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    MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR
    21.
    发明申请
    MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR 有权
    多层陶瓷电容器，具有多层陶瓷电容器的电路板的安装结构，多层陶瓷电容器的包装单元

    公开(公告)号：US20140133064A1

    公开(公告)日：2014-05-15

    申请号：US13764193

    申请日：2013-02-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Sang Soo PARK ,  Min Cheol PARK ,  Byoung Hwa LEE

    IPC: H01G4/01

    CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/38 ,  H05K1/111

    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.

    Abstract translation: 提供一种多层陶瓷电容器，包括：陶瓷体; 包括多个第一和第二内部电极的有源层; 上盖层; 形成在有源层下面的下覆盖层，下覆盖层比上盖层厚; 第一和第二外部电极; 在下覆盖层内重复形成至少一对第一和第二内部电极，其中当A定义为陶瓷体总厚度的1/2时，B定义为下覆盖层的厚度，C被定义 作为有源层的总厚度的1/2，D定义为上覆盖层的厚度，有源层的中心与陶瓷体的中心之间的偏差比（B + C）/ A ，满足1.063＆nlE;（B + C）/A≦̸1.745。

    MULTILAYERED CHIP ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME
    22.
    发明申请
    MULTILAYERED CHIP ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME 有权
    多层芯片电子元件和板安装相同

    公开(公告)号：US20140116766A1

    公开(公告)日：2014-05-01

    申请号：US13902521

    申请日：2013-05-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byung Jun JEON ,  Byoung Hwa LEE ,  Hyun Hee GU ,  Chang Hoon KIM ,  Young Ghyu AHN

    IPC: H05K1/18

    CPC classification number: H05K3/3442 ,  H01G2/065 ,  H01G4/232 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    Abstract: There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers.

    Abstract translation: 提供一种多层芯片电子部件，其包括：陶瓷体，其包括内部电极和电介质层; 外部电极在长度方向覆盖陶瓷体的两端面; 形成外部电极并形成在陶瓷体的外表面上的第一镀层; 形成在第一镀层的外侧表面上的非导电层; 以及形成在除了非导电层之外的第一镀层的区域上的第二镀层。

    ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    23.
    发明申请
    ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 有权
    电子元件及其制造方法

    公开(公告)号：US20130250476A1

    公开(公告)日：2013-09-26

    申请号：US13737504

    申请日：2013-01-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hae Sock CHUNG ,  Byoung Hwa LEE ,  Eun Hyuk CHAE ,  Min Cheol PARK

    IPC: H01G4/01

    CPC classification number: H01G4/012 ,  H01G4/232 ,  H01G4/30

    Abstract: There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t1 and t2 of the first and second internal electrodes is 0.9 μm or less, while a roughness R1 of the first internal electrode is lower than a roughness R2 of the second internal electrode.

    Abstract translation: 提供了电子部件及其制造方法。 电子部件包括：陶瓷主体，其包括长度方向的端面，宽度方向的侧面和厚度方向的上下表面; 第一和第二外部电极分别形成在端面上; 分别形成在侧表面上的第三和第四外部电极; 第一内部电极，形成在陶瓷主体内并连接到第一和第二外部电极; 和与第一内部电极交替布置的第二内部电极，同时在其间插入陶瓷层，并且连接到第三和第四外部电极，其中第一和第二内部电极的厚度t1和t2为0.9μm或更小，而 第一内部电极的粗糙度R1低于第二内部电极的粗糙度R2。

    MULTILAYER CERAMIC CAPACITOR
    27.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号：US20150325370A1

    公开(公告)日：2015-11-12

    申请号：US14558717

    申请日：2014-12-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Hwa LEE ,  Young Key KIM ,  Min Cheol PARK ,  Young Ghyu AHN

    IPC: H01G2/14 ,  H01G4/12 ,  H01G4/008 ,  H01G4/248 ,  H01G4/012 ,  H01G2/16 ,  H01G4/30

    CPC classification number: H01G2/14 ,  H01G2/16 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor may include: a ceramic body; a plurality of first internal electrodes disposed in the ceramic body; a plurality of second internal electrodes stacked alternately with the first internal electrodes in the ceramic body; first and second external electrodes connected to the first internal electrodes, respectively; a third external electrode extended from one side surface of the ceramic body to a portion of a surface opposing a mounting surface of the ceramic body and connected to the second internal electrodes; a fourth external electrode extended from the other side surface of the ceramic body to a portion of the surface opposing the mounting surface of the ceramic body; and an intermitting part disposed on the surface opposing the mounting surface of the ceramic body and connecting the third and fourth external electrodes to each other.

