公开(公告)号：US12190995B2

公开(公告)日：2025-01-07

申请号：US18455904

申请日：2023-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byunghoon Jeong ,  Kyungtae Kang ,  Jangwoo Lee ,  Jeongdon Ihm

IPC: G11C7/22 ,  G11C7/10 ,  G11C8/18 ,  G11C29/42 ,  H03K19/173

Abstract: A memory device includes a memory cell array configured to store data; and a data output circuit configured to transmit status data to an external device through at least one data line in a latency period in response to a read enable signal received from the external device and transmit the data read from the memory cell array to the external device through the at least one data line in a period subsequent to the latency period.

公开(公告)号：US12132792B2

公开(公告)日：2024-10-29

申请号：US17486793

申请日：2021-09-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonbo Lee ,  Youngki Hong ,  Sangcheol Lee ,  Songyean Cho ,  Jungsam Kim ,  Sojeong Park ,  Jangwoo Lee

IPC: H04L67/51 ,  H04L61/4511 ,  H04L67/01 ,  H04L67/52 ,  H04L67/561

CPC classification number: H04L67/51 ,  H04L61/4511 ,  H04L67/01 ,  H04L67/52 ,  H04L67/561

Abstract: Various embodiments of the present invention provide a method and electronic device for supporting an edge computing service (e.g., a multi-access edge computing (MEC) service). An electronic device according to various embodiments comprises a network interface, and a processor, wherein the processor is configured to: acquire, using the network interface, information relating to applications which can be provided within a base station or to at least one external server connectable through the base station by the at least one external server; select an external server including an application corresponding to a specified condition, on the basis of the information relating to the applications; and perform data transmission with the selected external server. Various embodiments are possible.

公开(公告)号：US11437293B2

公开(公告)日：2022-09-06

申请号：US16928159

申请日：2020-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongho Kim ,  Jongbo Shim ,  Hwanpil Park ,  Jangwoo Lee

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package is disclosed. The disclosed semiconductor package includes a substrate having bonding pads at an upper surface thereof, a lower semiconductor chip, at least one upper semiconductor chip disposed on the lower semiconductor chip, and a dam structure having a closed loop shape surrounding the lower semiconductor chip. The dam structure includes narrow and wide dams disposed between the lower semiconductor chip and the bonding pads. The wide dam has a greater inner width than the narrow dam. The semiconductor packages further includes an underfill disposed inside the dam structure and being filled between the substrate and the lower semiconductor chip.

公开(公告)号：US11367714B2

公开(公告)日：2022-06-21

申请号：US16845567

申请日：2020-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangwoo Lee ,  Jongbo Shim ,  Ji Hwang Kim ,  Yungcheol Kong ,  Youngbae Kim ,  Taehwan Kim ,  Hyunglak Ma

IPC: H01L25/10 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.

公开(公告)号：US11134127B2

公开(公告)日：2021-09-28

申请号：US16938824

申请日：2020-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonbo Lee ,  Youngki Hong ,  Sangcheol Lee ,  Songyean Cho ,  Jungsam Kim ,  Sojeong Park ,  Jangwoo Lee

IPC: G06F15/16 ,  H04L29/08 ,  H04L29/12 ,  H04L29/06

Abstract: Various embodiments of the present invention provide a method and electronic device for supporting an edge computing service (e.g., a multi-access edge computing (MEC) service). An electronic device according to various embodiments comprises a network interface, and a processor, wherein the processor is configured to: acquire, using the network interface, information relating to applications which can be provided within a base station or to at least one external server connectable through the base station by the at least one external server; select an external server including an application corresponding to a specified condition, on the basis of the information relating to the applications; and perform data transmission with the selected external server. Various embodiments are possible.

公开(公告)号：US10796488B2

公开(公告)日：2020-10-06

申请号：US16057952

申请日：2018-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangwoo Lee ,  Suhyun Na ,  Taeho Wang ,  Sunmi Jin

IPC: G06T19/00

Abstract: An electronic device and method are disclosed. The electronic device includes a processor which implements the method, including displaying a virtual environment in which a first device is disposed on a display, the virtual environment simulating a real environment, detecting by at least one processor virtual environment information about the virtual environment, detecting virtual device information about the first device disposed in the virtual environment and at least one second device disposed in the virtual environment, determining a setting value for the first device based on at least one of the virtual environment information and the virtual device information, and storing the determined setting value in a memory.

