Use of expanding material oxides for nano-fabrication
    23.
    发明申请
    Use of expanding material oxides for nano-fabrication 有权
    使用膨胀材料氧化物进行纳米制造

    公开(公告)号:US20070010101A1

    公开(公告)日:2007-01-11

    申请号:US11174798

    申请日:2005-07-05

    IPC分类号: H01L21/31 H01L21/469

    摘要: This invention relates to a method of fabricating nano-dimensional structures, comprising: depositing at least one deformable material upon a substrate such that the material includes at least one portion; and creating an oxidizable layer located substantially adjacent to the deposited deformable material such that at least a portion of the oxidized portion of the oxidizable layer interacts with the at least one portion of the deformable material to apply a localized pressure upon the at least one portion of the deformable material.

    摘要翻译: 本发明涉及一种制造纳米尺寸结构的方法,包括:将至少一种可变形材料沉积在基底上,使得该材料包括至少一部分; 以及产生基本上与所沉积的可变形材料相邻的可氧化层,使得可氧化层的氧化部分的至少一部分与可变形材料的至少一部分相互作用以将局部压力施加到至少一部分 可变形材料。

    Encapsulation of nano-dimensional structures by oxidation
    25.
    发明授权
    Encapsulation of nano-dimensional structures by oxidation 有权
    通过氧化封装纳米尺寸结构

    公开(公告)号:US07381658B2

    公开(公告)日:2008-06-03

    申请号:US11174896

    申请日:2005-07-05

    IPC分类号: H01L21/31 H01L21/469

    CPC分类号: B81B1/00

    摘要: This invention relates to a method of encapsulating nano-dimensional structures, comprising: depositing at least one material upon a substrate such that the material includes at least one portion; and creating an oxidized layer located substantially adjacent to the deposited material such that the at least one portion of the deposited material becomes substantially encapsulated by a portion of the oxidized layer.

    摘要翻译: 本发明涉及一种封装纳米尺寸结构的方法,包括:在衬底上沉积至少一种材料,使得该材料包括至少一部分; 以及产生基本上邻近沉积材料定位的氧化层,使得沉积材料的至少一部分基本上被氧化层的一部分包封。

    Use of expanding material oxides for nano-fabrication
    28.
    发明授权
    Use of expanding material oxides for nano-fabrication 有权
    使用膨胀材料氧化物进行纳米制造

    公开(公告)号:US07381631B2

    公开(公告)日:2008-06-03

    申请号:US11174798

    申请日:2005-07-05

    IPC分类号: H01L21/20 H01L21/36

    摘要: This invention relates to a method of fabricating nano-dimensional structures, comprising: depositing at least one deformable material upon a substrate such that the material includes at least one portion; and creating an oxidizable layer located substantially adjacent to the deposited deformable material such that at least a portion of the oxidized portion of the oxidizable layer interacts with the at least one portion of the deformable material to apply a localized pressure upon the at least one portion of the deformable material.

    摘要翻译: 本发明涉及一种制造纳米尺寸结构的方法,包括:将至少一种可变形材料沉积在基底上,使得该材料包括至少一部分; 以及产生基本上与所沉积的可变形材料相邻的可氧化层,使得可氧化层的氧化部分的至少一部分与可变形材料的至少一部分相互作用以将局部压力施加到至少一部分 可变形材料。

    Thin-film transistor and methods
    30.
    发明申请
    Thin-film transistor and methods 有权
    薄膜晶体管及方法

    公开(公告)号:US20060079037A1

    公开(公告)日:2006-04-13

    申请号:US10961507

    申请日:2004-10-07

    IPC分类号: H01L21/84

    摘要: A thin-film transistor (TFT) is fabricated by providing a substrate, depositing and patterning a metal gate, anodizing the patterned metal gate to form a gate dielectric on the metal gate, depositing and patterning a channel layer comprising a multi-cation oxide over at least a portion of the gate dielectric, and depositing and patterning a conductive source and conductive drain spaced apart from each other and disposed in contact with the channel layer.

    摘要翻译: 通过提供衬底,沉积和图案化金属栅极来制造薄膜晶体管(TFT),阳极氧化图案化金属栅极以在金属栅极上形成栅极电介质,沉积和图案化包含多阳离子氧化物的沟道层 至少一部分栅极电介质,并且沉积并图形化彼此间隔开并与沟道层接触的导电源和导电漏极。