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公开(公告)号：US10517170B2
公开(公告)日：2019-12-24
申请号：US16149162
申请日：2018-10-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinya Oguri , Yuki Ito , Yuya Dokai , Isamu Morita
Abstract: A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.
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公开(公告)号：US09501732B2
公开(公告)日：2016-11-22
申请号：US15076811
申请日：2016-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromi Murayama , Yuya Dokai , Tsuyoshi Mukai , Kazuaki Higashibata , Masato Nomura , Noboru Kato
IPC: G06K19/06 , G06K19/077 , H01Q7/00 , H01Q1/22 , G06K19/073 , H01Q1/38
CPC classification number: G06K19/0775 , G06K19/073 , G06K19/07749 , G06K19/07783 , H01Q1/2225 , H01Q1/38 , H01Q7/00
Abstract: An antenna module includes a base including two opposing mounting surfaces, an antenna coil provided on or in the base so as to define an opening, the antenna coil having a shape that is symmetrical or substantially symmetrical with respect to a reference plane, and an IC chip and a plurality of electronic components mounted on one of the mounting surfaces and electrically coupled to the antenna coil, the IC chip and the electronic components being arranged inside the opening when viewed in plan from a normal direction of the mounting surface. At least two of the plurality of electronic components are arranged so as to be symmetrical or substantially symmetrical to each other with respect to the reference plane when viewed in plan from the normal direction.
Abstract translation: 一种天线模块包括一个包括两个相对的安装表面的基座，一个天线线圈，设置在基座上或基座上，以便限定开口，天线线圈具有相对于参考平面对称或基本对称的形状，以及IC 芯片和安装在一个安装表面上并电耦合到天线线圈的多个电子部件，当从安装表面的法线方向观察时，IC芯片和电子部件布置在开口内部。 多个电子部件中的至少两个被布置成当从法线方向俯视时相对于参考平面彼此对称或基本对称。
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公开(公告)号：US09258019B2
公开(公告)日：2016-02-09
申请号：US14291203
申请日：2014-05-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuya Dokai , Noboru Kato
CPC classification number: H04B1/0078 , H04B1/0458 , H04B1/18 , H04B1/3805 , H04B1/525 , H04B15/04
Abstract: An RFID device provided at a transmission and reception circuit processes an RFID carrier signal belonging to a band of about 902 MHz to about 928 MHz or about 865 MHz to about 868 MHz to execute near field radio communication. An RFIC provided at a transmission and reception circuit processes a GSM carrier signal belonging to a band of about 824 MHz to about 894 MHz or about 880 MHz to about 960 MHz to execute mobile communication. A filter circuit provided at the transmission and reception circuit takes the band of about 850 MHz to about 940 MHz where RFID carrier signals appear as the pass band, and takes the band greater than or equal to about 1.2 GHz where a harmonic wave component of GSM carrier signals appears as the attenuation band.
Abstract translation: 设置在发送和接收电路处的RFID设备处理属于约902MHz至约928MHz或约865MHz至约868MHz的频带的RFID载波信号，以执行近场无线电通信。 在发送和接收电路处提供的RFIC处理属于约824MHz至约894MHz或约880MHz至约960MHz的频带的GSM载波信号，以执行移动通信。 设置在发送和接收电路上的滤波器电路采用大约850MHz至大约940MHz的频带，其中RFID载波信号作为通带出现，并且取大于或等于约1.2GHz的频带，其中GSM的谐波分量 载波信号出现为衰减频带。
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公开(公告)号：US09232034B2
公开(公告)日：2016-01-05
申请号：US14560274
申请日：2014-12-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuya Dokai , Tsuyoshi Mukai , Masato Nomura
CPC classification number: H04M1/026 , G06K7/10346 , G06K7/10386 , H01Q1/243 , H01Q9/42 , H04M2250/04
Abstract: A communication terminal device includes a UHF-band RFID system including a wireless IC element for UHF-band RFID and a loop-shaped conductor coupled to the wireless IC element for UHF-band RFID, and a UHF-band mobile communication system including a wireless IC element for UHF-band mobile communication and an antenna conductor coupled to the wireless IC element for UHF-band mobile communication. The loop-shaped conductor and the antenna conductor are closely adjacent to each other. The loop-shaped conductor is electromagnetically coupled to a portion of the antenna conductor.
Abstract translation: 通信终端装置包括UHF频带RFID系统，包括用于UHF频带RFID的无线IC元件和耦合到用于UHF频带RFID的无线IC元件的环形导体，以及UHF频带移动通信系统，包括无线 用于UHF频带移动通信的IC元件和耦合到用于UHF频带移动通信的无线IC元件的天线导体。 环形导体和天线导体彼此紧密相邻。 环形导体与天线导体的一部分电磁耦合。
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公开(公告)号：US09177240B2
公开(公告)日：2015-11-03
申请号：US14574781
申请日：2014-12-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuya Dokai , Masato Nomura
IPC: G06K19/06 , G06K7/08 , G06K19/07 , H01Q1/22 , H01Q7/00 , G06K19/073 , G06K19/077 , H04B1/04 , H04B1/18
CPC classification number: G06K19/0709 , G06K19/073 , G06K19/07754 , G06K19/07784 , G06K19/07786 , H01Q1/2216 , H01Q7/00 , H04B1/0458 , H04B1/18
Abstract: A communication device includes a radiator defining a duplex antenna of a first communication system whose carrier frequency is in a first frequency band and a second communication system whose carrier frequency is in a second frequency band overlapping the first frequency band, an antenna for the second communication system, a second communication system power feeding unit which is connected to the radiator and the antenna for the second communication system, and a first communication system power feeding unit which is connected to the radiator, wherein the first communication system power feeding unit includes a circuit configured to position a communication peak frequency whose communicable distance in the first communication system is maximum, outside the second frequency band.
