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公开(公告)号：US20230370048A1
公开(公告)日：2023-11-16
申请号：US18101267
申请日：2023-01-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Su KIM , Jae Hyoung GIL , Moon Chul LEE , Yong Suk KIM , Dong Hyun PARK , Tae Kyung LEE
CPC classification number: H03H9/174 , H03H9/131 , H03H9/02015 , H03H9/173
Abstract: A bulk-acoustic wave resonator includes a substrate; a lower electrode, disposed on the substrate, comprising a first inclined surface and a second inclined surface; and an insertion layer disposed on an edge of the lower electrode. The first inclined surface extends from an inclined surface of the insertion layer in a region disposed inside the insertion layer. The second inclined surface extends from the first inclined surface in a region inside a region of the first inclined surface.
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公开(公告)号：US20220038077A1
公开(公告)日：2022-02-03
申请号：US17094019
申请日：2020-11-10
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Kyung LEE , Yong Suk KIM , Sang Kee YOON , Jin Suk SON , Ran Hee SHIN
Abstract: A bulk-acoustic wave resonator includes a resonator having a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion disposed along a periphery of the central portion and in which an insertion layer is disposed below the piezoelectric layer, wherein the insertion layer includes a SiO2 thin film injected with fluorine (F).
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公开(公告)号：US20140153147A1
公开(公告)日：2014-06-05
申请号：US14173699
申请日：2014-02-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Kwon WI , Jeong Bok KWAK , Sang Moon LEE , Young Seuck YOO , Yong Suk KIM
IPC: H01F27/34
CPC classification number: H01F27/2804 , H01F17/0013 , H01F19/00 , H01F27/24 , H01F27/28 , H01F27/288 , H01F27/343 , H01F41/042 , H01F2017/0066 , H01F2017/008 , H01F2017/0093 , H05K1/0233 , H05K1/165 , H05K3/4629 , Y10T29/49002 , Y10T29/4902 , Y10T29/49208 , Y10T29/49211 , Y10T29/49936
Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.
Abstract translation: 共模滤波器被制造为包括线圈部分，其包括绝缘层和形成在绝缘层中的导体图案; 以及耦合到线圈部分的一个表面或两个表面的磁性基板。 磁性基板包括：由静电吸收材料制成的静电吸收层; 设置在静电吸收层的一个表面或两个表面上并由磁性材料制成的磁性层; 以及设置在磁性层和静电吸收层之间并由导电材料制成的电极。 因此，共模滤波器可以保持高效率特性，同时防止静电放电现象。
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公开(公告)号：US20140152402A1
公开(公告)日：2014-06-05
申请号：US13843717
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Moon LEE , Jun Hee BAE , Sung Kwon WI , Yong Suk KIM
IPC: H03H7/01
CPC classification number: H01F17/0013 , H01F2017/0066 , H01F2017/0093 , Y10T29/49016
Abstract: Disclosed herein are a common mode noise chip filter and a method for preparing thereof, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer composite layer on the substrate provided with the coil patterns, wherein the ferrite-polymer composite layer includes spherical ferrite particles and flake shaped ferrite particles.
Abstract translation: 这里公开了共模噪声芯片滤波器及其制备方法，该共模噪声芯片滤波器包括：铁氧体衬底; 在铁素体基板上形成的线圈图案; 在设置有线圈图案的基板上的铁素体 - 高分子复合层，其中铁氧体 - 聚合物复合层包括球形铁氧体颗粒和片状铁素体颗粒。
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公开(公告)号：US20130300527A1
公开(公告)日：2013-11-14
申请号：US13801264
申请日：2013-03-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Suk KIM , Sung Kwon WI , Ju Hwan YANG , Won Chul SIM , Jeong Bok KWAK , Jeong Min CHO , Young Seuck YOO , Sang Moon LEE
CPC classification number: H01F41/04 , H01F5/003 , H01F41/046 , Y10T29/49071
Abstract: The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern.
