Abstract:
A memory interface includes circuitry configured for applying a variable delay to a portion of a data signal and applying a variable delay to a data strobe. The delayed data strobe samples the delayed portion of the data signal. Delayed portions of the data signal are spaced away from non-delayed portions of the data signal by alternating the routing of delayed bits and non-delayed bits of the data signal. A training block determines and sets a value of the variable delay corresponding to a largest value of a number of recorded eye aperture widths.
Abstract:
A method of controlling signal termination includes providing first logic for selectively terminating signals received at a first device on a bidirectional data bus, providing second logic for selectively terminating signals received at a second device on the bidirectional data bus, sending first signals from the first device to the second device on the bidirectional data bus at a first speed, stopping the sending of the first signals, after stopping the sending of the first signals, enabling the second logic and shifting a reference voltage of the second device from a first level to a second level, after enabling the second logic at the second device, sending second signals from the first device to the second device on the bidirectional data bus at a higher speed, and controlling the first logic based on a speed of signals received at the first device on the bidirectional data bus.
Abstract:
Systems and methods are provided for allocating memory to dissimilar memory devices. An exemplary embodiment includes a method for allocating memory to dissimilar memory devices. An interleave bandwidth ratio is determined, which comprises a ratio of bandwidths for two or more dissimilar memory devices. The dissimilar memory devices are interleaved according to the interleave bandwidth ratio to define two or more memory zones having different performance levels. Memory address requests are allocated to the memory zones based on a quality of service (QoS).
Abstract:
In an embodiment, a stacked package-on-package system has a memory die and a logic die. The memory die comprises a first memory and a second memory, each operated independently of the other, and each having an inter-chip interface electrically connected to the logic die. The logic die has two independent clock sources, one to provide a first clock signal to the first memory, and the other clock source to provide a second clock signal to the second memory.