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公开(公告)号：US20140331709A1
公开(公告)日：2014-11-13
申请号：US14370190
申请日：2012-12-12
Applicant: NEC Corporation
Inventor： Masaki Chiba , Minoru Yoshikawa , Hitoshi Sakamoto , Akira Shoujiguchi , Kenichi Inaba , Arihiro Matsunaga
CPC classification number: H05K7/2029 , F25B39/00 , F25B39/02 , F25B39/04 , F28D15/02 , F28D15/0266 , F28F13/06 , F28F2250/08 , H01L23/367 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K7/20309 , H05K7/20318 , H01L2924/00
Abstract: When a cooling device employing an ebullient cooling system is mounted in a low-profile electronic device, not only is it impossible to obtain the sufficient cooling performance, but also the cooling efficiency of the entire electronic device decreases, therefore, a cooling device according to an exemplary aspect of the invention includes evaporating means for storing a refrigerant; condensing means for condensing and liquefying a vapor-phase refrigerant vaporized in the evaporation means and radiating heat; a pipe connecting the evaporating means to the condensing means; and flow regulating means for regulating a flow direction of air passing through the condensing means, wherein the evaporating means and the condensing means are located on roughly the same level in the vertical direction; the evaporating means includes an evaporation container and bulkhead means for separating the refrigerant disposed in the evaporation container; the height of the bulkhead means is larger than or equal to the height of a vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container; the pipe includes a vapor pipe through which vapor-phase refrigerant flows and a liquid pipe through which condensed and liquefied liquid-phase refrigerant flows; the condensing means includes first condensing means and second condensing means which differ in condensing-means height which is defined as the height in vertical direction of a condensation container composing the condensing means, and the condensing-means height of the first condensing means is configured to be larger than the condensing-means height of the second condensing means; the first condensing means includes a vapor pipe connection portion which is connected to the vapor pipe at the position above the condensing-means height of the second condensing means in vertical direction; and the flow regulating means is disposed in the upper part of the second condensing means.
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公开(公告)号：US20140321056A1
公开(公告)日：2014-10-30
申请号：US14361930
申请日：2012-11-16
Applicant: NEC Corporation
Inventor： Minoru Yoshikawa , Hitoshi Sakamoto , Masaki Chiba , Kenichi Inaba , Arihiro Matsunaga
IPC: H05K7/20
CPC classification number: H05K7/20354 , H05K7/20154 , H05K7/20727 , H05K7/20818
Abstract: An electronic substrate 200A mounts a heater element 220. A chassis 300A houses an electronic substrate 200 in an airtight manner. A cooling unit 400 cools the electronic substrate 200. The cooling unit 400 includes a heat receiving part 410 and a heat radiation part 420. The heat receiving part 410 receives heat from the electronic substrate 200. The heat radiation part 420 is connected with the heat receiving part 410, and radiates heat from the electronic substrate 200 which has received by the heat receiving part 410. Further, the heat receiving part 410 is provided in the chassis 300A in an airtight manner, and the heat radiation part 420 is provided outside the chassis 300. As a result, efficient cooling is possible, and moreover, maintenance replacement work can be performed for each piece of electronic substrate housing equipment individually.
Abstract translation: 电子基板200A安装加热元件220.底座300A以气密的方式容纳电子基板200。 冷却单元400冷却电子基板200.冷却单元400包括热接收部分410和散热部分420.热接收部分410从电子基板200接收热量。散热部分420与热量 接收部分410，并且从由热接收部分410接收的电子基板200辐射热量。此外，热接收部分410以气密的方式设置在机架300A中，并且散热部分420设置在 结果，可以有效地进行冷却，此外，可以分别对每个电子基板收纳设备执行维护更换工作。
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公开(公告)号：US20240255201A1
公开(公告)日：2024-08-01
申请号：US17789312
申请日：2021-08-19
Applicant: NEC Corporation
Inventor： Takashi OHTSUKA , Koichi Todoroki , Yoshinori Miyamoto , Masaki Chiba , Mahiro Hachiya , Minoru Yoshikawa
CPC classification number: F25B49/02 , F25B13/00 , F25B2700/1933
Abstract: An object of the present invention is to prevent cavitation in a refrigerant pump from occurring due to a decrease in a net positive suction head in a cooling device.
A cooling device of the present invention is a cooling device using a refrigeration cycle in which a refrigerant is circulated through a heat receiver (1), a compressor (2), a heat radiator (3), and an expander (4), and includes a tank (5) that separates the refrigerant supplied from the expander (4) into a gas phase refrigerant and a liquid phase refrigerant, a pump (6) that sends the liquid phase refrigerant separated in the tank (5) to the heat receiver (1), and a control unit (7) that controls the amount of increase in pressure of the compressor 2 in the refrigeration cycle, and the control unit (7) increases the pressure of the compressor (2) in a limited range in which the value of the net positive suction head of the pump (6) does not fall below a predetermined value.-
公开(公告)号：US11683912B2
公开(公告)日：2023-06-20
申请号：US17398208
申请日：2021-08-10
Applicant: NEC Corporation
Inventor： Kenji Kobayashi , Koichi Todoroki , Nirmal Singh Rajput , Yoshinori Miyamoto , Masaki Chiba , Minoru Yoshikawa
IPC: H05K7/20
CPC classification number: H05K7/20745 , H05K7/20145
Abstract: A cooling device includes: a duct that guides air that has absorbed heat generated inside a cooling target and has been discharged, to the cooling target; a cooler that is provided in the duct and cools the air flowing inside the duct; and an adjusting mechanism that is located on a downstream side of the cooler, adjusts an amount of the air discharged from the duct into a room where the cooling target is installed.
