公开(公告)号：US11149234B2

公开(公告)日：2021-10-19

申请号：US16250069

申请日：2019-01-17

Applicant: Samsung Electronics Co., Ltd. ,  SEMES Co., Ltd.

Inventor： Mi Hyun Park ,  Jung-Min Oh ,  Young-Hoo Kim ,  Hyo San Lee ,  Tae Keun Kim ,  Ye Rim Yeon ,  Hae Rim Oh ,  Ji Soo Jeong ,  Min Hee Cho

IPC: B08B3/10 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  C11D17/00 ,  C11D3/28 ,  C11D3/20 ,  C11D3/34 ,  C11D3/32 ,  C11D1/14 ,  C11D1/12 ,  C11D1/29

Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.

公开(公告)号：US10991600B2

公开(公告)日：2021-04-27

申请号：US15848481

申请日：2017-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

IPC: H01L21/67 ,  H01L21/02

Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

公开(公告)号：US10576582B2

公开(公告)日：2020-03-03

申请号：US16029828

申请日：2018-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Hoo Kim ,  Il-Sang Lee ,  Yong-sun Ko ,  Chang-Gil Ryu ,  Kun-Tack Lee ,  Hyo-San Lee

IPC: H01L21/00 ,  B23K26/146 ,  B08B7/00 ,  B08B3/10 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687

Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.

公开(公告)号：US09852921B2

公开(公告)日：2017-12-26

申请号：US15175062

申请日：2016-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Hwan Kim ,  Ingi Kim ,  Mihyun Park ,  Young-Hoo Kim ,  Ui-soon Park ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

IPC: G01N15/06 ,  G01N33/00 ,  G01N33/48 ,  H01L21/311 ,  H01L21/67

CPC classification number: H01L21/31111 ,  H01L21/67086 ,  H01L21/67253 ,  H01L21/67288

Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.