Abstract:
A micromechanical device having a frequency trimmable, resonant structure, including a semiconductor substrate forming a support frame. First and second flexures flexibly couple and support a structure within the support frame, to permit rotation with a resonant frequency about a first axis which passes through the flexures. First and second elongated openings located proximate the first and second flexures form first and second tension relief beams adjacent the flexures, for providing stress relief of the tensile forces between the resonant structure and the flexures, and for establishing and trimming the resonant frequency of the resonant structure. The resonant structure may also include first and second regions located proximate the elongated openings, the regions having a thickness which is substantially less than the thickness of the remainder of the resonant structure, to permit removal of at least a portion of the regions thereby enlarging the elongated openings and further trimming the resonant frequency of the resonant structure. Also disclosed is a method of trimming the resonant frequency of such a micromechanical device.
Abstract:
Motion restraints and a method for their fabrication are provided for use with a micromechanical transducer, such as a gyroscope or an accelerometer, to limit the motion of resiliently supported transducer elements, preventing extreme lateral or rotational displacement of the elements. The motion restraints are fabricated of a material such as gold that prevents or reduces the sticking of the transducer elements at points of contact between them. In one embodiment, the motion restraints include cantilevered depositions that extend from the substrate over the transducer element. In a further embodiment, the restraints includes a metal capped post and close-tolerance lateral restraints.
Abstract:
A video signal processor, particularly for use in identifying light source position, in which a video signal stream from an image detector is processed directly on a substrate using charge coupled device stored image transfer technology. The video signal is clocked through an array of charge coupled devices in a plurality of closely adjacent channels on a single semiconductor chip in such manner that the pattern of signals stored on the chip in the region of the adjacent channels corresponds to the light source image on the detector. Video signal processing is shared between the chip and external electronics to provide an indication of signal strength (acquisition), signal background, and signal centroiding in both horizontal and vertical axes. Much of the signal processing is provided directly on the chip by segmenting and intercoupling the charge coupled device electrodes in a predetermined pattern. There results a reduction in the amount of interconnection, external electronics and the spatial distribution of the video signal that improves the system immunity to environmental noise and limits weight aloft.
Abstract:
A transistor structure capable of high frequency operation with low collector currents is obtained by fabricating the transistor using nitride techniques to minimize the emitter area and base width area beyond that obtainable by conventional masking techniques. The emitter is surrounded on three sides by low capacitance dielectric which reduces its emitter-to-collector capacitance and hence improves high frequency performance.
Abstract:
An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.
Abstract:
A near-field energy conversion structure and method of assembling the same, utilizing a sub-micrometer “near field” gap between juxtaposed photocell infrared radiation receiver and heat emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure.
Abstract:
A micron gap thermo-photo-voltaic device including a photovoltaic substrate, a heat source substrate, and a plurality of spacers separating the photovoltaic substrate from the heat source substrate by a submicron gap. Each spacer includes an elongated thin-walled structure disposed in a well formed in the heat source substrate and having a top surface less than a micron above the heat source substrate. Also disclosed are methods of making the spacers.
Abstract:
A method of making a micron gap thermal photovoltaic device includes forming at least one standoff on a photovoltaic substrate, depositing a sacrificial layer on the photovoltaic substrate and about the standoff, forming an emitter attached to the standoff and having a lower planar surface separated from the photovoltaic substrate by the sacrificial layer, and removing the sacrificial layer to form a sub-micron gap between the photovoltaic substrate and the lower planar surface of the emitter.
Abstract:
A near-field energy conversion structure and method of assembling the same, utilizing a sub-micrometer “near field” gap between juxtaposed photocell infrared radiation receiver and heat emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure.
Abstract:
A low thermal strain flexure support for a micromechanical device includes a substrate; a micromechanical device having a rotational axis and a longitudinal axis; an anchor structure disposed on the substrate proximate the longitudinal axis of the micromechanical device; first and second support members extending outwardly oppositely from the anchor structure; and first and second flexures extending inwardly in the direction of the axis of rotation of the micromechanical device from the first and second support members, respectively, to the micromechanical device for suspending the micromechanical device from the substrate.