Abstract translation: 一种通信设备包括一个辐射体，其定义载波频率处于第一频带的第一通信系统的双工天线，以及载波频率处于与第一频带重叠的第二频带的第二通信系统，用于第二通信的天线 系统，连接到散热器和第二通信系统的天线的第二通信系统供电单元和连接到散热器的第一通信系统供电单元，其中第一通信系统供电单元包括电路 被配置为将第一通信系统中的可通信距离设置为最大的通信峰值频率定位在第二频带之外。
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Patent Agency Ranking
公开(公告)号：US08991717B2
公开(公告)日：2015-03-31
申请号：US14328858
申请日：2014-07-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromi Murayama , Yuya Dokai , Tsuyoshi Mukai , Kazuaki Higashibata , Masato Nomura , Noboru Kato
IPC: G06K19/06 , G06K19/077 , H01F38/14 , H01Q7/00 , H01Q1/22
CPC classification number: G06K19/07758 , G06K19/07722 , G06K19/07783 , G06K19/07784 , H01F38/14 , H01L2224/16225 , H01L2924/181 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H01L2924/00012
Abstract: An antenna module includes an antenna element including coil patterns and via conductors coupling together two adjacent two coil patterns. At least one of the coil patterns has a spiral shape, is wound three or more turns parallel or substantially parallel to an outer edge of a principal surface of a multilayer body, includes a first partial pattern including an outer end portion, a second partial pattern extending parallel or substantially parallel with the first partial pattern and being adjacent to the first partial pattern with a first gap provided therebetween, and a third partial pattern extending parallel or substantially parallel with the second partial pattern and being adjacent to the second partial pattern with a second gap provided therebetween, the second gap being smaller than the first gap.
Abstract translation: 天线模块包括天线元件，天线元件包括线圈图案和将两个相邻的两个线圈图案耦合在一起的通孔导体。 线圈图案中的至少一个具有螺旋形状，缠绕平行或基本平行于多层体的主表面的外边缘的三个或更多个匝，包括第一部分图案，其包括外端部分，第二部分图案 与第一部分图案平行或基本平行地延伸并且与第一部分图案相邻并且其间设置有第一间隙;以及第三部分图案，其与第二部分图案平行或基本平行延伸并且与第二部分图案相邻， 第二间隙设置在其间，第二间隙小于第一间隙。
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公开(公告)号：US08991713B2
公开(公告)日：2015-03-31
申请号：US13792650
申请日：2013-03-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuya Dokai , Koji Shiroki
CPC classification number: G06K19/0723 , G06K19/07786 , H01Q1/2225 , H01Q7/00 , H01Q9/285
Abstract: An RFID chip package includes an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band and a power supply circuit connected to the RFID chip and including at least one inductance element. A reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0Ω.
Abstract translation: RFID芯片封装包括包括升压电路和处理UHF频带中的RF信号的RFID芯片和连接到RFID芯片并且包括至少一个电感元件的电源电路。 在电源电路的天线连接输入/输出端子处的输入/输出阻抗的电抗分量基本上为0和OHgr。
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公开(公告)号：US08878739B2
公开(公告)日：2014-11-04
申请号：US13970633
申请日：2013-08-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuya Dokai
CPC classification number: G06K19/0726 , G06K19/07722 , G06K19/07754 , H01Q1/2225 , H01Q1/38 , H01Q1/48 , H01Q7/00 , H01Q9/06 , H04B5/0062 , H04B5/0075
Abstract: A wireless communication device includes a wireless IC device, a multilayer substrate including a stack of a plurality of dielectric layers, a resonant circuit that is connected to the wireless IC device and that includes a capacitance element provided in the multilayer substrate and an inductance element provided outside the multilayer substrate, and a radiation conductor connected to the resonant circuit.
Abstract translation: 无线通信装置包括无线IC器件，包括多个电介质层的叠层的多层衬底，连接到无线IC器件并且包括设置在多层衬底中的电容元件的谐振电路和设置在多层衬底中的电感元件 在多层基板之外，以及连接到谐振电路的辐射导体。
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公开(公告)号：US08876010B2
公开(公告)日：2014-11-04
申请号：US14151852
申请日：2014-01-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Yuya Dokai
CPC classification number: G06K19/07754 , G06K19/07749 , G06K19/07756 , H01Q1/2225 , H01Q7/00 , H01Q9/26 , H01Q9/285
Abstract: A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system.
Abstract translation: 无线IC器件包括无线IC芯片，耦合电极和辐射板。 耦合电极包括被布置成耦合到无线IC芯片的耦合部分和一对相对的端部。 一对相对的端部彼此电容耦合并且与待耦合到辐射板的辐射板相对。 无线IC芯片使用辐射板作为天线来发射和接收具有一定频率的信号到RFID系统。
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公开(公告)号：US08690070B2
公开(公告)日：2014-04-08
申请号：US13794929
申请日：2013-03-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noburo Kato , Yuya Dokai
IPC: G06K19/06
CPC classification number: G06K19/07754 , G06K19/07749 , G06K19/07756 , H01Q1/2225 , H01Q7/00 , H01Q9/26 , H01Q9/285
Abstract: A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system.
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