公开(公告)号：US06419572B2

公开(公告)日：2002-07-16

申请号：US09924066

申请日：2001-08-07

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： B24D1100

CPC分类号： B24B37/26

摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization. Additionally, the selected pattern of micro-features may be reproduced from a master pattern of micro-features to duplicate the selected pattern on several sections of film so that a consistent planarizing surface may be provided for a large number of substrates.

公开(公告)号：US06352466B1

公开(公告)日：2002-03-05

申请号：US09144756

申请日：1998-08-31

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： B24B100

CPC分类号： B24B37/013 ,  B24B49/00 ,  H01L22/26

摘要： A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.

公开(公告)号：US06248001B1

公开(公告)日：2001-06-19

申请号：US09369740

申请日：1999-08-06

申请人： Bryan C. Carson ,  Scott E. Moore

发明人： Bryan C. Carson ,  Scott E. Moore

IPC分类号： B24B100

CPC分类号： B24B37/042 ,  H01L21/30625 ,  Y10S438/977 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1798

摘要： A method and apparatus for removing layers from a circuit side of a semiconductor die includes the use of a holder, for example a semiconductor wafer having an opening therein for receiving the semiconductor die. Additionally the holder can include one or more layers thereover which are removed at a similar rate as those layers which comprise the semiconductor die. A die is placed into the opening and a circuit side of the die is aligned with a front side of the holder, for example using a generally planar surface, and is secured to the holder with an adhesive material. Using a holder reduces uneven layer removal which is known to occur in conventional processing, for example excessive removal at the edges of the die. A potting jig which aids in aligning and securing the die to the holder is also described.

摘要翻译： 用于从半导体管芯的电路侧去除层的方法和装置包括使用保持器，例如其中具有用于接收半导体管芯的开口的半导体晶片。 另外，保持器可以包括其上的一个或多个层，其以与包括半导体管芯的层类似的速率移除。 将模具放置在开口中，并且模具的电路侧与保持器的前侧对齐，例如使用大致平坦的表面，并且用粘合剂材料固定到保持器。 使用保持器减少已知在常规加工中发生的不均匀层去除，例如在模具的边缘处的过度去除。 还描述了有助于将模具对准并固定到保持器的灌封夹具。

公开(公告)号：US06217727B1

公开(公告)日：2001-04-17

申请号：US09385381

申请日：1999-08-30

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： C25D1700

CPC分类号： C25D21/12 ,  C25D7/123 ,  C25D17/001

摘要： An electroplating apparatus is provided with a metal target and a device for supporting a semiconductor wafer (or other workpiece) in an electroplating solution. The target (anode) may be located relatively far from the wafer surface (cathode) at the beginning of the plating process, until a sufficient amount of metal is plated. When an initial amount of metal is built up on the wafer surface, the target may be moved closer to the wafer for faster processing. The movement of the target may be controlled automatically according to one or more process parameters.

摘要翻译： 电镀设备具有金属靶和用于在电镀溶液中支撑半导体晶片（或其它工件）的装置。 目标（阳极）可以在电镀过程开始时相对远离晶片表面（阴极），直至镀覆足够量的金属。 当在晶片表面上建立初始量的金属时，靶可以移动到更靠近晶片的位置，以加速处理。 可以根据一个或多个过程参数自动控制目标的移动。

公开(公告)号：US06213144B1

公开(公告)日：2001-04-10

申请号：US09382549

申请日：1999-08-25

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： F16K31122

CPC分类号： F16K1/123 ,  F16K31/1221 ,  Y10T137/1007 ,  Y10T137/3367 ,  Y10T137/5762

摘要： A flow control valve is made from a one-piece housing which defines a substantially linear flow path. The housing comprises deformable portions coupled to a valve seat and a poppet to allow relative motion therebetween for opening and closing the valve. The deformable portion may comprise a thinned section of a side wall of the housing.

公开(公告)号：US06193588B1

公开(公告)日：2001-02-27

申请号：US09146055

申请日：1998-09-02

申请人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

发明人： David W. Carlson ,  Scott A. Southwick ,  Scott E. Moore

IPC分类号： B24B2902

CPC分类号： B24B37/24 ,  B24B21/04 ,  B24D3/28

摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film. In one particular embodiment, the processing media may be an elongated web configured to extend between a supply roller and a take-up roller of a web-format planarizing machine having a plurality of individually driven substrate holders. The planarizing and finishing sections of this embodiment may be long strips of material extending lengthwise along a longitudinal axis of the web. The planarizing machine and elongated web may contemporaneously planarize and finish two or more substrates.