公开(公告)号：US09897650B2

公开(公告)日：2018-02-20

申请号：US14957987

申请日：2015-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehoon Na ,  ChaeHoon Kim ,  HyunJin Kim ,  Jangwoo Lee ,  Jeongdon Ihm

IPC: G01R31/28 ,  G01R31/3177 ,  G01R31/317

CPC classification number: G01R31/31716 ,  G01R31/2884 ,  G01R31/3177

Abstract: An integrated circuit including first pads and second pads, a first receiver circuit and a first driver circuit respectively connected to the first pad, a second receiver circuit and a second driver circuit respectively connected to the second pad, and a first loopback circuit having a first input terminal electrically connected to the first receiver circuit, a first output terminal electrically connected to the first driver circuit, a second output terminal electrically connected to the second driver circuit, and a second input terminal electrically connected to the second receiver circuit may be provided. At a normal mode, the first loopback circuit electrically connects the first input terminal to the second output terminal and electrically connects the second input terminal to the first output terminal. At a test mode, the first loopback circuit electrically connects the first input terminal to the first output terminal.

公开(公告)号：US09748956B2

公开(公告)日：2017-08-29

申请号：US14960748

申请日：2015-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangwoo Lee ,  HyunJin Kim ,  Daehoon Na ,  Jeongdon Ihm

IPC: H03K17/16 ,  H03K19/003 ,  H03K19/0175 ,  G11C7/04 ,  G11C7/10 ,  G11C29/02 ,  G11C16/04

CPC classification number: H03K19/017545 ,  G11C7/04 ,  G11C7/1069 ,  G11C7/1096 ,  G11C16/0483 ,  G11C29/022 ,  G11C29/028 ,  G11C2207/105 ,  G11C2207/108

Abstract: An integrated circuit includes an input/output pad, a driver circuit connected to the input/output pad, and a receiver circuit connected to the input/output pad, and a code generator. The driver circuit is configured to output an output signal to an external device through the input/output pad. The receiver circuit is configured to receive an input signal from the external device through the input/output pad. The code generator is configured to generate a termination code of the external device in response to a signal output from the receiver circuit.

公开(公告)号：US12166831B2

公开(公告)日：2024-12-10

申请号：US17486793

申请日：2021-09-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonbo Lee ,  Youngki Hong ,  Sangcheol Lee ,  Songyean Cho ,  Jungsam Kim ,  Sojeong Park ,  Jangwoo Lee

IPC: H04L67/51 ,  H04L61/4511 ,  H04L67/01 ,  H04L67/52 ,  H04L67/561

Abstract: Various embodiments of the present invention provide a method and electronic device for supporting an edge computing service (e.g., a multi-access edge computing (MEC) service). An electronic device according to various embodiments comprises a network interface, and a processor, wherein the processor is configured to: acquire, using the network interface, information relating to applications which can be provided within a base station or to at least one external server connectable through the base station by the at least one external server; select an external server including an application corresponding to a specified condition, on the basis of the information relating to the applications; and perform data transmission with the selected external server. Various embodiments are possible.

公开(公告)号：US11769537B2

公开(公告)日：2023-09-26

申请号：US18069685

申请日：2022-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byunghoon Jeong ,  Kyungtae Kang ,  Jangwoo Lee ,  Jeongdon Ihm

IPC: G11C7/22 ,  G11C7/10 ,  H03K19/173 ,  G11C8/18 ,  G11C29/42

CPC classification number: G11C7/222 ,  G11C7/1057 ,  G11C7/1063 ,  G11C7/1084 ,  G11C8/18 ,  G11C29/42 ,  H03K19/1737

Abstract: A memory device includes a memory cell array configured to store data; and a data output circuit configured to transmit status data to an external device through at least one data line in a latency period in response to a read enable signal received from the external device and transmit the data read from the memory cell array to the external device through the at least one data line in a period subsequent to the latency period.