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公开(公告)号：US11614288B2
公开(公告)日：2023-03-28
申请号：US16923615
申请日：2020-07-08
Applicant: NEC Corporation
Inventor： Koichi Todoroki , Minoru Yoshikawa , Masaki Chiba
IPC: F24F13/30 , F28F9/02 , H05K7/20 , F28F1/10 , F24F1/0063 , F24F1/0323
Abstract: A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.
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Patent Agency Ranking
公开(公告)号：US11609035B2
公开(公告)日：2023-03-21
申请号：US16060994
申请日：2016-12-16
Applicant: NEC Corporation
Inventor： Minoru Yoshikawa , Hisato Sakuma , Masaki Chiba
Abstract: In a phase-change cooling apparatus including an indoor unit and an outdoor unit, a configuration to prevent dew condensation in the indoor unit causes the cooling performance to decrease; therefore, a refrigerant circulating apparatus according to an exemplary aspect of the present invention includes refrigerant-liquid thermal equilibrium means for mixing a first refrigerant liquid with a second refrigerant liquid and sending a reflux refrigerant liquid composed of the first refrigerant liquid and the second refrigerant liquid, the first refrigerant liquid being a liquid-phase refrigerant included in a gas-liquid two-phase refrigerant flowing in from heat receiving means, the second refrigerant liquid arising due to the gas-liquid two-phase refrigerant cooled by heat radiating means; a refrigerant passage configured for the gas-liquid two-phase refrigerant and the reflux refrigerant liquid to circulate between the heat receiving means and the refrigerant-liquid thermal equilibrium means; refrigerant-liquid reflux means for refluxing the reflux refrigerant liquid to the heat receiving means through the refrigerant passage; and refrigerant-liquid flow control means for controlling a flow rate of the reflux refrigerant liquid.
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公开(公告)号：US11105566B2
公开(公告)日：2021-08-31
申请号：US16498073
申请日：2017-03-30
Applicant: NEC Corporation
Inventor： Koichi Todoroki , Arihiro Matsunaga , Minoru Yoshikawa
Abstract: The present invention provides a heat exchanger including a lower header into which a liquid-phase refrigerant flows, a plurality of heat exchange pipes which branch off from the lower header and extend upwards, and an upper header which is configured to collect refrigerant received by the heat exchange pipes, in which a refrigerant inlet of the lower header is provided with a flow passage resistance adjusting hole having a cross-section smaller than a flow passage cross-section of a pipe passage for supplying the refrigerant.
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公开(公告)号：US09820407B2
公开(公告)日：2017-11-14
申请号：US14768917
申请日：2014-02-19
Applicant: NEC Corporation
Inventor： Hitoshi Sakamoto , Minoru Yoshikawa , Akira Shoujiguchi , Masaki Chiba , Kenichi Inaba , Arihiro Matsunaga
CPC classification number: H05K7/20145 , G06F1/20 , H05K7/20154 , H05K7/202 , H05K7/205
Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.
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公开(公告)号：US09693485B2
公开(公告)日：2017-06-27
申请号：US14646599
申请日：2013-12-03
Applicant: NEC Corporation
Inventor： Kenichi Inaba , Minoru Yoshikawa , Hitoshi Sakamoto , Akira Shoujiguchi , Arihiro Matsunaga , Masaki Chiba
CPC classification number: H05K7/20818 , F25B23/006 , F28D15/0266 , F28D15/06 , G06F1/20 , H05K7/20736 , H05K7/20809
Abstract: A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.
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公开(公告)号：US11774115B2
公开(公告)日：2023-10-03
申请号：US17400667
申请日：2021-08-12
Applicant: NEC Corporation
Inventor： Masaki Chiba , Kunihiko Ishihara , Minoru Yoshikawa , Junichi Miyamoto , Yoshinori Miyamoto
CPC classification number: F24F1/32 , F16L11/04 , F16L13/08 , F24F1/34 , F16L2011/047
Abstract: An air conditioner includes: a turbo compressor that compresses a heat medium; a heat exchanger that exchanges heat of the heat medium supplied from the turbo compressor with an atmosphere; and a supply flow path and a discharge flow path that connect the turbo compressor and the heat exchanger. At least one of the supply flow path and the discharge flow path includes piping, and the piping includes a gas barrier layer that covers a surface of a synthetic resin.
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