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公开(公告)号：US20240080011A1
公开(公告)日：2024-03-07
申请号：US18112609
申请日：2023-02-22
发明人： Moon Chul LEE , Jae Hyoung GIL , Kwang Su KIM , Sung Jun LEE , Yong Suk KIM , Dong Hyun PARK , Tae Kyung LEE
摘要： A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 Å to 500 Å. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.
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公开(公告)号：US20180205360A1
公开(公告)日：2018-07-19
申请号：US15812842
申请日：2017-11-14
发明人： Won HAN , Dae Ho KIM , Yong Suk KIM , Seung Hun HAN , Moon Chul LEE , Chang Hyun LIM , Sung Jun LEE , Sang Kee YOON , Tae Yoon KIM , Sang Uk SON
CPC分类号： H03H9/02118 , H03H3/02 , H03H9/02015 , H03H9/02157 , H03H9/132 , H03H9/17 , H03H9/173 , H03H9/174 , H03H2003/021 , H03H2003/023
摘要： A bulk acoustic wave resonator includes: a substrate; a membrane layer forming a cavity together with the substrate; a lower electrode disposed on the membrane layer; a piezoelectric layer disposed on a flat surface of the lower electrode; and an upper electrode covering a portion of the piezoelectric layer and exposing a side of the piezoelectric layer to air, wherein the piezoelectric layer includes a step portion extended from the side of the piezoelectric layer and disposed on the flat surface of the lower electrode.
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公开(公告)号：US20180152168A1
公开(公告)日：2018-05-31
申请号：US15789024
申请日：2017-10-20
发明人： Won HAN , Chang Hyun LIM , Yong Suk KIM , Seung Hun HAN , Sung Jun LEE , Sang Kee YOON , Tae Yoon KIM
IPC分类号： H03H9/02 , H03H9/17 , H01L41/047
CPC分类号： H03H9/02007 , H01L41/047 , H03H9/02015 , H03H9/02118 , H03H9/02157 , H03H9/17 , H03H9/173 , H03H9/174 , H03H9/54
摘要： A bulk acoustic wave resonator includes a membrane layer, together with a substrate, forming a cavity, a lower electrode disposed on the membrane layer, a piezoelectric layer disposed on a flat surface of the lower electrode and an upper electrode covering a portion of the piezoelectric layer. An overall region at a side of the piezoelectric layer is exposed to the air. The side of the piezoelectric layer has a gradient of 65° to 90° with respect to a top surface of the lower electrode.
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公开(公告)号：US20140133107A1
公开(公告)日：2014-05-15
申请号：US14078033
申请日：2013-11-12
发明人： Geon Se CHANG , Sung Kwon WI , Yong Suk KIM
IPC分类号： H05K1/16
CPC分类号： H05K1/165 , H01F17/0013 , H05K3/0052 , H05K2201/09672 , H05K2203/061 , Y10T29/4902
摘要： Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.
摘要翻译： 本文公开了一种薄膜型芯片器件，包括：层叠在基板上的多个单位电路结构; 以及将单元电路结构彼此粘合的粘合剂层。
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公开(公告)号：US20130112651A1
公开(公告)日：2013-05-09
申请号：US13670991
申请日：2012-11-07
发明人： Sang Moon LEE , Sung Kwon WI , Jeong Bok KWAK , Young Seuck YOO , Yong Suk KIM
IPC分类号： H01F41/04
CPC分类号： H01F41/04 , H01F41/046
摘要： The present invention discloses a method for manufacturing coil parts including a ferrite substrate, a conductor line formed on the ferrite substrate, and an external electrode for external electrical connection of the conductor line, including: coating a magnetic layer to cover the external electrode; planarizing a surface of the magnetic layer by mechanical polishing so that a portion of the magnetic layer remains on the external electrode; and exposing the external electrode by removing the remaining magnetic layer by chemical polishing.According to the present invention, it is possible to reduce planarization process time and cost by simplifying a process of planarizing the magnetic layer and improve productivity and reliability of products by preventing stress and damage to the external electrode occurred in the planarization process.
摘要翻译： 本发明公开了一种线圈部件的制造方法，其特征在于，包括：铁氧体基板，形成在所述铁氧体基板上的导体线和所述导线的外部电连接用的外部电极，包括：涂覆磁性层以覆盖所述外部电极; 通过机械抛光使磁性层的表面平坦化，使得一部分磁性层保留在外部电极上; 并通过化学抛光除去剩余的磁性层来暴露外部电极。 根据本发明，通过简化平面化磁性层的处理并且通过防止在平坦化处理中发生的外部电极的应力和损坏来提高产品的生产率和可靠性，可以减少平坦化处理时间和成本。
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公开(公告)号：US20190356293A1
公开(公告)日：2019-11-21
申请号：US16400052
申请日：2019-05-01
发明人： Yong Suk KIM , Moon Chul LEE , Sung Jun LEE , Chang Hyun LIM , Jae Hyoung GIL , Sang Hyun YI
摘要： A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.
