公开(公告)号：US20210375545A1

公开(公告)日：2021-12-02

申请号：US17405064

申请日：2021-08-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kota ZENZAI

IPC: H01G4/12 ,  H01L49/02 ,  H01G4/30

Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass. A glass-free conductive paste including a nickel powder, a metal powder, such as tin, having a melting point of lower than about 500° C., and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. The ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. The thermosetting resin is thermally decomposed or burned such that little or none remains, and the nickel powder and metal powder having a melting point of lower than about 500° C. are sintered to form a unified sintered metal body.

公开(公告)号：US20210050152A1

公开(公告)日：2021-02-18

申请号：US16897323

申请日：2020-06-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kota ZENZAI

IPC: H01G4/008 ,  H01G4/12 ,  B22F1/00 ,  B22F1/02 ,  H01B1/22 ,  H05K1/09 ,  H01G4/30 ,  H01G4/232 ,  H01G4/224 ,  C08L63/00

Abstract: A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

公开(公告)号：US20170140874A1

公开(公告)日：2017-05-18

申请号：US15418865

申请日：2017-01-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenichi HAMANAKA ,  Kota ZENZAI ,  Taku DEKURA ,  Kiyotaka MAEGAWA

IPC: H01G4/30 ,  H01C7/18 ,  H01C1/148 ,  H01L41/293 ,  H01C17/28 ,  H01F27/29 ,  H01L41/047 ,  H01G4/232 ,  H01C7/00

CPC classification number: H01G4/30 ,  H01C1/148 ,  H01C7/008 ,  H01C7/18 ,  H01C17/288 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01G4/232 ,  H01G4/2325 ,  H01L41/0472 ,  H01L41/293 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/4902 ,  Y10T29/49085

Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. A volume occupied by the resin component in the inner external electrode is within a prescribed range.

公开(公告)号：US20160042871A1

公开(公告)日：2016-02-11

申请号：US14922550

申请日：2015-10-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kota ZENZAI ,  Hisayoshi OMORI ,  Takashi KANAYAMA ,  Kiyoyasu SAKURADA ,  Naoki SHIMIZU ,  Seiji KATSUTA ,  Shinji OTANI

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/248 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/252 ,  H01G13/006 ,  H05K3/1283 ,  H05K3/4664

Abstract: A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.

Abstract translation: 制备陶瓷体，其包括设置在陶瓷体内部的内部电极，并且内部电极的端部被引导到陶瓷体的表面。 在陶瓷体的表面上形成电极层，以覆盖内部电极的端部，含有树脂的电极层，含有第一金属成分的第一金属填料和含有第一金属成分的第二金属填料 具有比第一金属成分高的熔点的第二金属成分。 进行加热电极层的加热步骤，以形成包括位于陶瓷体表面上并含有第一和第二金属成分的金属层的电极和内部电极中所含的金属。

公开(公告)号：US20140375173A1

公开(公告)日：2014-12-25

申请号：US14305103

申请日：2014-06-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenichi HAMANAKA ,  Kota ZENZAI ,  Taku DEKURA ,  Kiyotaka MAEKAWA

IPC: H01C7/00 ,  H01G4/008 ,  H01G4/30 ,  H01L41/297 ,  H01L41/047 ,  H01F41/04 ,  H01C17/00 ,  H01G4/12 ,  H01F27/28

CPC classification number: H01C7/008 ,  H01C1/148 ,  H01C7/18 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/046 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01L41/0472 ,  H01L41/0477 ,  H01L41/293 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/4902 ,  Y10T29/49085

Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped shaped laminate in which a ceramic layer and an internal electrode are alternately laminated and an external electrode provided on a portion of a surface of the laminate and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the laminate and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. The inner external electrode includes, as a metal component, a first metal component of which a portion forms an alloy with the internal electrode so as to connect the internal electrode and the inner external electrode to each other, and a second metal component higher in melting point than the first metal component, of which a portion forms an alloy with the first metal component so as to connect the inner external electrode and the outer external electrode to each other. A concentration of a metal in a surface layer of the inner external electrode is not lower than about 17%.

Abstract translation: 陶瓷电子部件包括矩形或大致矩形的平行六面体形状的层压体，其中陶瓷层和内部电极交替层压，并且设置在层压体的表面的一部分上并与内部电极电连接的外部电极。 外部电极包括覆盖层压体的表面的一部分的内部外部电极，并且包括树脂组分和金属组分的混合物以及覆盖内部外部电极并包括金属组分的外部外部电极。 内部外部电极包括作为金属成分的与内部电极形成合金以使内部电极和内部外部电极彼此连接的第一金属成分，以及熔融时的第二金属成分 与第一金属部件相比，其中一部分与第一金属部件形成合金，以将内部外部电极和外部外部电极彼此连接。 内部外部电极的表面层中的金属的浓度不低于约17％。

公开(公告)号：US20140239772A1

公开(公告)日：2014-08-28

申请号：US14174034

申请日：2014-02-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yutaka OTA ,  Masato KIMURA ,  Kota ZENZAI

IPC: H01C1/028 ,  H01L41/053 ,  H01F5/00 ,  H01G4/30

CPC classification number: H01C1/028 ,  H01C7/18 ,  H01F17/0013 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01L41/0472

Abstract: In an electronic component, when L0 is a dimension of an electronic component body in a first direction, L1 is a distance between a first outer electrode and a second outer electrode on a first surface in the first direction, and L2 is a dimension of each of the first and second outer electrodes on the first surface in the first direction, 0%

Abstract translation: 在电子部件中，当L0是第一方向的电子部件体的尺寸时，L1是在第一方向上的第一面上的第一外部电极和第二外部电极之间的距离，L2是每个的尺寸 在第一方向上的第一表面上的第一和第二外部电极的0％