mounting the MCM on the mother board. In an intermediate portion of the I/O pin, there is formed a solder dam composed of a plated layer of Ni of low solder wettability, a layer of highly heat-resistant resin or a layer of high-temperature solder.

摘要翻译： 在安装MCM的情况下，当I / O引脚被焊接时，提供了一个I / O引脚，通过该引脚可以有效地防止MCM从焊接头从I / O引脚的前端流到基座的损坏。 设置用于电连接的I / O引脚，其一端垂直固定于MCM，另一端在将MCM安装在母板上的情况下焊接到母板上的预定位置 。 在I / O引脚的中间部分形成有由低焊料润湿性的Ni的镀层，高耐热树脂层或高温焊料层构成的焊料坝。

公开(公告)号：US5894882A

公开(公告)日：1999-04-20

申请号：US650029

申请日：1996-05-17

申请人： Shunichi Kikuchi ,  Minoru Hirano ,  Kiyotaka Seyama ,  Hideaki Yoshimura ,  Takashi Kanda ,  Hitoshi Nori

发明人： Shunichi Kikuchi ,  Minoru Hirano ,  Kiyotaka Seyama ,  Hideaki Yoshimura ,  Takashi Kanda ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  F28F7/00 ,  H01L23/46

CPC分类号： H01L23/3672 ,  F28F3/027 ,  H01L23/467 ,  H01L2924/0002

摘要： A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.

摘要翻译： 模块基板的散热结构包括沿着纵向方向延伸并且以预定间距在横向上重复的多个条状底部区域，沿着所述纵向方向延伸并在所述纵向方向上重复的多个条状顶部区域 横向具有所述预定间距，使得条状底部区域和条状顶部区域在横向方向上交替重复，其中条状顶部区域和条形底部区域具有相应的横向边缘， 通过散热片相互连接。

公开(公告)号：US5763950A

公开(公告)日：1998-06-09

申请号：US598331

申请日：1996-02-08

申请人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

发明人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L29/06 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/3677 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068

摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。

公开(公告)号：US5050037A

公开(公告)日：1991-09-17

申请号：US251978

申请日：1988-09-29

申请人： Haruhiko Yamamoto ,  Kouji Katsuyama ,  Mitsuhiko Nakata ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Kouji Katsuyama ,  Mitsuhiko Nakata ,  Shunichi Kikuchi

IPC分类号： H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  H01L23/4332 ,  H01L2224/48091

摘要： A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compressive contact with the electronic circuit components on both faces of the printed circuit board.

摘要翻译： 一种印刷电路板组件，其具有安装在两面上的印刷电路板，诸如集成电路芯片的热生成电子电路部件和布置在印刷电路板两侧的一对液体冷却模块。 每个液冷模块设置有具有液体冷却剂供给头的液体冷却板和由液体冷却板保持的多个弹性传热单元，并且与印刷的两面上的电子电路部件压电接触 电路板。

公开(公告)号：US4879632A

公开(公告)日：1989-11-07

申请号：US914942

申请日：1986-10-03

申请人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

发明人： Haruhiko Yamamoto ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Mitsuhiko Nakata ,  Koji Katsuyama ,  Izumi Ono ,  Shunichi Kikuchi

IPC分类号： G02F1/00 ,  G11B5/64 ,  G11B11/105 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  G02F1/0036 ,  G11B11/10591 ,  G11B5/64 ,  H01L23/4332 ,  H01L2224/48091

摘要： A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

摘要翻译： 冷却系统包括冷却模块，该冷却模块具有弹性偏置并暴露于冷却剂流动的传热板，用于将从印刷电路板上的电路部件散发的热量传递到冷却剂，以及焊料或低熔点金属 用于在转印板和电路部件之间建立热接触。