公开(公告)号：US10347819B2

公开(公告)日：2019-07-09

申请号：US15340330

申请日：2016-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongchul Park ,  Byoungjae Bae ,  Inho Kim ,  Shin Kwon ,  Eunsun Noh ,  Insun Park ,  Sangmin Lee

IPC: H01L27/22 ,  H01L43/08 ,  H01L21/033 ,  G11C11/16 ,  H01L43/02 ,  H01L43/10 ,  H01L43/12

Abstract: Methods of manufacturing a semiconductor device include forming a conductive layer on a substrate, forming an air gap or other cavity between the conductive layer and the substrate, and patterning the conductive layer to expose the air gap. The methods may further include forming conductive pillars between the substrate and the conductive layer. The air gap may be positioned between the conductive pillars.

公开(公告)号：US20250062266A1

公开(公告)日：2025-02-20

申请号：US18653664

申请日：2024-05-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyunghwan Oh ,  Sangmin Lee

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10

Abstract: A semiconductor package includes a redistribution substrate including a first surface and a second surface which are opposite to each other, a semiconductor chip on the first surface of the redistribution substrate, and a connection terminal on the second surface of the redistribution substrate. The redistribution substrate includes an insulating layer, a redistribution pattern in the insulating layer, and an under bump pattern between the redistribution pattern and the connection terminal. The under bump pattern includes a via portion penetrating the insulating layer and connected to the redistribution pattern, and a protrusion protruding into the insulating layer.

公开(公告)号：US12213270B2

公开(公告)日：2025-01-28

申请号：US17847315

申请日：2022-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongyu Hwang ,  Sangmin Lee ,  Myungjun Kim ,  Jongchul Choi

IPC: H05K5/04 ,  B29C45/14 ,  B29L31/34 ,  G06F1/16 ,  H05K5/02

Abstract: According to an embodiment of the disclosure, an electronic device may include: a housing defining at least one surface of the electronic device. The housing may include: a metal plate comprising at least one penetration hole, a first nonmetallic part combined with the metal plate and surrounding at least a part of a side surface of the metal plate, and a second nonmetallic part at least partially disposed in the at least one penetration hole and providing a part of the one surface.

公开(公告)号：US12165610B2

公开(公告)日：2024-12-10

申请号：US18097948

申请日：2023-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyounghwan Kwon ,  Wonseok Kim ,  Wangsuk Sung ,  Sangmin Lee ,  Seonmee Lee ,  Woonyoung Lee

IPC: G06F3/038 ,  G09G5/00

Abstract: An operating method of a display driver integrated circuit (DDI) includes determining whether a change to a level of a first logic voltage supplied to a logic circuit of the DDI is required, based on determining that a change to the level of the first logic voltage is required, transmitting a logic voltage setting command to a power management integrated circuit (PMIC), and receiving, from the PMIC, a second logic voltage having a level different from the first logic voltage and corresponding to the logic voltage setting command.

公开(公告)号：US11823961B2

公开(公告)日：2023-11-21

申请号：US17021087

申请日：2020-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhee Jeang ,  Boris Afinogenov ,  Sangwoo Bae ,  Wondon Joo ,  Maksim Riabko ,  Anton Medvedev ,  Aleksandr Shorokhov ,  Anton Sofronov ,  Ingi Kim ,  Taehyun Kim ,  Minhwan Seo ,  Sangmin Lee ,  Seulgi Lee

IPC: H01L21/66 ,  H01L21/67 ,  G01N21/95 ,  G01N21/64

CPC classification number: H01L22/12 ,  G01N21/648 ,  G01N21/9505 ,  H01L21/67288 ,  G01N2201/06113

Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.

公开(公告)号：US11789694B2

公开(公告)日：2023-10-17

申请号：US17682372

申请日：2022-02-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunkyoung Kim ,  Hyewon Seo ,  Dasom Kim ,  Ukhyun Kim ,  Kyunghui Oh ,  Sangmin Lee ,  Hoyeon Kim ,  Jung-Uk Lim ,  Hyunyoung Yang

IPC: G06F3/16 ,  G06F3/0484 ,  G06F3/0482

CPC classification number: G06F3/165 ,  G06F3/0482 ,  G06F3/0484 ,  G06F2203/04803

Abstract: An electronic device for controlling output of audio data, and an operation method thereof are provided. The electronic device includes a display, a communication interface, at least one processor, and a memory electrically connected to the processor, wherein the memory is configured to store instructions, and when executed, the instructions enable the at least one processor to perform setting the electronic device and at least one other electronic device as audio output devices of different applications, based on a user input, detecting a connection to the at least one other electronic device via the communication interface, and controlling the display to display information indicating that the electronic device and the at least one other electronic device are set as the audio output devices of different applications.

