Methods of Fabricating Semiconductor Devices Having Punch-Through Stopping Regions
    22.
    发明申请
    Methods of Fabricating Semiconductor Devices Having Punch-Through Stopping Regions 有权
    制造具有穿通停止区域的半导体器件的方法

    公开(公告)号:US20150044829A1

    公开(公告)日:2015-02-12

    申请号:US14454943

    申请日:2014-08-08

    Abstract: Methods of fabricating semiconductor devices are provided including providing a substrate having a first region and a second region, the substrate defining trenches in the first and second regions; forming active fins on the first and second regions, the active fins protruding from the trenches in the first and second regions; forming spacers on sidewalls of the active fins in the first and second regions; recessing floors of the trenches under the spacers to provide extensions of the active fins; implanting impurities of a first type in the extensions of the active fins in the first region; and implanting impurities of a second, type, different from the first type, in the extensions of the active fins in the second region.

    Abstract translation: 提供制造半导体器件的方法包括提供具有第一区域和第二区域的衬底,所述衬底限定第一和第二区域中的沟槽; 在所述第一和第二区域上形成活动翅片,所述活动翅片从所述第一和第二区域中的沟槽突出; 在所述第一和第二区域中的活动翅片的侧壁上形成间隔物; 在间隔物下方的沟槽的凹陷地板,以提供活动鳍片的延伸; 将第一类型的杂质植入第一区域中活性鳍片的延伸部分; 以及将第二类型的不同于第一类型的杂质植入第二区域中的活性鳍片的延伸部分。

    Methods of fabricating semiconductor devices having punch-through stopping regions
    26.
    发明授权
    Methods of fabricating semiconductor devices having punch-through stopping regions 有权
    制造具有穿通停止区域的半导体器件的方法

    公开(公告)号:US09184293B2

    公开(公告)日:2015-11-10

    申请号:US14454943

    申请日:2014-08-08

    Abstract: Methods of fabricating semiconductor devices are provided including providing a substrate having a first region and a second region, the substrate defining trenches in the first and second regions; forming active fins on the first and second regions, the active fins protruding from the trenches in the first and second regions; forming spacers on sidewalls of the active fins in the first and second regions; recessing floors of the trenches under the spacers to provide extensions of the active fins; implanting impurities of a first type in the extensions of the active fins in the first region; and implanting impurities of a second, type, different from the first type, in the extensions of the active fins in the second region.

    Abstract translation: 提供制造半导体器件的方法包括提供具有第一区域和第二区域的衬底,所述衬底限定第一和第二区域中的沟槽; 在所述第一和第二区域上形成活动翅片,所述活动翅片从所述第一和第二区域中的沟槽突出; 在所述第一和第二区域中的活动翅片的侧壁上形成间隔物; 在间隔物下方的沟槽的凹陷地板,以提供活动鳍片的延伸; 将第一类型的杂质植入第一区域中活性鳍片的延伸部分; 以及将第二类型的不同于第一类型的杂质植入第二区域中的活性鳍片的延伸部分。

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