公开(公告)号：US20180366617A1

公开(公告)日：2018-12-20

申请号：US16111239

申请日：2018-08-24

Applicant: NICHIA CORPORATION

Inventor： Yuichi YAMADA ,  Motokazu YAMADA

IPC: H01L33/46

CPC classification number: H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.

公开(公告)号：US20180180250A1

公开(公告)日：2018-06-28

申请号：US15855573

申请日：2017-12-27

Applicant: NICHIA CORPORATION

Inventor： Yuichi YAMADA ,  Motokazu YAMADA

IPC: F21V7/00 ,  F21V3/00 ,  F21K9/64 ,  H01L33/46 ,  H01L33/48 ,  H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075

CPC classification number: F21V7/0083 ,  F21K9/64 ,  F21V3/00 ,  F21V3/02 ,  F21V9/30 ,  F21V13/12 ,  F21V17/002 ,  F21Y2105/16 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

公开(公告)号：US20170345974A1

公开(公告)日：2017-11-30

申请号：US15608791

申请日：2017-05-30

Applicant: NICHIA CORPORATION

Inventor： Yuichi YAMADA ,  Motokazu YAMADA

IPC: H01L33/44 ,  H01L33/38 ,  H01L33/62 ,  H01L33/50 ,  H01L33/26 ,  H01L33/20 ,  H01L33/40 ,  H01L33/60 ,  H01L33/54

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate, the light emitting element having an upper surface and a lateral surface; a reflecting layer located on the upper surface of the light emitting element; a first light-transmissive member having a first surface in contact with the lateral surface of the light emitting element, and a second surface that is inclined toward the substrate in a direction outward from the light emitting element; and a second light-transmissive member in contact with the second surface and covering the light emitting element. A refractive index of the first light-transmissive is smaller than a refractive index of the second light-transmissive member.