摘要翻译： 用于机械和/或化学机械平面化和清洁微电子衬底的方法和装置。 在一个实施例中，用于平面化和整理微电子衬底的处理介质具有平坦化部分，其具有由第一材料构成的第一主体和具有由第二材料组成的第二主体的精加工部分。 第一主体可以具有相对牢固的平坦化表面以接合基板，并且第一主体在平坦化表面处支撑研磨颗粒，以在平坦化循环期间从基板移除材料。 在精加工循环期间，第二主体可以具有相对柔软的抛光或精加工表面清洁磨料颗粒和其它物质从基底。 平面化和精加工部分可以固定地附接到背衬薄膜上，或者它们可以在具有或不具有背衬膜的邻接边缘处彼此附接。 在一个具体实施例中，处理介质可以是细长腹板，其被配置为在具有多个单独驱动的衬底保持器的幅材平面化机的供给辊和卷取辊之间延伸。 该实施例的平面化和精加工部分可以是沿着幅材的纵向轴线纵向延伸的长条材料。 平面化机和细长的网可以同时平坦化和完成两个或多个基底。

公开(公告)号：US5747386A

公开(公告)日：1998-05-05

申请号：US724905

申请日：1996-10-03

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： H01L21/00

CPC分类号： H01L21/67092

摘要： A rotary coupling for use in an apparatus for chemical mechanical planarization of material substrates. The coupling has a housing defining a chamber therein. A housing passage is formed through the housing and communicates with the chamber and a fluid source. A rotary shaft is connected at one end to the apparatus and has at an opposite end a coupling end extending into the chamber. A shaft passage is formed longitudinally through the shaft which opens into the coupling end and communicates with the apparatus at its other end. A coupling interface is defined within the chamber of the housing for abutting against the shaft coupling end. The coupling end and coupling interface are biased against one another. The shaft passage and housing passage in combination define a portion of a continuous fluid process line between the apparatus and the fluid source.

公开(公告)号：US5261776A

公开(公告)日：1993-11-16

申请号：US343678

申请日：1989-04-27

申请人： Ross H. Burck ,  Ernest E. Marks ,  Scott E. Moore

发明人： Ross H. Burck ,  Ernest E. Marks ,  Scott E. Moore

IPC分类号： B65G49/07 ,  H01L21/677 ,  B65G65/00

CPC分类号： H01L21/67781

摘要： The apparatus transfers a quantity of wafers from a first wafer boat to a second wafer boat. A wafer platform positioned beneath a wafer boat rises and transports the wafers to a pair of wafer grips which hold the wafers until the wafer platform is lowered and a second wafer about is in position to receive the wafers. The wafer platform is actuated by the negative pressure applied to alternating sides of a stage which divides a sealed cabinet into two portions. A vacuum is applied to alternating sides of the stage, while ambient air is introduced into the other side, causing the stage to move in the direction of lower pressure. The platform is affixed to the stage on at least two points.

摘要翻译： 该装置将一批晶片从第一晶片舟转移到第二晶片舟皿。 位于晶片舟皿下方的晶片平台上升并将晶片传送到一对晶片夹持件，其夹持晶片直到晶片平台下降，并且第二晶片位于接收晶片的位置。 晶片平台通过施加到将密封的机柜分成两部分的阶段的交替侧的负压致动。 真空被施加到舞台的交替侧面，而环境空气被引入另一侧，使得舞台沿较低压力的方向移动。 该平台至少在两点上贴在舞台上。

公开(公告)号：US09134164B2

公开(公告)日：2015-09-15

申请号：US13185395

申请日：2011-07-18

申请人： Scott E. Moore ,  Brett Olin

发明人： Scott E. Moore ,  Brett Olin

IPC分类号： G01B5/02 ,  G01B7/02 ,  G01B11/02 ,  G01B13/02 ,  G01B21/02 ,  G01F23/292 ,  F42B33/02 ,  G01F25/00

CPC分类号： G01B11/254 ,  F42B33/0285 ,  G01B11/002 ,  G01B11/14 ,  G01F23/292 ,  G01F25/0061 ,  G06T7/60

摘要： A non-contacting deviation measurement system projects a first line and a second line upon a surface of an object. The projections of the first line and second line are arranged to overlap at an intersection line oriented at a nominal location such that when the surface is oriented at the nominal location, the intersection line appears on the surface. As the location of the surface deviates from the nominal location, the first line and second line as projected upon the surface move away from one another. The distance between the lines may be used to calculate the deviation from the nominal location. The deviation calculated may be compared to a predetermined maximum allowable deviation.

摘要翻译： 非接触偏差测量系统在物体表面上投射第一条线和第二条线。 第一线和第二线的突起被布置成在以标称位置定向的交叉线处重叠，使得当表面定向在标称位置时，交叉线出现在表面上。 当表面的位置偏离标称位置时，投影在表面上的第一条线和第二条线彼此远离。 线之间的距离可用于计算与标称位置的偏差。 计算的偏差可以与预定的最大允许偏差进行比较。

公开(公告)号：US08048287B2

公开(公告)日：2011-11-01

申请号：US12580941

申请日：2009-10-16

申请人： Whonchee Lee ,  Scott E. Moore ,  Scott G. Meikle

发明人： Whonchee Lee ,  Scott E. Moore ,  Scott G. Meikle

IPC分类号： C25F3/16

CPC分类号： B24B37/12 ,  B23H3/00 ,  B23H3/02 ,  B23H5/08 ,  B24B37/046 ,  B24B37/30 ,  C25F3/14 ,  C25F7/00

摘要： Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.

摘要翻译： 用于从微电子衬底选择性去除导电材料的方法和装置。 根据本发明的实施例的方法包括将微电子基板定位在靠近并与电极对间隔开的位置，电极对包括第一电极和与第一电极间隔开的第二电极。 电解液可以通过第一流动通道引导到微电子衬底和电极对之间的界面区域。 可以将变化的电信号通过电极对和电解液体以从微电子衬底去除导电材料。 可以通过靠近第一流动通道和电极对的第二流动通道去除电解液体。