公开(公告)号：US11550365B2

公开(公告)日：2023-01-10

申请号：US16847794

申请日：2020-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo Kim ,  Bongsub Kim ,  Taewon Kim ,  Sangmin Lee ,  Jongheon Lee ,  Jiwoo Lee

IPC: G06F1/16 ,  H04N5/225 ,  H04M1/02 ,  G09F9/30

Abstract: According to an embodiment of the disclosure, an electronic device comprises a first housing structure; and a second housing structure hingedly connected to the first housing structure along a hinge axis, wherein a first surface of the first housing structure faces a first surface of the second housing structure in a folded configuration of the electronic device, and the first surface of the first housing structure and the first surface of the second housing structure are planar in an unfolded configuration of the electronic device; a first display disposed on the first surface of the first housing structure and the first surface of the second housing structure, and bendable about the hinge axis; and a sliding structure retractably disposed in the first housing structure, configured to protrude to the outside of the first housing structure in a direction substantially co-planar to the first surface of the first housing structure, the sliding structure comprising at least one optical input module facing a direction substantially orthogonal to the first surface.

公开(公告)号：US11513566B2

公开(公告)日：2022-11-29

申请号：US16804165

申请日：2020-02-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo Kim ,  Bongsub Kim ,  Taewon Kim ,  Sangmin Lee ,  Jongheon Lee ,  Jiwoo Lee

IPC: G06F1/16

Abstract: According to one aspect of the disclosure an electronic device comprises a foldable housing including: a hinge structure, a first housing structure connected to the hinge structure, and including a first face and a second face opposite the first face, and a second housing structure connected to the hinge structure and including a third face and a fourth face opposite the third face, the second housing structure being configured to be rotated about the hinge structure; a flexible display extending over the first face and over the third face; at least one sensor disposed within the foldable housing, and configured to sense an angle formed between the first face and the third face; a first haptic actuator disposed within the first housing structure; a second haptic actuator disposed within the second housing structure; at least one processor disposed within the first housing structure or the second housing structure, and operatively connected to the flexible display, the at least one sensor, the first haptic actuator, and the second haptic actuator. The at least one processor may detect a folding state of the foldable housing using the at least one sensor, and independently control the first haptic actuator and the second haptic actuator based on at least part of the detected folding state.

公开(公告)号：US11463563B2

公开(公告)日：2022-10-04

申请号：US16829340

申请日：2020-03-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewon Kim ,  Minsoo Kim ,  Bongsub Kim ,  Sangmin Lee ,  Jongheon Lee ,  Jiwoo Lee

IPC: H04M1/02 ,  H05K5/00 ,  F21V8/00 ,  H05K5/02

Abstract: An electronic device including an indicator is provided. The electronic device includes a first housing structure including a first face oriented in a first direction, and a second face oriented in a second direction opposite the first direction, a second housing structure including a third face oriented in a third direction, and a fourth face oriented in a fourth direction opposite the third direction, a hinge structure rotatably connecting the first housing structure and the second housing structure to each other, the hinge structure configured to provide a folding axis that is a rotating center of the first housing structure and the second housing structure, a flexible display extending from the first face to the third face across the hinge structure, and a hinge case disposed between the first housing structure and the second housing structure to accommodate the hinge structure therein to conceal or protect the hinge structure.

公开(公告)号：US11361899B2

公开(公告)日：2022-06-14

申请号：US16739564

申请日：2020-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngchang Yoon ,  Jaehyup Kim ,  Sangmin Lee

IPC: H01F27/29 ,  H03H7/38 ,  H03H7/06 ,  H03H7/01

Abstract: An apparatus is provided. The apparatus includes an electronic circuit for processing a differential signal. A device including an electronic circuit may include a first inductor and a second inductor that process a differential signal, a first circuit connected to the first inductor in parallel, a second circuit connected to the second inductor in parallel, and lines connecting the first inductor and the first circuit, the lines being disposed to pass through an area defined by the first inductor and the second inductor. The first inductor and the second inductor have symmetrical differential structures.