Abstract:
The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.
Abstract:
Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.
Abstract:
Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode.
Abstract:
The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.
Abstract:
The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
Abstract:
Disclosed herein is a common mode filter with an ESD protection pattern built therein. The common mode filter includes a base substrate that is made of an insulating material, a first insulating layer that is formed on the base substrate, a coil-shaped internal electrode that is formed on the first insulating layer, a second insulating layer that is formed on the internal electrode, a first external electrode terminal that is formed on the second insulating layer, a first ferrite resin layer that is formed on the second insulating layer and receives the first external electrode terminal, an ESD protection pattern that is formed on the first external electrode terminal, a second external electrode terminal that is formed on the ESD protection pattern, and a second ferrite resin layer that is formed on the first ferrite resin layer and receives the second external electrode terminal.
Abstract:
Disclosed herein is a common mode filter with an ESD protection pattern built therein. The common mode filter includes a base substrate that is made of an insulating material, a first insulating layer that is formed on the base substrate, a coil-shaped internal electrode that is formed on the first insulating layer, a second insulating layer that is formed on the internal electrode, a first external electrode terminal that is formed on the second insulating layer, a first ferrite resin layer that is formed on the second insulating layer and receives the first external electrode terminal, an ESD protection pattern that is formed on the first external electrode terminal, a second external electrode terminal that is formed on the ESD protection pattern, and a second ferrite resin layer that is formed on the first ferrite resin layer and receives the second external electrode terminal.
Abstract:
A transparent electrode includes: a substrate, a first electrode layer formed on the substrate, and a graphene oxide layer formed on and/or under the first electrode layer, and an electronic material for same. The transparent electrode includes graphene oxide layers on and under a conductor and/or a semiconductor to maintain a resistance measured on a surface of a graphene oxide layer in a transparent electrode including the graphene oxide layer almost equal to a resistance of a conductor and/or a semiconductor while showing characteristics of an insulator between conductors or semiconductors or between a conductor and a semiconductor which are separated from each other. Further, the graphene oxide layer performs a role of a barrier layer to protect the transparent electrode, thus preventing deterioration of characteristics of the transparent electrode and improving long-term reliability and transmittance.
Abstract:
The present invention discloses a coil part including: a lower magnetic body; primary and secondary lower patterns formed on the lower magnetic body in a spiral shape in parallel to each other; a lower insulating layer covering the primary and secondary lower patterns; primary and secondary upper patterns electrically connected to the primary and secondary lower patterns, respectively, and formed on the lower insulating layer in a spiral shape in parallel to each other to correspond to the primary and secondary lower patterns; and an upper magnetic body formed on the primary and secondary upper patterns, wherein the primary and secondary upper patterns have portions which cross the primary and secondary lower patterns on the plane, and a method of manufacturing the same.
Abstract:
A piezoelectric element driving apparatus may apply a predetermined driving signal to a piezoelectric element to drive the piezoelectric element. The driving signal may be an asymmetrical waveform in which amplitudes of first and second polarities thereof are different from each other. An exemplary embodiment in the present disclosure may provide a piezoelectric element driving apparatus and method having a high output while protecting dielectric characteristics of a piezoelectric element by driving the piezoelectric element using an asymmetrical driving signal.