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体; 设置在所述陶瓷体中的多个第一内部电极; 与陶瓷体中的第一内部电极交替堆叠的多个第二内部电极; 分别连接到第一内部电极的第一和第二外部电极; 第三外部电极，从陶瓷体的一个侧表面延伸到与陶瓷体的安装表面相对的表面的与第二内部电极相连接的部分; 从陶瓷体的另一侧表面延伸到与陶瓷体的安装表面相对的表面的一部分的第四外部电极; 以及设置在与陶瓷体的安装面相对的表面上并将第三和第四外部电极彼此连接的间隔部分。

    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME
    29.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME 有权
    多层陶瓷电容器和具有该陶瓷电容器的电路板

    公开(公告)号：US20150302992A1

    公开(公告)日：2015-10-22

    申请号：US14335613

    申请日：2014-07-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Hwa LEE ,  Jin Man JUNG ,  Jin Woo LEE ,  Eun Sang NA ,  Young Don CHOI

    IPC: H01G4/30 ,  H05K1/18 ,  H01G4/12 ,  H01G4/012 ,  H01G4/248

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: There are provided a multilayer ceramic capacitor and a circuit board having the same. The multilayer ceramic capacitor may include: first and second internal electrodes connected to first and second external electrodes, respectively, and disposed to face each other; and third and fourth internal electrodes connected to the first and second external electrodes, respectively, and disposed to face each other, a connection area of the third and fourth internal electrodes with the first and second external electrodes being different from that of the first and second internal electrodes with the first and second external electrodes, and the first and second external electrodes including first and second conductive layers disposed in inner portions thereof and first and second conductive resin layers disposed in outer portions thereof, respectively.

    Abstract translation: 提供了一种多层陶瓷电容器和具有该多层陶瓷电容器的电路板。 多层陶瓷电容器可以包括：第一和第二内部电极，分别连接到第一外部电极和第二外部电极并且彼此面对设置; 以及第三和第四内部电极，分别与第一外部电极和第二外部电极相连并且彼此相对配置，第三和第四内部电极与第一和第二外部电极的连接区域与第一和第二外部电极的连接区域不同于第一和第二外部电极的连接区域 具有第一外部电极和第二外部电极的内部电极，第一外部电极和第二外部电极分别包括设置在其内部的第一和第二导电层以及设置在其外部的第一和第二导电树脂层。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
    30.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME 有权
    多层陶瓷电容器及具有相同功能的电路板

    公开(公告)号：US20150114705A1

    公开(公告)日：2015-04-30

    申请号：US14527662

    申请日：2014-10-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Hyun Tae KIM ,  Hwi Geun IM ,  Jin KIM ,  Kyo Kwang LEE ,  Byoung Hwa LEE

    IPC: H01G4/005 ,  H01G4/30 ,  H01G4/012 ,  H01G2/06 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248

    Abstract: There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from each other and connected to lead portions of internal electrodes, wherein an interval between adjacent lead portions is 500.7 μm or less, widths of one-side margin portions of the external electrodes in a length direction of the ceramic body that are not in contact with the corresponding lead portions are 20.2 μm or more.

    Abstract translation: 提供了多层陶瓷电容器和具有该多层陶瓷电容器的电路板。 多层陶瓷电容器可以包括：三个外部电极，设置在陶瓷体的安装表面上，彼此间隔开并连接到内部电极的引线部分，其中相邻引线部分之间的间隔为500.7μm或更小， 外部电极在不与相应引线部分接触的陶瓷体的长度方向上的一侧边缘部分为20.2μm以上。

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