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公开(公告)号：US20160007486A1
公开(公告)日：2016-01-07
申请号：US14754261
申请日：2015-06-29
发明人： Yong Suk KIM , Taek Jung LEE , Byeung Gyu CHANG , Doo Young KIM , Byoung Hwa LEE
CPC分类号： H05K3/30 , H01L21/4857 , H01L21/486 , H01L21/52 , H01L23/055 , H01L23/24 , H01L23/31 , H01L23/49822 , H01L23/49827 , H01L2924/181 , H05K5/0095 , H01L2924/00012
摘要： There is provided a package substrate including: a substrate on which a circuit layer and an insulating layer are stacked; a metal post provided in an outside region of at least any one of an upper surface and a lower surface of the substrate; an electronic component mounted in a cavity formed by the metal post; and a metal lid bonded to an upper portion of the metal post.
摘要翻译： 提供一种封装基板，包括：基板，其上层叠有电路层和绝缘层; 设置在所述基板的上表面和下表面中的至少任一个的外部区域中的金属柱; 安装在由所述金属柱形成的空腔中的电子部件; 以及金属盖，其结合到金属柱的上部。
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公开(公告)号：US20150294785A1
公开(公告)日：2015-10-15
申请号：US14729677
申请日：2015-06-03
发明人： Yong Suk KIM , Sung Kwon WI , Jeong Bok KWAK , Sang Moon LEE , Won Chul SIM , Young Seuck YOO
CPC分类号： H01F41/0206 , B32B37/24 , B32B38/04 , B32B2037/243 , B32B2038/047 , B32B2457/00 , H01F17/0013 , H01F17/0033 , H01F2017/0093 , H03H7/427 , H03H2001/0057 , H03H2001/0085 , Y10T156/1057
摘要： The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.
摘要翻译： 共模滤波器及其制造方法技术领域本发明涉及共模滤波器及其制造方法。 为了实现低收缩率，高基板烧结密度和高强度的共模滤波器，本发明提供一种共模滤波器，包括：下基板; 绝缘层，其内部具有导体图案并设置在下基板上; 设置在所述绝缘层上的上基板; 以及由铁氧体制成的铁氧体磁芯及其制造方法，该铁氧体磁芯通过贯穿绝缘层，下基板和上基板而设置在绝缘层，下基板和上基板的中心。
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9.发明申请MULTILAYER INDUCTOR AND PROTECTING LAYER COMPOSITION FOR MULTILAYER INDUCTOR 审中-公开多层电感器的多层电感器和保护层组成公开(公告)号：US20140028430A1
公开(公告)日：2014-01-30
申请号：US13831204
申请日：2013-03-14
发明人： Sang Moon LEE , Young Seuck YOO , Jeong Bok KWAK , Yong Suk KIM , Young Do KWEON , Sung Kwon WI
IPC分类号： H01F27/00
CPC分类号： H01F27/00 , H01F17/0013 , H01F27/292 , H01F27/327
摘要： Disclosed herein are a multilayer inductor including a protecting layer including an inorganic filler having different stretching ratios in traverse and mechanical directions or an inorganic filler coated with a color former, and a protecting layer composition of a multilayer inductor, including 10 to 30 parts by weight of an inorganic filler having different stretching ratios in traverse and mechanical directions, and 10 to 30 parts by weight of a dispersant, based on 100 parts by weight of an epoxy resin, so that thermal deformation of an inductor chip can be reduced by including the inorganic filler having different stretching ratios in traverse and machine directions in the outermost insulating layer of the multilayer inductor, thereby reducing change in external appearance due to heat, thereby providing a multilayer inductor securing reliability.
摘要翻译： 本文公开了一种多层电感器，其包括保护层，其包括在横向和机械方向上具有不同拉伸比的无机填料或涂有成色剂的无机填料，以及多层电感器的保护层组合物，其包含10至30重量份 的在横向和机械方向上具有不同拉伸比的无机填料和基于100重量份环氧树脂的10至30重量份分散剂，使得可以通过包括 无机填料在多层电感器的最外绝缘层中的横向和纵向上具有不同的拉伸比，从而减少由于热量引起的外观变化，从而提供了确保可靠性的多层电感器。
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公开(公告)号：US20140002231A1
公开(公告)日：2014-01-02
申请号：US13827661
申请日：2013-03-14
发明人： Sang Moon LEE , Sung Kwon WI , Jun Hee BAE , Young Do KWEON , Yong Suk KIM
IPC分类号： H01F3/08
CPC分类号： H01F3/08 , H01F27/255 , H01F2017/0093
摘要： Disclosed herein is a common mode noise filter independently including ferrite powder having pores formed in a surface thereof or including at least two kinds of ferrite powder having different particle sizes as a magnetic layer.According to the present invention, the adhesive strength between the polymer binder and the ferrite powder that are included in the magnetic layer is improved, such that at the time of manufacturing or mounting of a chip, a defect such as a crack generated by a thermal impact due to a lack of adhesive strength between the ferrite powder and the polymer binder may be suppressed, thereby securing the reliability with respect to the thermal impact.
摘要翻译： 本文公开了一种共模噪声滤波器，其独立地包括在其表面形成有孔的铁氧体粉末或者包括至少两种具有不同粒径的铁氧体粉末作为磁性层。 根据本发明，包含在磁性层中的聚合物粘合剂和铁氧体粉末之间的粘合强度得到改善，使得在制造或安装芯片时，由热量产生的裂纹等缺陷 可以抑制由于铁氧体粉末和聚合物粘合剂之间的粘合强度的不足而引起的冲击，从而确保了相对于热冲击的可靠性。
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