公开(公告)号：US20180106617A1

公开(公告)日：2018-04-19

申请号：US15858909

申请日：2017-12-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Daniele PRATI ,  Carlo VALZASINA ,  Luca Giuseppe FALORNI ,  Matteo Fabio BRUNETTO

IPC: G01C19/5733 ,  G01C19/5762 ,  G01C19/5747

Abstract: A microelectromechanical gyroscope includes: a substrate; a stator sensing structure fixed to the substrate; a first mass elastically constrained to the substrate and movable with respect to the substrate in a first direction; a second mass elastically constrained to the first mass and movable with respect to the first mass in a second direction; and a third mass elastically constrained to the second mass and to the substrate and capacitively coupled to the stator sensing structure, the third mass being movable with respect to the substrate in the second direction and with respect to the second mass in the first direction.

公开(公告)号：US20170088416A1

公开(公告)日：2017-03-30

申请号：US15083034

申请日：2016-03-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro TOCCHIO ,  Carlo VALZASINA ,  Luca GUERINONI ,  Giorgio ALLEGATO

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00325 ,  B81C2203/0792 ,  H01L23/055 ,  H01L23/13 ,  H01L23/16 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/3511 ,  H01L2924/00012

Abstract: An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.

公开(公告)号：US20160313123A1

公开(公告)日：2016-10-27

申请号：US15201133

申请日：2016-07-01

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Carlo VALZASINA ,  Luca Giuseppe FALORNI

IPC: G01C19/5712 ,  G01C19/5747

CPC classification number: G01C19/5712 ,  G01C19/56 ,  G01C19/5719 ,  G01C19/574 ,  G01C19/5747

Abstract: A microelectromechanical gyroscope, includes: a supporting body; a first movable mass and a second movable mass, which are oscillatable according to a first driving axis and tiltable about respective a first and second sensing axes and are symmetrically arranged with respect to a center of symmetry; first sensing electrodes and a second sensing electrodes associated with the first and second movable masses and arranged on the supporting body symmetrically with respect to the first and second sensing axis, the first and second movable masses being capacitively coupled to the respective first sensing electrode and to the respective second sensing electrode, a bridge element elastically coupled to respective inner ends of the first movable mass and of the second movable mass and coupled to the supporting body so as to be tiltable about an axis transverse to the first driving axis.

公开(公告)号：US20150082856A1

公开(公告)日：2015-03-26

申请号：US14498966

申请日：2014-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario PACI ,  Francesco PROCOPIO ,  Carlo VALZASINA ,  Paolo ANGELINI ,  Francesco DIAZZI ,  Roberto Pio BAORDA ,  Danilo Karim KADDOURI

IPC: G01D18/00 ,  H05B3/16 ,  G01K13/00

CPC classification number: G01D18/00 ,  B81B2207/012 ,  B81B2207/03 ,  B81C99/003 ,  G01K13/00 ,  G01R33/0017 ,  G01R33/09 ,  H05B3/16

Abstract: An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.

Abstract translation: 一种集成传感器装置，包括第一管芯，容纳传感器元件以检测传感器装置外部的量并将外部量转换成电感测信号; 机械地耦合到第一模具的第二模具，使得第一和第二模具沿着同一轴线彼此堆叠; 以及集成在第一管芯和/或第二管芯中的至少一个电阻型加热器，具有第一导电端子和第二导电端子，该第二导电端子被配置为耦合信号发生器的相应的第一和第二导电端子，用于引起电流 在使用中在加热器的第一和第二导电端子之间流动，并通过焦耳效应产生热量。 可以在传感器元件的温度下进行校准。