Abstract translation: 本发明涉及一种制造线圈元件和线圈元件的方法，其包括形成，对准和耦合第一辅助层和第二辅助层的过程，其中由电镀图案形成的线圈部分设置在 衬底或绝缘层，并且即使通过使用光致抗蚀剂图案的电镀方法形成具有高纵横比的细间距微细导体线圈，也可以克服由于光致抗蚀剂图案的塌陷或变形引起的限制。
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Patent Agency Ranking
公开(公告)号：US20230216470A1
公开(公告)日：2023-07-06
申请号：US17824145
申请日：2022-05-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Won HAN , Hwa Sun LEE , Jeong Hoon RYOU , Moon Chul LEE , Tae Yoon KIM , Sang Kee YOON , Yong Suk KIM , Joung Hun KIM , Sung Jun LEE , Sung Joon PARK
CPC classification number: H03H9/0211 , H03H9/173 , H03H9/02102
Abstract: A bulk acoustic wave resonator includes a substrate; a central portion including a first portion of a first electrode, a first portion of a piezoelectric layer, and a first portion of a second electrode laminated in order on the substrate; and a reflective region disposed laterally of the central portion and including a second portion of the first electrode, an insertion layer, a second portion of the piezoelectric layer, and a second portion of the second electrode. A side surface of the insertion layer adjacent to the central portion has an inclined surface, the first portion of the second electrode and the second portion of the second electrode are coplanar, and an end of the second electrode overlaps the inclined surface of the insertion layer in the reflective region.
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公开(公告)号：US20230208381A1
公开(公告)日：2023-06-29
申请号：US17994706
申请日：2022-11-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Moon Chul LEE , Kwang Su KIM , Jin Woo YI , Jae Hyoung GIL , Yong Suk KIM , Dong Hyun PARK
CPC classification number: H03H9/02015 , H03H9/132 , H03H9/131 , H03H9/54
Abstract: A bulk acoustic resonator includes a substrate, a frequency control layer changing a resonant frequency or antiresonant frequency of the bulk acoustic resonator according to a thickness of the frequency control layer, a piezoelectric layer disposed between the frequency control layer and the substrate, a first electrode disposed between the piezoelectric layer and the substrate, a second electrode disposed between the piezoelectric layer and the frequency control layer, a metal layer connected to the first electrode or the second electrode, and a protective layer disposed between the second electrode and the frequency control layer, wherein the frequency control layer covers a larger area than that of the protective layer.
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公开(公告)号：US20210359662A1
公开(公告)日：2021-11-18
申请号：US16953431
申请日：2020-11-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Kyung LEE , Yong Suk KIM , Sang Kee YOON , Chang Hyun LIM , Tae Hun LEE , Jin Woo YI
Abstract: A bulk-acoustic wave resonator includes a resonator, including a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on a substrate; and an insertion layer disposed below the piezoelectric layer, and configured to partially elevate the piezoelectric layer and the second electrode, wherein the insertion layer may be formed of a material containing silicon (Si), oxygen (O), and nitrogen (N).
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公开(公告)号：US20210313955A1
公开(公告)日：2021-10-07
申请号：US16942913
申请日：2020-07-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Chang Hyun LIM , Sang Hyun YI , Yong Suk KIM , Sung Jun LEE , Jae Hyoung GIL , Dong Hyun PARK
Abstract: A bulk acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a protective layer disposed to cover at least the metal pad.
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公开(公告)号：US20170349493A1
公开(公告)日：2017-12-07
申请号：US15355205
申请日：2016-11-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Kyung JOO , Yong Suk KIM , Taek Jung LEE , Doo Young KIM , Ik Hwan CHANG
IPC: C04B35/117 , C04B35/64 , H01B3/12 , H01B19/00
CPC classification number: C04B35/117 , C04B35/111 , C04B35/62645 , C04B35/64 , C04B2235/3217 , C04B2235/3232 , C04B2235/3418 , C04B2235/442 , C04B2235/5436 , C04B2235/5445 , C04B2235/6025 , C04B2235/656 , C04B2235/6582 , C04B2235/785 , H01B3/12 , H01B19/00
Abstract: An insulator composition includes Al2O3 having a particle size of 120 to 500 nm. The insulator composition has a strength of 400 to 740 MPa and a particle size of 1 μm or less.
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