公开(公告)号：US20220369466A1

公开(公告)日：2022-11-17

申请号：US17873144

申请日：2022-07-26

Applicant: NICHIA CORPORATION

Inventor： Masakazu SAKAMOTO ,  Masaaki KATSUMATA ,  Tomohisa KISHIMOTO

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42 ,  H05K3/10 ,  H05K3/32

Abstract: A printed circuit board includes a printed wiring board including an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. A semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. Conductive members filled in the through-holes connect the element terminals and the wiring. The insulative substrate has elasticity in which an elongation percentage of the insulative substrate is 20% or more. The wiring is formed from a conductive polymer or an elastic conductive paste in which conductive particles are mixed into a resin material.

公开(公告)号：US20210193878A1

公开(公告)日：2021-06-24

申请号：US17193239

申请日：2021-03-05

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/56

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

公开(公告)号：US20200274034A1

公开(公告)日：2020-08-27

申请号：US15930687

申请日：2020-05-13

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/56

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

公开(公告)号：US20190273188A1

公开(公告)日：2019-09-05

申请号：US16356789

申请日：2019-03-18

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/44 ,  H01L33/56 ,  H01L33/62 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

公开(公告)号：US20180342651A1

公开(公告)日：2018-11-29

申请号：US16053803

申请日：2018-08-03

Applicant: NICHIA CORPORATION

Inventor： Mayumi FUKUDA ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/60 ,  B29C41/00 ,  B29C45/14 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  B29C33/12

Abstract: A package has a bottomed recess with a bottom portion. The package includes: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess. The first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view. The first part has a thickness different from a thickness of the first outer lead portion. A light emitting has: the package; and a light emitting element mounted on at least one of the first electrode and the second electrode of the package.

公开(公告)号：US20140315338A1

公开(公告)日：2014-10-23

申请号：US14321672

申请日：2014-07-01

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohide MIKI ,  Tomoya TSUKIOKA ,  Tomohisa KISHIMOTO

IPC: H01L33/56 ,  H01L33/36 ,  H01L33/60

CPC classification number: H01L33/36 ,  C08G59/3245 ,  C08K3/013 ,  C08K5/005 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract translation: 公开了一种发光装置，其包括由发光峰值波长不小于430nm的氮化镓系化合物半导体构成的发光元件（10） 设置有具有安装有发光元件（10）的底面的凹部和侧面的成型体（40） 以及含有包含三嗪衍生物环氧树脂的环氧树脂或含硅树脂的密封构件（50）。 成型体（40）通过使用基本上含有包含三嗪衍生物环氧树脂的环氧树脂的热固性环氧树脂组合物的固化物得到，并且在不小于430nm的波长下具有不小于70％的反射率 。